JPH0447966Y2 - - Google Patents
Info
- Publication number
- JPH0447966Y2 JPH0447966Y2 JP1986164210U JP16421086U JPH0447966Y2 JP H0447966 Y2 JPH0447966 Y2 JP H0447966Y2 JP 1986164210 U JP1986164210 U JP 1986164210U JP 16421086 U JP16421086 U JP 16421086U JP H0447966 Y2 JPH0447966 Y2 JP H0447966Y2
- Authority
- JP
- Japan
- Prior art keywords
- island
- protrusion
- resin
- lead frame
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 28
- 239000011347 resin Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 16
- 238000005452 bending Methods 0.000 description 18
- 238000010586 diagram Methods 0.000 description 6
- 239000008188 pellet Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- ZJPGOXWRFNKIQL-JYJNAYRXSA-N Phe-Pro-Pro Chemical compound C([C@H](N)C(=O)N1[C@@H](CCC1)C(=O)N1[C@@H](CCC1)C(O)=O)C1=CC=CC=C1 ZJPGOXWRFNKIQL-JYJNAYRXSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986164210U JPH0447966Y2 (US06312121-20011106-C00033.png) | 1986-10-28 | 1986-10-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986164210U JPH0447966Y2 (US06312121-20011106-C00033.png) | 1986-10-28 | 1986-10-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6370161U JPS6370161U (US06312121-20011106-C00033.png) | 1988-05-11 |
| JPH0447966Y2 true JPH0447966Y2 (US06312121-20011106-C00033.png) | 1992-11-12 |
Family
ID=31093119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986164210U Expired JPH0447966Y2 (US06312121-20011106-C00033.png) | 1986-10-28 | 1986-10-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0447966Y2 (US06312121-20011106-C00033.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5173654B2 (ja) * | 2007-08-06 | 2013-04-03 | セイコーインスツル株式会社 | 半導体装置 |
| WO2019116457A1 (ja) * | 2017-12-13 | 2019-06-20 | 三菱電機株式会社 | 半導体装置及び電力変換装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53124068A (en) * | 1976-12-27 | 1978-10-30 | Hitachi Ltd | Lead frame |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4967552U (US06312121-20011106-C00033.png) * | 1972-09-28 | 1974-06-12 |
-
1986
- 1986-10-28 JP JP1986164210U patent/JPH0447966Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53124068A (en) * | 1976-12-27 | 1978-10-30 | Hitachi Ltd | Lead frame |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6370161U (US06312121-20011106-C00033.png) | 1988-05-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0447966Y2 (US06312121-20011106-C00033.png) | ||
| JP3403699B2 (ja) | 半導体装置および半導体装置の製造方法 | |
| JPH08316372A (ja) | 樹脂封止型半導体装置 | |
| JP3051376B2 (ja) | リードフレーム及びその製造方法並びにリードフレームを用いた半導体装置 | |
| JP6705741B2 (ja) | 半導体装置 | |
| JP2694879B2 (ja) | 半導体装置 | |
| JPH079961B2 (ja) | 樹脂封止形半導体装置 | |
| JPH03228339A (ja) | ボンディングツール | |
| JP3003653B2 (ja) | ボールグリッドアレイ型半導体装置 | |
| JP2518247Y2 (ja) | リードフレーム | |
| JPH0870087A (ja) | リードフレーム | |
| JPS6242536Y2 (US06312121-20011106-C00033.png) | ||
| JP2604885B2 (ja) | 樹脂封止型半導体装置 | |
| JP2726042B2 (ja) | 半導体装置 | |
| JP2503638B2 (ja) | 半導体装置 | |
| JP2546532B2 (ja) | 樹脂封止型半導体装置 | |
| JPS63232361A (ja) | リ−ドフレ−ム及び半導体装置 | |
| JPH0531246U (ja) | 半導体装置 | |
| JPH0515438U (ja) | 半導体装置 | |
| JPH06163742A (ja) | 半導体装置 | |
| JPH01179348A (ja) | 半導体装置 | |
| JPS58197864A (ja) | 半導体装置 | |
| JP2000114449A (ja) | 半導体装置とそのリードフレーム及びその製造方法 | |
| JPH08139262A (ja) | リードフレームおよびそれを用いた半導体集積回路装置 | |
| JPH1074778A (ja) | 半導体装置 |
