JPH0451080B2 - - Google Patents

Info

Publication number
JPH0451080B2
JPH0451080B2 JP61096455A JP9645586A JPH0451080B2 JP H0451080 B2 JPH0451080 B2 JP H0451080B2 JP 61096455 A JP61096455 A JP 61096455A JP 9645586 A JP9645586 A JP 9645586A JP H0451080 B2 JPH0451080 B2 JP H0451080B2
Authority
JP
Japan
Prior art keywords
lamination
hole
drilling
mold
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61096455A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62252194A (ja
Inventor
Hiroyuki Watanabe
Katsumi Kosaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP9645586A priority Critical patent/JPS62252194A/ja
Publication of JPS62252194A publication Critical patent/JPS62252194A/ja
Publication of JPH0451080B2 publication Critical patent/JPH0451080B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP9645586A 1986-04-24 1986-04-24 多層プリント配線板の製造方法 Granted JPS62252194A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9645586A JPS62252194A (ja) 1986-04-24 1986-04-24 多層プリント配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9645586A JPS62252194A (ja) 1986-04-24 1986-04-24 多層プリント配線板の製造方法

Publications (2)

Publication Number Publication Date
JPS62252194A JPS62252194A (ja) 1987-11-02
JPH0451080B2 true JPH0451080B2 (cs) 1992-08-18

Family

ID=14165499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9645586A Granted JPS62252194A (ja) 1986-04-24 1986-04-24 多層プリント配線板の製造方法

Country Status (1)

Country Link
JP (1) JPS62252194A (cs)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5392471A (en) * 1977-01-26 1978-08-14 Tokyo Shibaura Electric Co Method of perforating multilayer printed circuit board
JPS5678199A (en) * 1979-11-30 1981-06-26 Fujitsu Ltd Method of laminating multilayer printed board

Also Published As

Publication number Publication date
JPS62252194A (ja) 1987-11-02

Similar Documents

Publication Publication Date Title
KR100755795B1 (ko) 다층 회로 기판의 제조 방법
JPH0451080B2 (cs)
JPS62214939A (ja) 積層板の製法
JP3277195B2 (ja) 多層プリント配線板およびその製造方法
JP3882739B2 (ja) 内層回路入り金属箔張り積層板の製造法
JP2001036237A (ja) 多層プリント基板の製造方法
JPS62269391A (ja) プリント配線板の製造方法
JPS6125547B2 (cs)
JP5574145B2 (ja) 多層配線板の製造方法及び圧力調整用治具
JP3952863B2 (ja) 内層回路入り金属箔張り積層板の製造法
JP3308975B2 (ja) 多層プリント配線板の製造方法
JP4425523B2 (ja) 積層板の製造法
JP2520706B2 (ja) プリント配線板の製造方法
JP2507238B2 (ja) 多層プリント回路用基板の製造法
JP3985304B2 (ja) プリント配線板の製造方法
JPH06169172A (ja) 多層プリント基板の製造方法
JPH0730210A (ja) リジッドフレックスプリント配線板とその製造方法
KR20160112508A (ko) 본딩 타겟 가이드
JPH01264832A (ja) 積層板の製造方法
JPH0444290A (ja) プリント配線基板の製造方法
JPH033393A (ja) 銅張り積層板の製造方法
JPH06334278A (ja) リジッドフレックスプリント配線板
JPH1131886A (ja) 多層プリント配線板の製造方法
JP2006196567A (ja) 回路形成基板の製造方法
JPS637040B2 (cs)

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term