JPH04504025A - イオン銃 - Google Patents
イオン銃Info
- Publication number
- JPH04504025A JPH04504025A JP2504251A JP50425190A JPH04504025A JP H04504025 A JPH04504025 A JP H04504025A JP 2504251 A JP2504251 A JP 2504251A JP 50425190 A JP50425190 A JP 50425190A JP H04504025 A JPH04504025 A JP H04504025A
- Authority
- JP
- Japan
- Prior art keywords
- plasma
- chamber
- ion
- grid
- ion gun
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 150000002500 ions Chemical class 0.000 claims description 105
- 238000010884 ion-beam technique Methods 0.000 claims description 61
- 238000002347 injection Methods 0.000 claims description 10
- 239000007924 injection Substances 0.000 claims description 10
- 230000001133 acceleration Effects 0.000 claims description 9
- 238000000605 extraction Methods 0.000 claims description 7
- 239000003989 dielectric material Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 4
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims 3
- 229910052740 iodine Inorganic materials 0.000 claims 3
- 239000011630 iodine Substances 0.000 claims 3
- 239000007789 gas Substances 0.000 description 45
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 229910052786 argon Inorganic materials 0.000 description 10
- 239000000203 mixture Substances 0.000 description 7
- 230000005684 electric field Effects 0.000 description 6
- 239000011261 inert gas Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 230000001939 inductive effect Effects 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000002826 coolant Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000006386 neutralization reaction Methods 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 210000002784 stomach Anatomy 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000005284 excitation Effects 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000003801 milling Methods 0.000 description 3
- 229910052761 rare earth metal Inorganic materials 0.000 description 3
- 150000002910 rare earth metals Chemical class 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 238000000992 sputter etching Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 230000005520 electrodynamics Effects 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005405 multipole Effects 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000012552 review Methods 0.000 description 2
- 229910000938 samarium–cobalt magnet Inorganic materials 0.000 description 2
- ZFXYFBGIUFBOJW-UHFFFAOYSA-N theophylline Chemical compound O=C1N(C)C(=O)N(C)C2=C1NC=N2 ZFXYFBGIUFBOJW-UHFFFAOYSA-N 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 208000002430 Multiple chemical sensitivity Diseases 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000963 austenitic stainless steel Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001793 charged compounds Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000003574 free electron Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical group [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000013598 vector Substances 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J27/00—Ion beam tubes
- H01J27/02—Ion sources; Ion guns
- H01J27/16—Ion sources; Ion guns using high-frequency excitation, e.g. microwave excitation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/08—Ion sources; Ion guns
