JPH0338633U - - Google Patents
Info
- Publication number
- JPH0338633U JPH0338633U JP1989098578U JP9857889U JPH0338633U JP H0338633 U JPH0338633 U JP H0338633U JP 1989098578 U JP1989098578 U JP 1989098578U JP 9857889 U JP9857889 U JP 9857889U JP H0338633 U JPH0338633 U JP H0338633U
- Authority
- JP
- Japan
- Prior art keywords
- bare chip
- semiconductor bare
- semiconductor
- glass dam
- outer periphery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989098578U JPH0338633U (de) | 1989-08-24 | 1989-08-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989098578U JPH0338633U (de) | 1989-08-24 | 1989-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0338633U true JPH0338633U (de) | 1991-04-15 |
Family
ID=31647665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989098578U Pending JPH0338633U (de) | 1989-08-24 | 1989-08-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0338633U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110347238A (zh) * | 2018-04-03 | 2019-10-18 | 富士通电子零件有限公司 | 输入设备 |
-
1989
- 1989-08-24 JP JP1989098578U patent/JPH0338633U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110347238A (zh) * | 2018-04-03 | 2019-10-18 | 富士通电子零件有限公司 | 输入设备 |