JPH0442933Y2 - - Google Patents
Info
- Publication number
- JPH0442933Y2 JPH0442933Y2 JP1986066635U JP6663586U JPH0442933Y2 JP H0442933 Y2 JPH0442933 Y2 JP H0442933Y2 JP 1986066635 U JP1986066635 U JP 1986066635U JP 6663586 U JP6663586 U JP 6663586U JP H0442933 Y2 JPH0442933 Y2 JP H0442933Y2
- Authority
- JP
- Japan
- Prior art keywords
- glass sleeve
- electrode
- end surface
- glass
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 69
- 239000008188 pellet Substances 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000007789 sealing Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986066635U JPH0442933Y2 (ko) | 1986-04-30 | 1986-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986066635U JPH0442933Y2 (ko) | 1986-04-30 | 1986-04-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62178541U JPS62178541U (ko) | 1987-11-12 |
| JPH0442933Y2 true JPH0442933Y2 (ko) | 1992-10-12 |
Family
ID=30904824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986066635U Expired JPH0442933Y2 (ko) | 1986-04-30 | 1986-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442933Y2 (ko) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5828859A (ja) * | 1981-08-13 | 1983-02-19 | Matsushita Electronics Corp | リ−ドレスガラス封止ダイオ−ド |
-
1986
- 1986-04-30 JP JP1986066635U patent/JPH0442933Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5828859A (ja) * | 1981-08-13 | 1983-02-19 | Matsushita Electronics Corp | リ−ドレスガラス封止ダイオ−ド |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62178541U (ko) | 1987-11-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3274456A (en) | Rectifier assembly and method of making same | |
| US4483062A (en) | Method for manufacturing solid electrolyte condensers | |
| US20020153608A1 (en) | Land grid array semiconductor device and method of mounting land grid array semiconductor devices | |
| JPH0442933Y2 (ko) | ||
| JPH0442932Y2 (ko) | ||
| JP3520854B2 (ja) | レジスタコネクタ及びその製造方法 | |
| US6258622B1 (en) | Flip clip bonding leadframe-type packaging method for integrated circuit device and a device formed by the packaging method | |
| KR0127308B1 (ko) | 저융점 글라스를 사용하여 구성부품들을 접합하는 방법 | |
| JPH0677631A (ja) | チップ部品のアルミ基板への実装方法 | |
| JP2593524Y2 (ja) | ハイブリッドｉｃ | |
| JPS63287038A (ja) | パッケ−ジ構造 | |
| JP2546178B2 (ja) | リードレスダイオード | |
| JPS6156623B2 (ko) | ||
| JP2000164636A (ja) | 半導体発光素子の実装方法及びこれに用いるボンディングツール | |
| JPS643333B2 (ko) | ||
| JP2551243B2 (ja) | 半導体装置 | |
| JPH02156606A (ja) | リード線の接続構造 | |
| JPH046198Y2 (ko) | ||
| JPH04356935A (ja) | 半導体装置のバンプ電極形成方法 | |
| JPH05291739A (ja) | 接続用端子及びこれを用いた装置の接続方法 | |
| KR930010984B1 (ko) | 반도체의 리이드 본딩방법 | |
| JPS5842764A (ja) | メツキ方法 | |
| JPH01187954A (ja) | 樹脂封止型半導体装置 | |
| JPS5868944A (ja) | 半導体装置 | |
| JPH0382067A (ja) | 樹脂封止型半導体装置 |