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
- Electron Sources, Ion Sources (AREA)
- Plasma Technology (AREA)
Abstract
Description
Claims (18)
- 1.第1の端部及び第2の端部を有する排気チヤンバを定める壁手段と、前記排 気チャンバの第1の端部を横切って延びる誘電性部材とよりなるプラズマチャン バと、 このプラズマチャンバヘのプラズマ生成ガスの注入を許容するガス注入口手段と 、 イオン銃の使用時に前記プラズマチャンバ内のガスにおいてプラズマを誘導的に 発生させる、誘電性部材と組み合わされた高周波放射手段と、 正の電圧源へ接続する為に配置された第1のグリッドと、員の電圧源へ接続する 為に配置された第2のグリッドとを含み、これらにより、前記第2のグリッドへ 向かうと共にこれを通過するようにイオンを加速させるための加速場を生成して 、前記プラズマチヤンバ内のプラズマからイオンを抽出する制御グリッド構造物 とよりなることを特徴とする、イオンビーム生成用のイオン銃。
- 2.誘電性部材が平坦、又は最小限の皿状であることを特徴とする、請求項1記 載のイオン銃。
- 3.誘電性部材と組み合わされている高周波放射手段が、前記誘電性部材に隣接 して置かれた、又は前記誘電性部材に埋め込まれた、コイルを含むことを特徴と する、請求項1記載のイオン銃。
- 4.コイルが平坦、又はほぼ平坦であることを特徴とする、請求項3記載のイオ ン銃。
- 5.コイルが渦巻状であることを特徴とする、請求項3又は請求項4記載のイオ ン銃。
- 6.コイルが約1MHzから約40MHzまでの範囲内の周波数において動作す るように配置されていることを特徴とする、請求項3ないし請求項5記載のイオ ン銃。
- 7.壁手段が導電性材料により形成されていることを特徴とする、請求項1ない し請求項6記載のイオン銃。
- 8.壁手段が誘電性材料により形成されていることを特徴とする、請求項1ない し請求項6記載のイオン銃。
- 9.イオン銃の使用時にプラズマチャンバの壁に酸接するイオンを捉える為の一 次磁石手段を更に含むことを特徴とする、請求項1ないし請求項8記載のイオン 銃。
- 10.一次磁石手段が、プラズマチャンバの複数の壁領域の各々を越えてアーチ を形成するように前記プラズマチャンバの壁から曲線状に延びて前記壁へ戻る磁 力線を前記プラズマチャンバ内に生成するように配列された一列の磁石よりなる ことを特徴とする、請求項9記載のイオン銃。
- 11.壁領域が、プラズマチャンバの壁の長手方向に延びていることを特徴とす る、請求項10記載のイオン銃。
- 12.一次磁石手段が、プラズマチャンバの外周面のまわりに延びる少なくとも 1列を含むアレイ内において整列された偶数個の磁石よりなり、前記アレイ内に おける各々の磁石が、それらの磁軸がほぼ水平面内において延びるように配置さ れると共に、前記プラズマチャンバに面する隣接の磁石の極性と正反対の極性の 極を有することを特徴とする、請求項10又は請求項11記載のイオン銃。
- 13.磁石のアレイがプラズマチヤンバの外周面の周りを延びる複数列の磁石よ りなり、その1列中の磁石が、前記プラズマチャンバに対向する他の隣接列にお ける隣後するどの磁石の極性に対しても正反対の極性の極を有する枢を有するこ とを特徴とする、請求項12記載のイオン銃。
- 14.高周波放射手段と組み合わされ前記高周波放射手段を通る磁気双極場を生 成する二次磁石手段を更に含むことを特徴とする、請求項1ないし請求項13記 載のイオン銃。
- 15.真空チャンバと、 この真空チヤンバ内ヘイオンピームを出射ずる、請求項1ないし請求項14記載 のイオン銃と、 イオンビーム内へ電子を出射するイオンビーム中和器と、イオンビームの経路内 のターゲット又は基板の為の支持手段とよりなることを特徴とする、イオンビー ム生成装置。
- 16.イオンビーム中和器の電源が高周波電源により供給されていることを特徴 とする、請求項15記載のイオンビーム生成装置。
- 17.イオンビーム中和器が、誘電性材料よりなる壁を有して端部が開放された プラズマ源チャンバと、このプラズマ源チャンバヘのプラズマ生成ガスの注入を 許容する手段と、前記プラズマ源チャンバを取り囲んでその内部にプラズマを発 生させる高周波生成コイルと、前記プラズマ源チヤンバの開放端部を横切って配 設された、員の電圧源へ接続する為に配置された第1のグリッドと正の電圧源へ 接続する為に配置された第2のグリッドとを含み、これらにより、前記第2のグ リッドへ向かうと共にこれを通過するようにイオンを加速させるための加速場を 生成する、抽出グリッド構造物とよりなることを特徴とする、請求項15または 請求項18記載のイオンビーム生成装置。
- 18.誘電性材料よりなる壁を有して端部が開放されたプラズマ源チャンバと、 このプラズマ源チャンバヘのプラズマ生成ガスの注入を許容する手段と、前記プ ラズマ源チャンバを取り囲んでその内部にプラズマを発生させる高周波生成コイ ルと、プラズマ源チヤンバの開放端部を横切って配設された、負の電圧源へ接続 する為に配置された第1のグリッドと正の電圧源へ接続する為に配置された第2 のグリッドとを含み、これらにより、前記第2のグリッドへ向かうと共にこれを 通過するようにイオンを加速させるための加速場を生成する、抽出グリッド構造 物とよりなることを特徴とする、イオンビーム中和器。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8905073.6 | 1989-03-06 | ||
GB898905073A GB8905073D0 (en) | 1989-03-06 | 1989-03-06 | Ion gun |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04504025A true JPH04504025A (ja) | 1992-07-16 |
JP2648235B2 JP2648235B2 (ja) | 1997-08-27 |
Family
ID=10652817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2504251A Expired - Lifetime JP2648235B2 (ja) | 1989-03-06 | 1990-03-06 | イオン銃 |
Country Status (6)
Country | Link |
---|---|
US (1) | US5198718A (ja) |
EP (1) | EP0462165B1 (ja) |
JP (1) | JP2648235B2 (ja) |
DE (1) | DE69019741T2 (ja) |
GB (1) | GB8905073D0 (ja) |
WO (1) | WO1990010945A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002151429A (ja) * | 2000-07-20 | 2002-05-24 | Axcelis Technologies Inc | Rfプラズマ発生装置及びウエハの処理装置 |
