JPH0446475B2 - - Google Patents

Info

Publication number
JPH0446475B2
JPH0446475B2 JP17041085A JP17041085A JPH0446475B2 JP H0446475 B2 JPH0446475 B2 JP H0446475B2 JP 17041085 A JP17041085 A JP 17041085A JP 17041085 A JP17041085 A JP 17041085A JP H0446475 B2 JPH0446475 B2 JP H0446475B2
Authority
JP
Japan
Prior art keywords
workpiece
heating block
die
semiconductor laser
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP17041085A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6230394A (ja
Inventor
Masashi Nishizaki
Mamoru Okanishi
Hisaaki Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP17041085A priority Critical patent/JPS6230394A/ja
Publication of JPS6230394A publication Critical patent/JPS6230394A/ja
Publication of JPH0446475B2 publication Critical patent/JPH0446475B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
  • Semiconductor Lasers (AREA)
JP17041085A 1985-07-31 1985-07-31 半導体レ−ザ−組立装置 Granted JPS6230394A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17041085A JPS6230394A (ja) 1985-07-31 1985-07-31 半導体レ−ザ−組立装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17041085A JPS6230394A (ja) 1985-07-31 1985-07-31 半導体レ−ザ−組立装置

Publications (2)

Publication Number Publication Date
JPS6230394A JPS6230394A (ja) 1987-02-09
JPH0446475B2 true JPH0446475B2 (enrdf_load_stackoverflow) 1992-07-30

Family

ID=15904406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17041085A Granted JPS6230394A (ja) 1985-07-31 1985-07-31 半導体レ−ザ−組立装置

Country Status (1)

Country Link
JP (1) JPS6230394A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0737911A (ja) * 1993-07-19 1995-02-07 Mitsubishi Electric Corp 半導体素子のダイボンド装置、及びダイボンド方法
US7968394B2 (en) 2005-12-16 2011-06-28 Freescale Semiconductor, Inc. Transistor with immersed contacts and methods of forming thereof
CN112713497B (zh) * 2019-10-25 2022-06-14 潍坊华光光电子有限公司 一种半导体激光器用模条固定载具

Also Published As

Publication number Publication date
JPS6230394A (ja) 1987-02-09

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Legal Events

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