JPH0432539B2 - - Google Patents
Info
- Publication number
- JPH0432539B2 JPH0432539B2 JP2209289A JP20928990A JPH0432539B2 JP H0432539 B2 JPH0432539 B2 JP H0432539B2 JP 2209289 A JP2209289 A JP 2209289A JP 20928990 A JP20928990 A JP 20928990A JP H0432539 B2 JPH0432539 B2 JP H0432539B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- guide surface
- holding
- lead frame
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78703—Mechanical holding means
- H01L2224/78704—Mechanical holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2209289A JPH03114241A (ja) | 1990-08-09 | 1990-08-09 | リードフレーム押え装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2209289A JPH03114241A (ja) | 1990-08-09 | 1990-08-09 | リードフレーム押え装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57132972A Division JPS5925235A (ja) | 1982-07-31 | 1982-07-31 | リ−ドフレ−ム押え装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03114241A JPH03114241A (ja) | 1991-05-15 |
| JPH0432539B2 true JPH0432539B2 (enrdf_load_stackoverflow) | 1992-05-29 |
Family
ID=16570482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2209289A Granted JPH03114241A (ja) | 1990-08-09 | 1990-08-09 | リードフレーム押え装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03114241A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6938530B1 (en) | 1999-09-28 | 2005-09-06 | Sanyo Electric Co., Ltd. | Tablet conveying apparatus and tablet cutting apparatus |
-
1990
- 1990-08-09 JP JP2209289A patent/JPH03114241A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03114241A (ja) | 1991-05-15 |
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