KR20150010946A (ko) * | 2012-05-09 | 2015-01-29 | 아르켐 에이비 | 전자 빔을 발생시키기 위한 방법 및 장치 |
Families Citing this family (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5525392A (en) * | 1992-12-10 | 1996-06-11 | International Business Machines Corporation | Magnetic recording medium having a fluorinated polymeric protective layer formed by an ion beam |
US5825035A (en) * | 1993-03-10 | 1998-10-20 | Hitachi, Ltd. | Processing method and apparatus using focused ion beam generating means |
US5874704A (en) | 1995-06-30 | 1999-02-23 | Lam Research Corporation | Low inductance large area coil for an inductively coupled plasma source |
US5731565A (en) | 1995-07-27 | 1998-03-24 | Lam Research Corporation | Segmented coil for generating plasma in plasma processing equipment |
US5824605A (en) * | 1995-07-31 | 1998-10-20 | Lam Research Corporation | Gas dispersion window for plasma apparatus and method of use thereof |
US6048798A (en) * | 1996-06-05 | 2000-04-11 | Lam Research Corporation | Apparatus for reducing process drift in inductive coupled plasma etching such as oxide layer |
US5863376A (en) * | 1996-06-05 | 1999-01-26 | Lam Research Corporation | Temperature controlling method and apparatus for a plasma processing chamber |
US5800619A (en) * | 1996-06-10 | 1998-09-01 | Lam Research Corporation | Vacuum plasma processor having coil with minimum magnetic field in its center |
US5759280A (en) * | 1996-06-10 | 1998-06-02 | Lam Research Corporation | Inductively coupled source for deriving substantially uniform plasma flux |
US5993594A (en) | 1996-09-30 | 1999-11-30 | Lam Research Corporation | Particle controlling method and apparatus for a plasma processing chamber |
GB9622127D0 (en) | 1996-10-24 | 1996-12-18 | Nordiko Ltd | Ion gun |
US5969470A (en) * | 1996-11-08 | 1999-10-19 | Veeco Instruments, Inc. | Charged particle source |
US6033585A (en) * | 1996-12-20 | 2000-03-07 | Lam Research Corporation | Method and apparatus for preventing lightup of gas distribution holes |
US6035868A (en) * | 1997-03-31 | 2000-03-14 | Lam Research Corporation | Method and apparatus for control of deposit build-up on an inner surface of a plasma processing chamber |
US6030666A (en) * | 1997-03-31 | 2000-02-29 | Lam Research Corporation | Method for microwave plasma substrate heating |
US6090456A (en) * | 1997-05-03 | 2000-07-18 | The United States Of America As Represented By The Secretary Of The Air Force | Process for large area deposition of diamond-like carbon films |
US6815633B1 (en) | 1997-06-26 | 2004-11-09 | Applied Science & Technology, Inc. | Inductively-coupled toroidal plasma source |
US8779322B2 (en) | 1997-06-26 | 2014-07-15 | Mks Instruments Inc. | Method and apparatus for processing metal bearing gases |
US6150628A (en) * | 1997-06-26 | 2000-11-21 | Applied Science And Technology, Inc. | Toroidal low-field reactive gas source |
US7569790B2 (en) * | 1997-06-26 | 2009-08-04 | Mks Instruments, Inc. | Method and apparatus for processing metal bearing gases |
US6388226B1 (en) | 1997-06-26 | 2002-05-14 | Applied Science And Technology, Inc. | Toroidal low-field reactive gas source |
US7166816B1 (en) * | 1997-06-26 | 2007-01-23 | Mks Instruments, Inc. | Inductively-coupled torodial plasma source |
