JPH0432773Y2 - - Google Patents
Info
- Publication number
- JPH0432773Y2 JPH0432773Y2 JP1986153770U JP15377086U JPH0432773Y2 JP H0432773 Y2 JPH0432773 Y2 JP H0432773Y2 JP 1986153770 U JP1986153770 U JP 1986153770U JP 15377086 U JP15377086 U JP 15377086U JP H0432773 Y2 JPH0432773 Y2 JP H0432773Y2
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- pedestal
- diode elements
- lead wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 8
- 238000003491 array Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986153770U JPH0432773Y2 (US07943777-20110517-C00090.png) | 1986-10-08 | 1986-10-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986153770U JPH0432773Y2 (US07943777-20110517-C00090.png) | 1986-10-08 | 1986-10-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6361156U JPS6361156U (US07943777-20110517-C00090.png) | 1988-04-22 |
| JPH0432773Y2 true JPH0432773Y2 (US07943777-20110517-C00090.png) | 1992-08-06 |
Family
ID=31072950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986153770U Expired JPH0432773Y2 (US07943777-20110517-C00090.png) | 1986-10-08 | 1986-10-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0432773Y2 (US07943777-20110517-C00090.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002057371A (ja) * | 2000-08-15 | 2002-02-22 | Hukuyo Denkyu Kk | 連鎖ｌｅｄ光源構造 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59206877A (ja) * | 1983-05-11 | 1984-11-22 | 株式会社東芝 | 発光表示装置 |
| JPS6045079A (ja) * | 1983-08-23 | 1985-03-11 | Honda Motor Co Ltd | 発光ダイオ−ドを用いたフレキシブルランプ |
| JPS61206102A (ja) * | 1985-03-11 | 1986-09-12 | 株式会社小糸製作所 | 車輌用灯具 |
| JPS6161854B2 (US07943777-20110517-C00090.png) * | 1984-04-23 | 1986-12-27 | Hitachi Ltd |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6092852U (ja) * | 1983-11-30 | 1985-06-25 | 白光電器工業株式会社 | 灯器の発光部分 |
| JPS6161854U (US07943777-20110517-C00090.png) * | 1984-09-27 | 1986-04-25 |
-
1986
- 1986-10-08 JP JP1986153770U patent/JPH0432773Y2/ja not_active Expired
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59206877A (ja) * | 1983-05-11 | 1984-11-22 | 株式会社東芝 | 発光表示装置 |
| JPS6045079A (ja) * | 1983-08-23 | 1985-03-11 | Honda Motor Co Ltd | 発光ダイオ−ドを用いたフレキシブルランプ |
| JPS6161854B2 (US07943777-20110517-C00090.png) * | 1984-04-23 | 1986-12-27 | Hitachi Ltd | |
| JPS61206102A (ja) * | 1985-03-11 | 1986-09-12 | 株式会社小糸製作所 | 車輌用灯具 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6361156U (US07943777-20110517-C00090.png) | 1988-04-22 |
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