JP3488138B2 - ワイヤボンディング装置 - Google Patents

ワイヤボンディング装置

Info

Publication number
JP3488138B2
JP3488138B2 JP17989499A JP17989499A JP3488138B2 JP 3488138 B2 JP3488138 B2 JP 3488138B2 JP 17989499 A JP17989499 A JP 17989499A JP 17989499 A JP17989499 A JP 17989499A JP 3488138 B2 JP3488138 B2 JP 3488138B2
Authority
JP
Japan
Prior art keywords
frame
lead
wire bonding
mounting table
frame mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP17989499A
Other languages
English (en)
Other versions
JP2001007141A (ja
Inventor
正行 志村
久 荒井
優 猪股
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP17989499A priority Critical patent/JP3488138B2/ja
Priority to TW089107952A priority patent/TW451373B/zh
Priority to KR10-2000-0029699A priority patent/KR100374383B1/ko
Publication of JP2001007141A publication Critical patent/JP2001007141A/ja
Application granted granted Critical
Publication of JP3488138B2 publication Critical patent/JP3488138B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】 【０００１】 【発明の属する技術分野】本発明はワイヤボンディング
装置に係り、特にフレーム載置台の上面に載置したリー
ドフレームのリードをフレーム押さえの押さえ部でクラ
ンプする構造に関する。 【０００２】 【従来の技術】図２に示すように、リードフレーム１の
タブ１ａ上に半導体チップ２が固定されており、フレー
ム載置台３の上面に載置されたリードフレーム１のリー
ド１ｂを枠形状のフレーム押さえ４の押さえ部４ａでク
ランプする。この状態で、ツール５に挿通されたワイヤ
６を半導体チップ２のパッド（第１ボンド点）とリード
１ｂの先端部分（第２ボンド点）とをツール５により接
続する。なお、７はヒータを示す。 【０００３】 【発明が解決しようとする課題】近年、リード１ｂは薄
くかつ細くなる傾向にあり、変形が生じ易い。従来のよ
うにリード１ｂをフレーム押さえ４の押さえ部４ａでフ
レーム載置台３に押し付けるのみでは、リード１ｂの先
端が持ち上がり、フレーム載置台３に密着しないことが
ある。リード１ｂの先端がフレーム載置台３に密着しな
いと、ツール５に印加されている超音波振動が逃げ、ワ
イヤボンディングの着きが悪く品質が低下する。 【０００４】本発明の課題は、簡単な構造でリードの先
端をフレーム載置台に密着させることができるワイヤボ
ンディング装置を提供することにある。 【０００５】 【課題を解決するための手段】上記課題を解決するため
の本発明の手段は、フレーム載置台の上面に載置したリ
ードフレームのリードをフレーム押さえの押さえ部でク
ランプするワイヤボンディング装置において、前記フレ
ーム載置台の上面には、前記フレーム押さえの押さえ部
の先端に対応した部分から該押さえ部の後端の途中まで
に溝を設けたことを特徴とする。 【０００６】 【発明の実施の形態】本発明の一実施の形態を図１によ
り説明する。なお、図２と同じ又は相当部分には同一符
号を付し、その詳細な説明は省略する。フレーム載置台
３の上面には、押さえ部４ａの先端を受ける部分に溝８
が形成されている。従って、リード１ｂをフレーム押さ
え４の押さえ部４ａの後端でフレーム載置台３に押し付
けた場合、この押圧力は溝８に逃げ、リード１ｂの先端
は持ち上がらなくフレーム載置台３に密着する。溝８の
存在により、むしろ押さえ部４ａでリード１ｂを押し付
けた場合、リード１ｂ先端にフレーム載置台３方向への
力が作用するためである。 【０００７】このように、リード１ｂの先端はフレーム
載置台３に密着するので、ワイヤボンディング時におけ
る超音波振動の損失がなく、ボンディング品質が向上す
る。なお、上記実施の形態は、フレーム載置台３として
ヒートブロックの場合について説明したが、ヒートブロ
ック上にヒート駒が固定されている場合には、このヒー
ト駒に溝８を設けることは言うまでもない。またフレー
ム載置台３としてヒートブロックの場合について説明し
たが、ヒータを有しないフレーム載置台にも適用できる
ことは言うまでもない。 【０００８】 【発明の効果】本発明は、フレーム載置台の上面には、
フレーム押さえの押さえ部の先端に対応した部分から該
押さえ部の後端の途中までに溝を設けたので、簡単な構
造でリードの先端をフレーム載置台に密着させることが
できる。
【図面の簡単な説明】 【図１】本発明のワイヤボンディング装置の一実施の形
態を示す断面図である。 【図２】従来のワイヤボンディング装置を示す断面図で
ある。 【符号の説明】 １ リードフレーム １ｂ リード ２ 半導体チップ ３ フレーム載置台 ４ フレーム押さえ ４ａ 押さえ部 ５ ツール ６ ワイヤ ８ 溝
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平４−176135（ＪＰ，Ａ) 特開 平10−256449（ＪＰ，Ａ) 特開 平５−326609（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/60 301

Claims (1)

  1. (57)【特許請求の範囲】 【請求項１】 フレーム載置台の上面に載置したリード
    フレームのリードをフレーム押さえの押さえ部でクラン
    プするワイヤボンディング装置において、前記フレーム
    載置台の上面には、前記フレーム押さえの押さえ部の先
    端に対応した部分から該押さえ部の後端の途中までに溝
    を設けたことを特徴とするワイヤボンディング装置。
JP17989499A 1999-06-25 1999-06-25 ワイヤボンディング装置 Expired - Fee Related JP3488138B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP17989499A JP3488138B2 (ja) 1999-06-25 1999-06-25 ワイヤボンディング装置
TW089107952A TW451373B (en) 1999-06-25 2000-04-27 Wire bonding device
KR10-2000-0029699A KR100374383B1 (ko) 1999-06-25 2000-05-31 와이어본딩장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17989499A JP3488138B2 (ja) 1999-06-25 1999-06-25 ワイヤボンディング装置

Publications (2)

Publication Number Publication Date
JP2001007141A JP2001007141A (ja) 2001-01-12
JP3488138B2 true JP3488138B2 (ja) 2004-01-19

Family

ID=16073773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17989499A Expired - Fee Related JP3488138B2 (ja) 1999-06-25 1999-06-25 ワイヤボンディング装置

Country Status (3)

Country Link
JP (1) JP3488138B2 (ja)
KR (1) KR100374383B1 (ja)
TW (1) TW451373B (ja)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0120454Y1 (ko) * 1995-02-28 1998-08-01 김광호 단차를 가지는 히터블럭

Also Published As

Publication number Publication date
TW451373B (en) 2001-08-21
KR100374383B1 (ko) 2003-03-04
KR20010007155A (ko) 2001-01-26
JP2001007141A (ja) 2001-01-12

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