US6083363A (en) * | 1997-07-02 | 2000-07-04 | Tokyo Electron Limited | Apparatus and method for uniform, low-damage anisotropic plasma processing |
DE29718954U1 (de) | 1997-10-24 | 1998-01-08 | Bader, Jürgen, 89537 Giengen | Vorrichtung zur Überdruckbelüftung |
EP1068632B1 (en) * | 1998-03-31 | 2006-11-15 | Lam Research Corporation | Contamination controlling method and plasma processing chamber |
US6464843B1 (en) | 1998-03-31 | 2002-10-15 | Lam Research Corporation | Contamination controlling method and apparatus for a plasma processing chamber |
US6545580B2 (en) | 1998-09-09 | 2003-04-08 | Veeco Instruments, Inc. | Electromagnetic field generator and method of operation |
US6464891B1 (en) * | 1999-03-17 | 2002-10-15 | Veeco Instruments, Inc. | Method for repetitive ion beam processing with a carbon containing ion beam |
US6238582B1 (en) | 1999-03-30 | 2001-05-29 | Veeco Instruments, Inc. | Reactive ion beam etching method and a thin film head fabricated using the method |
US6514378B1 (en) | 2000-03-31 | 2003-02-04 | Lam Research Corporation | Method for improving uniformity and reducing etch rate variation of etching polysilicon |
US6418874B1 (en) | 2000-05-25 | 2002-07-16 | Applied Materials, Inc. | Toroidal plasma source for plasma processing |
US6461974B1 (en) | 2000-10-06 | 2002-10-08 | Lam Research Corporation | High temperature tungsten etching process |
DE10058326C1 (de) * | 2000-11-24 | 2002-06-13 | Astrium Gmbh | Induktiv gekoppelte Hochfrequenz-Elektronenquelle mit reduziertem Leistungsbedarf durch elektrostatischen Einschluss von Elektronen |
US6805952B2 (en) * | 2000-12-29 | 2004-10-19 | Lam Research Corporation | Low contamination plasma chamber components and methods for making the same |
US6634313B2 (en) | 2001-02-13 | 2003-10-21 | Applied Materials, Inc. | High-frequency electrostatically shielded toroidal plasma and radical source |
US6755150B2 (en) | 2001-04-20 | 2004-06-29 | Applied Materials Inc. | Multi-core transformer plasma source |
GB0113368D0 (en) * | 2001-06-01 | 2001-07-25 | Nordiko Ltd | Apparatus |
US6759807B2 (en) | 2002-04-04 | 2004-07-06 | Veeco Instruments, Inc. | Multi-grid ion beam source for generating a highly collimated ion beam |
DE10215660B4 (de) * | 2002-04-09 | 2008-01-17 | Eads Space Transportation Gmbh | Hochfrequenz-Elektronenquelle, insbesondere Neutralisator |
US7183716B2 (en) * | 2003-02-04 | 2007-02-27 | Veeco Instruments, Inc. | Charged particle source and operation thereof |
CN101457338B (zh) * | 2003-02-14 | 2011-04-27 | 应用材料股份有限公司 | 利用含氢自由基清洁自生氧化物的方法和设备 |
DE10317027A1 (de) * | 2003-04-11 | 2004-11-11 | Leybold Optics Gmbh | Hochfrequenz-Plasmastrahlquelle und Verfahren zum Bestrahlen einer Oberfläche |
JP4052191B2 (ja) * | 2003-06-24 | 2008-02-27 | 株式会社島津製作所 | 複合成膜装置およびこれを用いた磁気ヘッドの保護膜形成方法 |
DE102004011118B4 (de) * | 2004-03-08 | 2009-09-24 | Leybold Optics Gmbh | Extraktionselektrode mit Lochblendenmuster für eine Plasmastrahlquelle |
US20060042752A1 (en) * | 2004-08-30 | 2006-03-02 | Rueger Neal R | Plasma processing apparatuses and methods |
JP2006079924A (ja) * | 2004-09-09 | 2006-03-23 | Tdk Corp | イオンビーム照射装置及び当該装置用絶縁スペーサ |
