JPH0445244Y2 - - Google Patents

Info

Publication number
JPH0445244Y2
JPH0445244Y2 JP1985147747U JP14774785U JPH0445244Y2 JP H0445244 Y2 JPH0445244 Y2 JP H0445244Y2 JP 1985147747 U JP1985147747 U JP 1985147747U JP 14774785 U JP14774785 U JP 14774785U JP H0445244 Y2 JPH0445244 Y2 JP H0445244Y2
Authority
JP
Japan
Prior art keywords
adhesive
electrode terminal
semiconductor chip
substrate
metal wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985147747U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6255348U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985147747U priority Critical patent/JPH0445244Y2/ja
Publication of JPS6255348U publication Critical patent/JPS6255348U/ja
Application granted granted Critical
Publication of JPH0445244Y2 publication Critical patent/JPH0445244Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
JP1985147747U 1985-09-27 1985-09-27 Expired JPH0445244Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985147747U JPH0445244Y2 (enExample) 1985-09-27 1985-09-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985147747U JPH0445244Y2 (enExample) 1985-09-27 1985-09-27

Publications (2)

Publication Number Publication Date
JPS6255348U JPS6255348U (enExample) 1987-04-06
JPH0445244Y2 true JPH0445244Y2 (enExample) 1992-10-23

Family

ID=31061393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985147747U Expired JPH0445244Y2 (enExample) 1985-09-27 1985-09-27

Country Status (1)

Country Link
JP (1) JPH0445244Y2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2705658B2 (ja) * 1994-08-31 1998-01-28 日本電気株式会社 電子デバイス組立体およびその製造方法
WO1998046811A1 (fr) * 1997-04-17 1998-10-22 Sekisui Chemical Co., Ltd. Particules conductrices, procede et dispositif de fabrication, structure anisotrope a adhesif et raccordement conducteur, composants de circuit electronique et leur procede de fabrication

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5120941A (ja) * 1974-08-14 1976-02-19 Seikosha Kk Dodenseisetsuchakuzai
JPS5431566A (en) * 1977-08-12 1979-03-08 Nippon Kokuen Kogyo Kk Way of connecting large scale integrated circuit to current carrying circuit portions on insulated substrate

Also Published As

Publication number Publication date
JPS6255348U (enExample) 1987-04-06

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