JPH0451991B2 - - Google Patents

Info

Publication number
JPH0451991B2
JPH0451991B2 JP57076857A JP7685782A JPH0451991B2 JP H0451991 B2 JPH0451991 B2 JP H0451991B2 JP 57076857 A JP57076857 A JP 57076857A JP 7685782 A JP7685782 A JP 7685782A JP H0451991 B2 JPH0451991 B2 JP H0451991B2
Authority
JP
Japan
Prior art keywords
light emitting
emitting device
electrode
insulating frame
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57076857A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58194382A (ja
Inventor
Juji Kawasaki
Takeshi Haneda
Tsugio Kawamichi
Hitoshi Haga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP57076857A priority Critical patent/JPS58194382A/ja
Publication of JPS58194382A publication Critical patent/JPS58194382A/ja
Publication of JPH0451991B2 publication Critical patent/JPH0451991B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Led Device Packages (AREA)
JP57076857A 1982-05-08 1982-05-08 発光装置用電極構体 Granted JPS58194382A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57076857A JPS58194382A (ja) 1982-05-08 1982-05-08 発光装置用電極構体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57076857A JPS58194382A (ja) 1982-05-08 1982-05-08 発光装置用電極構体

Publications (2)

Publication Number Publication Date
JPS58194382A JPS58194382A (ja) 1983-11-12
JPH0451991B2 true JPH0451991B2 (enrdf_load_html_response) 1992-08-20

Family

ID=13617318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57076857A Granted JPS58194382A (ja) 1982-05-08 1982-05-08 発光装置用電極構体

Country Status (1)

Country Link
JP (1) JPS58194382A (enrdf_load_html_response)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3777785D1 (de) * 1986-12-26 1992-04-30 Idec Izumi Corp Traegerband fuer elektronische bauteile und herstellungsverfahren.
EP0646971B1 (de) 1993-09-30 1997-03-12 Siemens Aktiengesellschaft Zweipoliges SMT-Miniatur-Gehäuse für Halbleiterbauelemente und Verfahren zu dessen Herstellung
JP2001518692A (ja) 1997-07-29 2001-10-16 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー オッフェネ ハンデルスゲゼルシャフト 光電素子
EP2416368B1 (en) * 2009-03-30 2018-10-24 AutoNetworks Technologies, Ltd. Optical communication module and manufacturing method therefor
EP2416372B1 (en) * 2009-03-30 2017-04-19 AutoNetworks Technologies, Ltd. Optical communication module and method for manufacturing optical communication module

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50104565U (enrdf_load_html_response) * 1974-02-01 1975-08-28
US3914786A (en) * 1974-04-19 1975-10-21 Hewlett Packard Co In-line reflective lead-pair for light-emitting diodes
JPS5338973A (en) * 1976-09-22 1978-04-10 Hitachi Ltd Lead frame
JPS5947462B2 (ja) * 1977-01-13 1984-11-19 日本電気株式会社 半導体装置用リ−ド構成
JPS53108880U (enrdf_load_html_response) * 1977-02-08 1978-08-31
JPS5824453Y2 (ja) * 1978-05-11 1983-05-25 三洋電機株式会社 発光ダイオ−ド基板
JPS55105388A (en) * 1979-02-07 1980-08-12 Toshiba Corp Manufacture of light emission display device
JPS5776856A (en) * 1980-10-30 1982-05-14 Toshiba Corp Manufacture of semiconductor device
JPS582079A (ja) * 1981-06-29 1983-01-07 Nippon Denyo Kk Ｌｅｄランプ及びその製法

Also Published As

Publication number Publication date
JPS58194382A (ja) 1983-11-12

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