JPH0451056B2 - - Google Patents
Info
- Publication number
- JPH0451056B2 JPH0451056B2 JP61010977A JP1097786A JPH0451056B2 JP H0451056 B2 JPH0451056 B2 JP H0451056B2 JP 61010977 A JP61010977 A JP 61010977A JP 1097786 A JP1097786 A JP 1097786A JP H0451056 B2 JPH0451056 B2 JP H0451056B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- lead
- film
- substrate
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 238000005476 soldering Methods 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61010977A JPS62171132A (ja) | 1986-01-23 | 1986-01-23 | 半導体チップの実装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61010977A JPS62171132A (ja) | 1986-01-23 | 1986-01-23 | 半導体チップの実装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62171132A JPS62171132A (ja) | 1987-07-28 |
JPH0451056B2 true JPH0451056B2 (ko) | 1992-08-18 |
Family
ID=11765220
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61010977A Granted JPS62171132A (ja) | 1986-01-23 | 1986-01-23 | 半導体チップの実装方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62171132A (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02102553A (ja) * | 1988-10-12 | 1990-04-16 | Nec Corp | 集積回路装置 |
JPH02101538U (ko) * | 1989-01-30 | 1990-08-13 | ||
JPH02252250A (ja) * | 1989-03-27 | 1990-10-11 | Nippon Telegr & Teleph Corp <Ntt> | 半導体チップ端子接続用フィルムおよび半導体チップ端子接続方法 |
JPH0498843A (ja) * | 1990-08-16 | 1992-03-31 | Nec Corp | Lsiの実装方法 |
-
1986
- 1986-01-23 JP JP61010977A patent/JPS62171132A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS62171132A (ja) | 1987-07-28 |
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