JPH031437U - - Google Patents
Info
- Publication number
- JPH031437U JPH031437U JP5881589U JP5881589U JPH031437U JP H031437 U JPH031437 U JP H031437U JP 5881589 U JP5881589 U JP 5881589U JP 5881589 U JP5881589 U JP 5881589U JP H031437 U JPH031437 U JP H031437U
- Authority
- JP
- Japan
- Prior art keywords
- tape carrier
- lead pattern
- soldering lead
- semiconductor
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5881589U JPH031437U (de) | 1989-05-22 | 1989-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5881589U JPH031437U (de) | 1989-05-22 | 1989-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH031437U true JPH031437U (de) | 1991-01-09 |
Family
ID=31584768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5881589U Pending JPH031437U (de) | 1989-05-22 | 1989-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH031437U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56160423U (de) * | 1980-04-30 | 1981-11-30 |
-
1989
- 1989-05-22 JP JP5881589U patent/JPH031437U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56160423U (de) * | 1980-04-30 | 1981-11-30 |