JPH0433137B2 - - Google Patents
Info
- Publication number
- JPH0433137B2 JPH0433137B2 JP59182683A JP18268384A JPH0433137B2 JP H0433137 B2 JPH0433137 B2 JP H0433137B2 JP 59182683 A JP59182683 A JP 59182683A JP 18268384 A JP18268384 A JP 18268384A JP H0433137 B2 JPH0433137 B2 JP H0433137B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- heat dissipation
- chips
- wiring board
- dissipation cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000017525 heat dissipation Effects 0.000 claims description 29
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 13
- 229920002379 silicone rubber Polymers 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 239000004945 silicone rubber Substances 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000088 plastic resin Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59182683A JPS6161449A (ja) | 1984-09-03 | 1984-09-03 | マルチチップ集積回路パッケ−ジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59182683A JPS6161449A (ja) | 1984-09-03 | 1984-09-03 | マルチチップ集積回路パッケ−ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6161449A JPS6161449A (ja) | 1986-03-29 |
| JPH0433137B2 true JPH0433137B2 (enrdf_load_stackoverflow) | 1992-06-02 |
Family
ID=16122606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59182683A Granted JPS6161449A (ja) | 1984-09-03 | 1984-09-03 | マルチチップ集積回路パッケ−ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6161449A (enrdf_load_stackoverflow) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5184211A (en) * | 1988-03-01 | 1993-02-02 | Digital Equipment Corporation | Apparatus for packaging and cooling integrated circuit chips |
| JP2923884B2 (ja) | 1997-05-13 | 1999-07-26 | 日本電気株式会社 | 光送受信装置 |
| DE19832710A1 (de) * | 1998-07-14 | 2000-01-27 | Siemens Ag | Elektrooptische Baugruppe |
| JP4672902B2 (ja) * | 2001-05-11 | 2011-04-20 | 株式会社三社電機製作所 | 電力用半導体モジュール |
| JP5846824B2 (ja) * | 2011-09-26 | 2016-01-20 | ダイヤモンド電機株式会社 | 電動パワーステアリングコントロールユニット |
| JP5686127B2 (ja) * | 2012-11-16 | 2015-03-18 | 日立金属株式会社 | 信号伝送装置 |
| CN109860131A (zh) * | 2019-03-22 | 2019-06-07 | 西安微电子技术研究所 | 一种具有内散热装置的系统级封装结构 |
-
1984
- 1984-09-03 JP JP59182683A patent/JPS6161449A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6161449A (ja) | 1986-03-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |