JPH0447468B2 - - Google Patents

Info

Publication number
JPH0447468B2
JPH0447468B2 JP61038177A JP3817786A JPH0447468B2 JP H0447468 B2 JPH0447468 B2 JP H0447468B2 JP 61038177 A JP61038177 A JP 61038177A JP 3817786 A JP3817786 A JP 3817786A JP H0447468 B2 JPH0447468 B2 JP H0447468B2
Authority
JP
Japan
Prior art keywords
light emitting
metal substrate
conductive layer
insulating layer
lighting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61038177A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62196878A (ja
Inventor
Masaru Sasaki
Hiroyuki Serizawa
Tsutomu Machida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koito Manufacturing Co Ltd
Original Assignee
Koito Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koito Manufacturing Co Ltd filed Critical Koito Manufacturing Co Ltd
Priority to JP61038177A priority Critical patent/JPS62196878A/ja
Publication of JPS62196878A publication Critical patent/JPS62196878A/ja
Publication of JPH0447468B2 publication Critical patent/JPH0447468B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Securing Globes, Refractors, Reflectors Or The Like (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
JP61038177A 1986-02-25 1986-02-25 照明装置 Granted JPS62196878A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61038177A JPS62196878A (ja) 1986-02-25 1986-02-25 照明装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61038177A JPS62196878A (ja) 1986-02-25 1986-02-25 照明装置

Publications (2)

Publication Number Publication Date
JPS62196878A JPS62196878A (ja) 1987-08-31
JPH0447468B2 true JPH0447468B2 (de) 1992-08-04

Family

ID=12518105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61038177A Granted JPS62196878A (ja) 1986-02-25 1986-02-25 照明装置

Country Status (1)

Country Link
JP (1) JPS62196878A (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH036850U (de) * 1989-06-05 1991-01-23
JP2668140B2 (ja) * 1989-09-30 1997-10-27 三菱電線工業株式会社 発光モジュール
JP2503074Y2 (ja) * 1991-03-14 1996-06-26 株式会社小糸製作所 チップ型発光ダイオ―ドの取付構造
JP2000349348A (ja) * 1999-03-31 2000-12-15 Toyoda Gosei Co Ltd 短波長ｌｅｄランプユニット
DE19918370B4 (de) 1999-04-22 2006-06-08 Osram Opto Semiconductors Gmbh LED-Weißlichtquelle mit Linse
GB2361581A (en) * 2000-04-20 2001-10-24 Lite On Electronics Inc A light emitting diode device
DE10129785B4 (de) 2001-06-20 2010-03-18 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
AUPR598201A0 (en) * 2001-06-28 2001-07-19 Showers International Pty Ltd Light assembly for solid state light devices
JP2004265986A (ja) 2003-02-28 2004-09-24 Citizen Electronics Co Ltd 高輝度発光素子及びそれを用いた発光装置及び高輝度発光素子の製造方法
US7095053B2 (en) * 2003-05-05 2006-08-22 Lamina Ceramics, Inc. Light emitting diodes packaged for high temperature operation
JP2006019598A (ja) * 2004-07-05 2006-01-19 Citizen Electronics Co Ltd 発光ダイオード
JP4706206B2 (ja) 2004-08-18 2011-06-22 ソニー株式会社 放熱装置及び表示装置
US7303315B2 (en) * 2004-11-05 2007-12-04 3M Innovative Properties Company Illumination assembly using circuitized strips
FR2878401B1 (fr) * 2004-11-22 2007-01-19 Valeo Vision Sa Procede de fabrication de support de diodes electroluminescentes interconnectees dans un environnement tridimensionnel
FR2885990B1 (fr) * 2005-05-23 2007-07-13 Valeo Vision Sa Dispositif d'eclairage et/ou de signalisation a diodes electroluminescentes pour vehicule automobile.
KR100616695B1 (ko) * 2005-10-04 2006-08-28 삼성전기주식회사 고출력 발광 다이오드 패키지
JP4551336B2 (ja) * 2006-01-27 2010-09-29 小島プレス工業株式会社 車両用マップライト
KR100789951B1 (ko) * 2006-06-09 2008-01-03 엘지전자 주식회사 발광 유닛 제작 장치 및 방법
TW200824142A (en) * 2006-11-22 2008-06-01 Lighthouse Technology Co Ltd High power diode holder and thereof package is described
JP4990740B2 (ja) * 2007-11-13 2012-08-01 株式会社フジクラ 半導体素子実装用サブマウント及び光送受信モジュール
JP2010010298A (ja) * 2008-06-25 2010-01-14 Mitsui Mining & Smelting Co Ltd フレキシブルプリント配線基材及び半導体装置
JP5545848B2 (ja) * 2010-06-24 2014-07-09 シチズン電子株式会社 半導体発光装置
TWI414050B (zh) * 2010-10-19 2013-11-01 Unistars 封裝板與其製造方法
US8888331B2 (en) * 2011-05-09 2014-11-18 Microsoft Corporation Low inductance light source module
JP2016195177A (ja) * 2015-03-31 2016-11-17 Ｈｏｙａ Ｃａｎｄｅｏ Ｏｐｔｒｏｎｉｃｓ株式会社 光照射モジュール
JP2015149515A (ja) * 2015-05-28 2015-08-20 シャープ株式会社 発光装置および照明機器

Also Published As

Publication number Publication date
JPS62196878A (ja) 1987-08-31

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