JPH0444439B2 - - Google Patents

Info

Publication number
JPH0444439B2
JPH0444439B2 JP62237959A JP23795987A JPH0444439B2 JP H0444439 B2 JPH0444439 B2 JP H0444439B2 JP 62237959 A JP62237959 A JP 62237959A JP 23795987 A JP23795987 A JP 23795987A JP H0444439 B2 JPH0444439 B2 JP H0444439B2
Authority
JP
Japan
Prior art keywords
nozzle
paste
thick film
holding member
film circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62237959A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6481294A (en
Inventor
Katsuhiko Taguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Juki Corp
Original Assignee
Juki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Juki Corp filed Critical Juki Corp
Priority to JP62237959A priority Critical patent/JPS6481294A/ja
Priority to US07/246,760 priority patent/US4868007A/en
Priority to DE3832116A priority patent/DE3832116A1/de
Priority to FR888812337A priority patent/FR2620859B1/fr
Priority to CH3529/88A priority patent/CH677427A5/de
Publication of JPS6481294A publication Critical patent/JPS6481294A/ja
Publication of JPH0444439B2 publication Critical patent/JPH0444439B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Electronic Switches (AREA)
  • Coating Apparatus (AREA)
JP62237959A 1987-09-22 1987-09-22 Method and apparatus for forming thick-film circuit Granted JPS6481294A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP62237959A JPS6481294A (en) 1987-09-22 1987-09-22 Method and apparatus for forming thick-film circuit
US07/246,760 US4868007A (en) 1987-09-22 1988-09-20 Method and apparatus for forming a thick film integrated circuit
DE3832116A DE3832116A1 (de) 1987-09-22 1988-09-21 Verfahren und vorrichtung zur steuerung einer maschine fuer die herstellung eines dickfilmschaltkreises
FR888812337A FR2620859B1 (fr) 1987-09-22 1988-09-21 Procede et appareil pour commander une machine d'inscription servant a distribuer une pate pour circuit integre a couche epaisse sur la surface d'un substrat
CH3529/88A CH677427A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-09-22 1988-09-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62237959A JPS6481294A (en) 1987-09-22 1987-09-22 Method and apparatus for forming thick-film circuit

Publications (2)

Publication Number Publication Date
JPS6481294A JPS6481294A (en) 1989-03-27
JPH0444439B2 true JPH0444439B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-07-21

Family

ID=17023000

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62237959A Granted JPS6481294A (en) 1987-09-22 1987-09-22 Method and apparatus for forming thick-film circuit

Country Status (5)

Country Link
US (1) US4868007A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS6481294A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CH (1) CH677427A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3832116A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2620859B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2738017B2 (ja) * 1989-05-23 1998-04-08 ブラザー工業株式会社 三次元成形装置
US5232736A (en) * 1989-07-24 1993-08-03 Motorola, Inc. Method for controlling solder printer
US5082534A (en) * 1990-03-14 1992-01-21 Wayne Technology, Inc. Pyrolytic conversion system
US5225044A (en) * 1990-03-14 1993-07-06 Wayne Technology, Inc. Pyrolytic conversion system
US5258101A (en) * 1990-03-14 1993-11-02 Wayne Technology Corp. Pyrolytic conversion system
US5657144A (en) * 1991-01-10 1997-08-12 Fujitsu Limited Optical processing device operating in a wavelength-synchronized mode and an optical circuit exchanger that uses such an optical processing device
DE4206999C2 (de) * 1992-03-05 1996-02-29 Kleinmichel Klaus Gmbh Auftragsgerät für Medien wie Kleber, Dichtmasse etc.
JP3054900B2 (ja) * 1993-03-10 2000-06-19 セイコーインスツルメンツ株式会社 微細加工装置
US6132809A (en) 1997-01-16 2000-10-17 Precision Valve & Automation, Inc. Conformal coating using multiple applications
EP0901155B1 (de) * 1997-09-05 2004-08-18 ESEC Trading SA Halbleiter-Montageeinrichtung zum Auftragen von Klebstoff auf einem Substrat
EP0913857B1 (de) 1997-10-30 2004-01-28 ESEC Trading SA Verfahren und Einrichtung für die Justierung des Bondkopfs einer Maschine für das Bonden von Halbleiterchips auf ein Trägermaterial
JP3453075B2 (ja) * 1998-11-13 2003-10-06 武蔵エンジニアリング株式会社 ペーストの形成方法
US6692573B1 (en) * 2000-06-01 2004-02-17 Agilent Technologies, Inc. Automated pitch button dispensing station and method
KR100540633B1 (ko) * 2003-06-20 2006-01-11 주식회사 탑 엔지니어링 페이스트 도포기 및 그 제어 방법
SE527838C2 (sv) * 2004-07-02 2006-06-20 Sandvik Intellectual Property En rotationskniv och en rotationsknivanordning försedd med en dylik rotationskniv
FR2997881B1 (fr) * 2012-11-09 2015-04-17 Air Liquide Buse laser a element mobile externe
CN108910434B (zh) * 2018-06-21 2020-01-17 东莞职业技术学院 全自动环形组装流水线

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2264632A (en) * 1939-02-14 1941-12-02 Armstrong Cork Co Adhesive applying device
US4569305A (en) * 1981-10-09 1986-02-11 Ferco S.R.L. Apparatus to provide the application of glue on preselected zones of printed circuit boards
JPS58202074A (ja) * 1981-12-29 1983-11-25 Nordson Kk 熱可塑性樹脂吐出用自動ガン
US4584964A (en) * 1983-12-12 1986-04-29 Engel Harold J Viscous material dispensing machine having programmed positioning
US4572103A (en) * 1984-12-20 1986-02-25 Engel Harold J Solder paste dispenser for SMD circuit boards
US4661368A (en) * 1985-09-18 1987-04-28 Universal Instruments Corporation Surface locating and dispensed dosage sensing method and apparatus

Also Published As

Publication number Publication date
JPS6481294A (en) 1989-03-27
CH677427A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-05-15
FR2620859A1 (fr) 1989-03-24
US4868007A (en) 1989-09-19
FR2620859B1 (fr) 1994-09-02
DE3832116A1 (de) 1989-03-30

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