JPH0447905Y2 - - Google Patents
Info
- Publication number
- JPH0447905Y2 JPH0447905Y2 JP1985166729U JP16672985U JPH0447905Y2 JP H0447905 Y2 JPH0447905 Y2 JP H0447905Y2 JP 1985166729 U JP1985166729 U JP 1985166729U JP 16672985 U JP16672985 U JP 16672985U JP H0447905 Y2 JPH0447905 Y2 JP H0447905Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- flexible printed
- wiring pattern
- pressure plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011295 pitch Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985166729U JPH0447905Y2 (US20020051482A1-20020502-M00057.png) | 1985-10-31 | 1985-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985166729U JPH0447905Y2 (US20020051482A1-20020502-M00057.png) | 1985-10-31 | 1985-10-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6276478U JPS6276478U (US20020051482A1-20020502-M00057.png) | 1987-05-16 |
| JPH0447905Y2 true JPH0447905Y2 (US20020051482A1-20020502-M00057.png) | 1992-11-11 |
Family
ID=31097985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985166729U Expired JPH0447905Y2 (US20020051482A1-20020502-M00057.png) | 1985-10-31 | 1985-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0447905Y2 (US20020051482A1-20020502-M00057.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0610583Y2 (ja) * | 1987-06-10 | 1994-03-16 | 松下電器産業株式会社 | メンブレンスイツチ |
| JP2690096B2 (ja) * | 1988-02-09 | 1997-12-10 | キヤノン株式会社 | プリント配線板の接続部の構造 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4811382B1 (US20020051482A1-20020502-M00057.png) * | 1967-05-15 | 1973-04-12 | ||
| JPS5467691A (en) * | 1977-11-09 | 1979-05-31 | Daiichi Denshi Kogyo | Method of connecting conduction portion and conductive pressure sensing adhesives |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5212951Y2 (US20020051482A1-20020502-M00057.png) * | 1971-06-21 | 1977-03-23 |
-
1985
- 1985-10-31 JP JP1985166729U patent/JPH0447905Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4811382B1 (US20020051482A1-20020502-M00057.png) * | 1967-05-15 | 1973-04-12 | ||
| JPS5467691A (en) * | 1977-11-09 | 1979-05-31 | Daiichi Denshi Kogyo | Method of connecting conduction portion and conductive pressure sensing adhesives |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6276478U (US20020051482A1-20020502-M00057.png) | 1987-05-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4583800A (en) | Self-aligning electrical connection assembly | |
| US6778403B2 (en) | Wiring board having terminal | |
| JPH0447905Y2 (US20020051482A1-20020502-M00057.png) | ||
| JPH11288751A (ja) | プリント配線基板への端子の取付構造 | |
| JPH0644125Y2 (ja) | プリント基板の端子接続構造 | |
| JP3456187B2 (ja) | 電気接続箱 | |
| JP3824352B2 (ja) | 電気コネクタ | |
| JPH0746749B2 (ja) | 回路基板圧接装置 | |
| JPH0615424Y2 (ja) | コネクタ実装構造 | |
| JPH0347270Y2 (US20020051482A1-20020502-M00057.png) | ||
| JPS6242548Y2 (US20020051482A1-20020502-M00057.png) | ||
| JPH044386Y2 (US20020051482A1-20020502-M00057.png) | ||
| JPS6188471A (ja) | コネクタ− | |
| JPS5826544Y2 (ja) | フレキシブル印刷配線板 | |
| JPS61145888A (ja) | 印刷配線基板接続装置 | |
| JP2000165035A (ja) | フレキシブルプリント配線板とリジットプリント配線板及びこれらの接続方法 | |
| JPH0316308Y2 (US20020051482A1-20020502-M00057.png) | ||
| JPS5827395A (ja) | 印刷配線基板の接続装置 | |
| JPH06314581A (ja) | Ｆｐｃ用コネクタ | |
| JPH0343727Y2 (US20020051482A1-20020502-M00057.png) | ||
| JPS5844602Y2 (ja) | プリント配線基板 | |
| KR890000597Y1 (ko) | 프린트 기판장치 | |
| JPH0222890A (ja) | フレキシブルプリント配線板及びその接続方法 | |
| JP2001313110A (ja) | 電装品の接続構造 | |
| JP2003257520A (ja) | 押し当て式基板用コネクター |
