JPH0139213B2 - - Google Patents

Info

Publication number
JPH0139213B2
JPH0139213B2 JP57132972A JP13297282A JPH0139213B2 JP H0139213 B2 JPH0139213 B2 JP H0139213B2 JP 57132972 A JP57132972 A JP 57132972A JP 13297282 A JP13297282 A JP 13297282A JP H0139213 B2 JPH0139213 B2 JP H0139213B2
Authority
JP
Japan
Prior art keywords
lead
lead frame
holding
pellet
guide surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57132972A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5925235A (ja
Inventor
Hiroshi Ushiki
Tomio Kobayashi
Koichi Orita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP57132972A priority Critical patent/JPS5925235A/ja
Publication of JPS5925235A publication Critical patent/JPS5925235A/ja
Publication of JPH0139213B2 publication Critical patent/JPH0139213B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP57132972A 1982-07-31 1982-07-31 リ−ドフレ−ム押え装置 Granted JPS5925235A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57132972A JPS5925235A (ja) 1982-07-31 1982-07-31 リ−ドフレ−ム押え装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57132972A JPS5925235A (ja) 1982-07-31 1982-07-31 リ−ドフレ−ム押え装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2209289A Division JPH03114241A (ja) 1990-08-09 1990-08-09 リードフレーム押え装置

Publications (2)

Publication Number Publication Date
JPS5925235A JPS5925235A (ja) 1984-02-09
JPH0139213B2 true JPH0139213B2 (enrdf_load_stackoverflow) 1989-08-18

Family

ID=15093792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57132972A Granted JPS5925235A (ja) 1982-07-31 1982-07-31 リ−ドフレ−ム押え装置

Country Status (1)

Country Link
JP (1) JPS5925235A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60147792A (ja) * 1984-01-11 1985-08-03 カシオ計算機株式会社 電子楽器の周波数制御装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4918609U (enrdf_load_stackoverflow) * 1972-05-24 1974-02-16
JPS6057393B2 (ja) * 1977-06-27 1985-12-14 鐘淵化学工業株式会社 塗膜の表面を改良する方法
JPS5754278Y2 (enrdf_load_stackoverflow) * 1977-10-18 1982-11-24

Also Published As

Publication number Publication date
JPS5925235A (ja) 1984-02-09

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