JPH045280B2 - - Google Patents
Info
- Publication number
- JPH045280B2 JPH045280B2 JP59031645A JP3164584A JPH045280B2 JP H045280 B2 JPH045280 B2 JP H045280B2 JP 59031645 A JP59031645 A JP 59031645A JP 3164584 A JP3164584 A JP 3164584A JP H045280 B2 JPH045280 B2 JP H045280B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive circuit
- layer
- layer conductive
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 229910052799 carbon Inorganic materials 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 238000003780 insertion Methods 0.000 description 8
- 230000037431 insertion Effects 0.000 description 8
- 238000005476 soldering Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3164584A JPS60180186A (ja) | 1984-02-22 | 1984-02-22 | プリント基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3164584A JPS60180186A (ja) | 1984-02-22 | 1984-02-22 | プリント基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60180186A JPS60180186A (ja) | 1985-09-13 |
| JPH045280B2 true JPH045280B2 (fr) | 1992-01-30 |
Family
ID=12336927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3164584A Granted JPS60180186A (ja) | 1984-02-22 | 1984-02-22 | プリント基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60180186A (fr) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0347341Y2 (fr) * | 1985-12-18 | 1991-10-08 | ||
| JPS62211994A (ja) * | 1986-03-13 | 1987-09-17 | 三井金属鉱業株式会社 | 多層回路基板およびその製造法 |
| JP2635847B2 (ja) * | 1991-04-26 | 1997-07-30 | 古河電気工業株式会社 | 大電流回路基板 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4889353A (fr) * | 1972-02-29 | 1973-11-22 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49121063U (fr) * | 1973-02-12 | 1974-10-17 |
-
1984
- 1984-02-22 JP JP3164584A patent/JPS60180186A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4889353A (fr) * | 1972-02-29 | 1973-11-22 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60180186A (ja) | 1985-09-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |