JPH0444416B2 - - Google Patents

Info

Publication number
JPH0444416B2
JPH0444416B2 JP58173506A JP17350683A JPH0444416B2 JP H0444416 B2 JPH0444416 B2 JP H0444416B2 JP 58173506 A JP58173506 A JP 58173506A JP 17350683 A JP17350683 A JP 17350683A JP H0444416 B2 JPH0444416 B2 JP H0444416B2
Authority
JP
Japan
Prior art keywords
resin
heat sink
lead frame
auxiliary
resin part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58173506A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6065555A (ja
Inventor
Toshihiro Kato
Yoshimasa Kudo
Mitsugi Myamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP58173506A priority Critical patent/JPS6065555A/ja
Publication of JPS6065555A publication Critical patent/JPS6065555A/ja
Publication of JPH0444416B2 publication Critical patent/JPH0444416B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP58173506A 1983-09-20 1983-09-20 樹脂封止半導体装置の製造方法 Granted JPS6065555A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58173506A JPS6065555A (ja) 1983-09-20 1983-09-20 樹脂封止半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58173506A JPS6065555A (ja) 1983-09-20 1983-09-20 樹脂封止半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6065555A JPS6065555A (ja) 1985-04-15
JPH0444416B2 true JPH0444416B2 (enrdf_load_stackoverflow) 1992-07-21

Family

ID=15961785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58173506A Granted JPS6065555A (ja) 1983-09-20 1983-09-20 樹脂封止半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6065555A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0770658B2 (ja) * 1987-12-17 1995-07-31 三菱電機株式会社 半導体装置の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5613738A (en) * 1979-07-13 1981-02-10 Nec Home Electronics Ltd Manufacture of semiconductor device

Also Published As

Publication number Publication date
JPS6065555A (ja) 1985-04-15

Similar Documents

Publication Publication Date Title
JPH0444416B2 (enrdf_load_stackoverflow)
JP2928120B2 (ja) 樹脂封止型半導体装置用リードフレームおよび樹脂封止型半導体装置の製造方法
JPH0574999A (ja) 半導体装置及びその製造方法
JPH09307046A (ja) 金型及び該金型を用いたタイバ−切断方法
JP2866816B2 (ja) リードフレーム
JPS6084850A (ja) リ−ドフレ−ム
JPS6223094Y2 (enrdf_load_stackoverflow)
JPS5921050A (ja) 半導体装置の製造方法
JPS61156845A (ja) 樹脂封止型半導体装置用リ−ドフレ−ム
JP2532490B2 (ja) 樹脂封止形半導体装置の製造方法
JPS63136636A (ja) 成形金型
JPS5933838A (ja) 半導体樹脂封止用金型装置
JP2997182B2 (ja) 面実装用樹脂封止半導体装置
JPH05335442A (ja) 半導体装置の樹脂モールド方法
JP2543657Y2 (ja) 半導体製造装置
KR970004619Y1 (ko) 반도체 칩
JPH08124950A (ja) 半導体装置の製造方法
JP3007891B1 (ja) 半導体中空パッケ―ジ及びその製造方法
JP4081707B2 (ja) 混成集積回路装置
JPH02117162A (ja) 半導体装置
JPS61215028A (ja) モ−ルド金型およびそれを用いた半導体装置の製造方法
JPH0529519A (ja) 半導体装置とその製造方法
JPS6150379B2 (enrdf_load_stackoverflow)
JPS63157451A (ja) 半導体装置用リ−ドフレ−ム
JPH07111277A (ja) 樹脂封止型半導体装置の製造方法