US7498592B2 (en) * | 2006-06-28 | 2009-03-03 | Wisconsin Alumni Research Foundation | Non-ambipolar radio-frequency plasma electron source and systems and methods for generating electron beams |
JP5444006B2 (ja) * | 2007-03-02 | 2014-03-19 | ノルディコ テクニカル サーヴィシズ リミテッド | 装置 |
JP4881908B2 (ja) * | 2007-06-19 | 2012-02-22 | 昭和電工株式会社 | 磁気記録媒体の製造方法及び磁気記録再生装置 |
JP4925132B2 (ja) * | 2007-09-13 | 2012-04-25 | 公立大学法人首都大学東京 | 荷電粒子放出装置およびイオンエンジン |
JP2010020844A (ja) * | 2008-07-10 | 2010-01-28 | Showa Denko Kk | 磁気記録媒体の製造方法、磁気記録再生装置、及び磁気記録媒体 |
US20100270262A1 (en) * | 2009-04-22 | 2010-10-28 | Applied Materials, Inc. | Etching low-k dielectric or removing resist with a filtered ionized gas |
WO2011011278A1 (en) * | 2009-07-20 | 2011-01-27 | Advanced Electron Beams, Inc. | Emitter exit window |
US8698401B2 (en) * | 2010-01-05 | 2014-04-15 | Kaufman & Robinson, Inc. | Mitigation of plasma-inductor termination |
US8729806B2 (en) * | 2010-02-02 | 2014-05-20 | The Regents Of The University Of California | RF-driven ion source with a back-streaming electron dump |
US20140097752A1 (en) * | 2012-10-09 | 2014-04-10 | Varian Semiconductor Equipment Associates, Inc. | Inductively Coupled Plasma ION Source Chamber with Dopant Material Shield |
CN106014899B (zh) * | 2016-05-10 | 2017-05-10 | 中国人民解放军国防科学技术大学 | 螺旋波等离子体感应式推力器 |
WO2019118121A1 (en) * | 2017-12-15 | 2019-06-20 | Entegris, Inc. | Methods and assemblies using flourine containing and inert gasses for plasma flood gun (pfg) operation |
ES2696227B2 (es) * | 2018-07-10 | 2019-06-12 | Centro De Investig Energeticas Medioambientales Y Tecnologicas Ciemat | Fuente de iones interna para ciclotrones de baja erosion |
KR102019009B1 (ko) | 2019-02-26 | 2019-09-05 | 권순영 | 플라즈마 소스 |
CN114381702B (zh) * | 2021-12-31 | 2023-01-06 | 北京航空航天大学 | 一种新型高能离子束流产生方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61138432A (ja) * | 1984-12-11 | 1986-06-25 | Hitachi Ltd | 高周波プラズマ発生装置 |
JPS61273840A (ja) * | 1985-05-28 | 1986-12-04 | Rikagaku Kenkyusho | 電子ビ−ム励起イオン照射装置 |
JPS6263139A (ja) * | 1985-09-17 | 1987-03-19 | ▲乗▼田 操 | 羽根型ロ−タリ−エンジン |
JPS6388740A (ja) * | 1986-09-30 | 1988-04-19 | Shimadzu Corp | イオン銃 |
JPS6396840A (ja) * | 1986-10-13 | 1988-04-27 | Hitachi Ltd | イオン源 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU1138853A1 (ru) * | 1982-02-03 | 1985-02-07 | Институт физики твердого тела АН СССР | Высокочастотный источник ионов |
US4507588A (en) * | 1983-02-28 | 1985-03-26 | Board Of Trustees Operating Michigan State University | Ion generating apparatus and method for the use thereof |
EP0169744A3 (en) * | 1984-07-26 | 1987-06-10 | United Kingdom Atomic Energy Authority | Ion source |
FR2581244B1 (fr) * | 1985-04-29 | 1987-07-10 | Centre Nat Rech Scient | Source d'ions du type triode a une seule chambre d'ionisation a excitation haute frequence et a confinement magnetique du type multipolaire |
GB8522976D0 (en) * | 1985-09-17 | 1985-10-23 | Atomic Energy Authority Uk | Ion sources |
JPS6276137A (ja) * | 1985-09-30 | 1987-04-08 | Hitachi Ltd | イオン源 |
JPH0711072B2 (ja) * | 1986-04-04 | 1995-02-08 | 株式会社日立製作所 | イオン源装置 |
US4767931A (en) * | 1986-12-17 | 1988-08-30 | Hitachi, Ltd. | Ion beam apparatus |
-
1989
- 1989-03-06 GB GB898905073A patent/GB8905073D0/en active Pending
-
1990
- 1990-03-06 EP EP90904389A patent/EP0462165B1/en not_active Expired - Lifetime
