JPH0444432B2 - - Google Patents
Info
- Publication number
- JPH0444432B2 JPH0444432B2 JP58175463A JP17546383A JPH0444432B2 JP H0444432 B2 JPH0444432 B2 JP H0444432B2 JP 58175463 A JP58175463 A JP 58175463A JP 17546383 A JP17546383 A JP 17546383A JP H0444432 B2 JPH0444432 B2 JP H0444432B2
- Authority
- JP
- Japan
- Prior art keywords
- region
- opening
- forming
- film
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
- H10D64/252—Source or drain electrodes for field-effect devices for vertical or pseudo-vertical devices
- H10D64/2527—Source or drain electrodes for field-effect devices for vertical or pseudo-vertical devices for vertical devices wherein the source or drain electrodes are recessed in semiconductor bodies
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58175463A JPS6066862A (ja) | 1983-09-22 | 1983-09-22 | 縦型mosfetの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58175463A JPS6066862A (ja) | 1983-09-22 | 1983-09-22 | 縦型mosfetの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6066862A JPS6066862A (ja) | 1985-04-17 |
| JPH0444432B2 true JPH0444432B2 (OSRAM) | 1992-07-21 |
Family
ID=15996500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58175463A Granted JPS6066862A (ja) | 1983-09-22 | 1983-09-22 | 縦型mosfetの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6066862A (OSRAM) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4748103A (en) * | 1986-03-21 | 1988-05-31 | Advanced Power Technology | Mask-surrogate semiconductor process employing dopant protective region |
| JPH0783122B2 (ja) * | 1988-12-01 | 1995-09-06 | 富士電機株式会社 | 半導体装置の製造方法 |
| JPH0334376A (ja) * | 1989-06-29 | 1991-02-14 | Nec Corp | 縦型電界効果トランジスタの製造方法 |
| CN112701151B (zh) * | 2019-10-23 | 2022-05-06 | 株洲中车时代电气股份有限公司 | SiC MOSFET器件的制造方法及SiC MOSFET器件 |
-
1983
- 1983-09-22 JP JP58175463A patent/JPS6066862A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6066862A (ja) | 1985-04-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6043126A (en) | Process for manufacture of MOS gated device with self aligned cells | |
| US4925807A (en) | Method of manufacturing a semiconductor device | |
| KR900008207B1 (ko) | 반도체기억장치 | |
| US4517731A (en) | Double polysilicon process for fabricating CMOS integrated circuits | |
| US6800528B2 (en) | Method of fabricating LDMOS semiconductor devices | |
| JPH0444432B2 (OSRAM) | ||
| KR100257074B1 (ko) | 모스팻 및 이의 제조방법 | |
| JPH04287332A (ja) | 半導体素子の製造方法 | |
| KR100537096B1 (ko) | 수직형 트랜지스터의 제조방법 | |
| JP2550691B2 (ja) | 半導体装置の製造方法 | |
| JPH0661482A (ja) | Mos型トランジスタおよびその製造方法 | |
| EP0817247A1 (en) | Process for the fabrication of integrated circuits with contacts self-aligned to active areas | |
| JPH0485968A (ja) | Mos型半導体装置およびその製造方法 | |
| JP3253712B2 (ja) | 半導体装置の製造方法 | |
| JPS6039868A (ja) | 半導体装置の製造方法 | |
| JP2948892B2 (ja) | Mos電界効果トランジスタおよびその製造方法 | |
| KR100487503B1 (ko) | 반도체장치및그의제조방법 | |
| JP3108927B2 (ja) | 半導体装置の製造方法 | |
| KR20040082967A (ko) | 반도체 장치의 제조 방법 | |
| KR20010065907A (ko) | 반도체 소자의 듀얼-폴리실리콘 게이트 형성방법 | |
| JPS60226168A (ja) | 相補型mos半導体装置 | |
| JPH06326316A (ja) | 半導体装置の製造方法 | |
| JPH11224945A (ja) | 半導体装置 | |
| JPH04354328A (ja) | 半導体装置の製造方法 | |
| JPS63307778A (ja) | 半導体装置の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |