JPH03114241A - リードフレーム押え装置 - Google Patents

リードフレーム押え装置

Info

Publication number
JPH03114241A
JPH03114241A JP2209289A JP20928990A JPH03114241A JP H03114241 A JPH03114241 A JP H03114241A JP 2209289 A JP2209289 A JP 2209289A JP 20928990 A JP20928990 A JP 20928990A JP H03114241 A JPH03114241 A JP H03114241A
Authority
JP
Japan
Prior art keywords
lead
guide surface
holding
lead frame
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2209289A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0432539B2 (enrdf_load_stackoverflow
Inventor
Hiroshi Ushiki
博 丑木
Tomio Kobayashi
十三男 小林
Koichi Orita
折田　浩一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2209289A priority Critical patent/JPH03114241A/ja
Publication of JPH03114241A publication Critical patent/JPH03114241A/ja
Publication of JPH0432539B2 publication Critical patent/JPH0432539B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means
    • H01L2224/78704—Mechanical holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP2209289A 1990-08-09 1990-08-09 リードフレーム押え装置 Granted JPH03114241A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2209289A JPH03114241A (ja) 1990-08-09 1990-08-09 リードフレーム押え装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2209289A JPH03114241A (ja) 1990-08-09 1990-08-09 リードフレーム押え装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP57132972A Division JPS5925235A (ja) 1982-07-31 1982-07-31 リ−ドフレ−ム押え装置

Publications (2)

Publication Number Publication Date
JPH03114241A true JPH03114241A (ja) 1991-05-15
JPH0432539B2 JPH0432539B2 (enrdf_load_stackoverflow) 1992-05-29

Family

ID=16570482

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2209289A Granted JPH03114241A (ja) 1990-08-09 1990-08-09 リードフレーム押え装置

Country Status (1)

Country Link
JP (1) JPH03114241A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6938530B1 (en) 1999-09-28 2005-09-06 Sanyo Electric Co., Ltd. Tablet conveying apparatus and tablet cutting apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6938530B1 (en) 1999-09-28 2005-09-06 Sanyo Electric Co., Ltd. Tablet conveying apparatus and tablet cutting apparatus

Also Published As

Publication number Publication date
JPH0432539B2 (enrdf_load_stackoverflow) 1992-05-29

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