JPH0388350U - - Google Patents
Info
- Publication number
- JPH0388350U JPH0388350U JP1989150344U JP15034489U JPH0388350U JP H0388350 U JPH0388350 U JP H0388350U JP 1989150344 U JP1989150344 U JP 1989150344U JP 15034489 U JP15034489 U JP 15034489U JP H0388350 U JPH0388350 U JP H0388350U
- Authority
- JP
- Japan
- Prior art keywords
- tab tape
- semiconductor chip
- semiconductor device
- bonded
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989150344U JPH0388350U (de) | 1989-12-26 | 1989-12-26 | |
| KR2019900019502U KR930003872Y1 (ko) | 1989-12-26 | 1990-12-11 | 반도체 장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989150344U JPH0388350U (de) | 1989-12-26 | 1989-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0388350U true JPH0388350U (de) | 1991-09-10 |
Family
ID=15494942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989150344U Pending JPH0388350U (de) | 1989-12-26 | 1989-12-26 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH0388350U (de) |
| KR (1) | KR930003872Y1 (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101301782B1 (ko) * | 2011-03-30 | 2013-08-29 | 앰코 테크놀로지 코리아 주식회사 | 반도체 패키지 및 그 제조 방법 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5243364A (en) * | 1975-10-01 | 1977-04-05 | Hitachi Ltd | Power semiconductor device and process for production of same |
| JPH01304738A (ja) * | 1988-06-01 | 1989-12-08 | Mitsubishi Electric Corp | 半導体装置のパッケージ構造 |
-
1989
- 1989-12-26 JP JP1989150344U patent/JPH0388350U/ja active Pending
-
1990
- 1990-12-11 KR KR2019900019502U patent/KR930003872Y1/ko not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5243364A (en) * | 1975-10-01 | 1977-04-05 | Hitachi Ltd | Power semiconductor device and process for production of same |
| JPH01304738A (ja) * | 1988-06-01 | 1989-12-08 | Mitsubishi Electric Corp | 半導体装置のパッケージ構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR930003872Y1 (ko) | 1993-06-23 |
| KR910013038U (ko) | 1991-07-30 |