- 1990-03-06 DE DE69019741T patent/DE69019741T2/de not_active Expired - Lifetime
- 1990-03-06 JP JP2504251A patent/JP2648235B2/ja not_active Expired - Lifetime
- 1990-03-06 US US07/602,254 patent/US5198718A/en not_active Expired - Lifetime
- 1990-03-06 WO PCT/GB1990/000340 patent/WO1990010945A1/en active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61138432A (ja) * | 1984-12-11 | 1986-06-25 | Hitachi Ltd | 高周波プラズマ発生装置 |
JPS61273840A (ja) * | 1985-05-28 | 1986-12-04 | Rikagaku Kenkyusho | 電子ビ−ム励起イオン照射装置 |
JPS6263139A (ja) * | 1985-09-17 | 1987-03-19 | ▲乗▼田 操 | 羽根型ロ−タリ−エンジン |
JPS6388740A (ja) * | 1986-09-30 | 1988-04-19 | Shimadzu Corp | イオン銃 |
JPS6396840A (ja) * | 1986-10-13 | 1988-04-27 | Hitachi Ltd | イオン源 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002151429A (ja) * | 2000-07-20 | 2002-05-24 | Axcelis Technologies Inc | Rfプラズマ発生装置及びウエハの処理装置 |
KR20150010946A (ko) * | 2012-05-09 | 2015-01-29 | 아르켐 에이비 | 전자 빔을 발생시키기 위한 방법 및 장치 |
KR20190130062A (ko) * | 2012-05-09 | 2019-11-20 | 아르켐 에이비 | 전자 빔을 발생시키기 위한 방법 및 장치 |
Also Published As
Publication number | Publication date |
---|---|
DE69019741D1 (de) | 1995-06-29 |
US5198718A (en) | 1993-03-30 |
DE69019741T2 (de) | 1995-09-28 |
EP0462165B1 (en) | 1995-05-24 |
EP0462165A1 (en) | 1991-12-27 |
WO1990010945A1 (en) | 1990-09-20 |
JP2648235B2 (ja) | 1997-08-27 |
GB8905073D0 (en) | 1989-04-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH04504025A (ja) | イオン銃 | |
JP7385621B2 (ja) | イオン-イオンプラズマ原子層エッチングプロセス及びリアクタ | |
EP0934600B1 (en) | Ion gun | |
US7863582B2 (en) | Ion-beam source | |
US7116054B2 (en) | High-efficient ion source with improved magnetic field | |
KR102066312B1 (ko) | 하전 입자 빔을 생성하기 위한 플라즈마 소스 장치 및 방법들 | |
US7381311B2 (en) | Filtered cathodic-arc plasma source | |
EP0428527B1 (en) | Remote ion source plasma electron gun | |
US5022977A (en) | Ion generation apparatus and thin film forming apparatus and ion source utilizing the ion generation apparatus | |
US7176469B2 (en) | Negative ion source with external RF antenna | |
US5457298A (en) | Coldwall hollow-cathode plasma device for support of gas discharges | |
US5032205A (en) | Plasma etching apparatus with surface magnetic fields | |
US6819053B2 (en) | Hall effect ion source at high current density | |
JPH02235332A (ja) | プラズマ処理装置 | |
US4587430A (en) | Ion implantation source and device | |
US4122347A (en) | Ion source | |
US20070034501A1 (en) | Cathode-arc source of metal/carbon plasma with filtration | |
US4937456A (en) | Dielectric coated ion thruster | |
Falabella et al. | Comparison of two filtered cathodic arc sources | |
EP4362058B1 (en) | Hollow cathode arc plasma device | |
WO2013096519A1 (en) | Method and apparatus for surface plasma source (sps) with anode layer plasma accelerator | |
JPH057814B2 (ja) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080509 Year of fee payment: 11 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080509 Year of fee payment: 11 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080509 Year of fee payment: 11 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090509 Year of fee payment: 12 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100509 Year of fee payment: 13 |
|
EXPY | Cancellation because of completion of term |