JPH0452693B2 - - Google Patents
Info
- Publication number
- JPH0452693B2 JPH0452693B2 JP61146845A JP14684586A JPH0452693B2 JP H0452693 B2 JPH0452693 B2 JP H0452693B2 JP 61146845 A JP61146845 A JP 61146845A JP 14684586 A JP14684586 A JP 14684586A JP H0452693 B2 JPH0452693 B2 JP H0452693B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- wiring board
- mold
- assembly
- board assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 35
- 239000011347 resin Substances 0.000 claims description 35
- 239000004020 conductor Substances 0.000 claims description 15
- 230000001681 protective effect Effects 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 5
- 238000009413 insulation Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000006757 chemical reactions by type Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Connection Or Junction Boxes (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61146845A JPS637125A (ja) | 1986-06-25 | 1986-06-25 | 配線接続箱の組立方法 |
| US07/059,639 US4781600A (en) | 1986-06-25 | 1987-06-08 | Junction box and a process of assembling the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61146845A JPS637125A (ja) | 1986-06-25 | 1986-06-25 | 配線接続箱の組立方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS637125A JPS637125A (ja) | 1988-01-13 |
| JPH0452693B2 true JPH0452693B2 (fr) | 1992-08-24 |
Family
ID=15416833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61146845A Granted JPS637125A (ja) | 1986-06-25 | 1986-06-25 | 配線接続箱の組立方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS637125A (fr) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63182625U (fr) * | 1987-05-14 | 1988-11-24 | ||
| JP2014116228A (ja) * | 2012-12-11 | 2014-06-26 | Nippon Telegr & Teleph Corp <Ntt> | パルストランスの放電防止用のコネクタモジュール |
-
1986
- 1986-06-25 JP JP61146845A patent/JPS637125A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS637125A (ja) | 1988-01-13 |
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