JPH0431800B2 - - Google Patents

Info

Publication number
JPH0431800B2
JPH0431800B2 JP4214583A JP4214583A JPH0431800B2 JP H0431800 B2 JPH0431800 B2 JP H0431800B2 JP 4214583 A JP4214583 A JP 4214583A JP 4214583 A JP4214583 A JP 4214583A JP H0431800 B2 JPH0431800 B2 JP H0431800B2
Authority
JP
Japan
Prior art keywords
solder
tin
melting point
alloy
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4214583A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59169694A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4214583A priority Critical patent/JPS59169694A/ja
Publication of JPS59169694A publication Critical patent/JPS59169694A/ja
Publication of JPH0431800B2 publication Critical patent/JPH0431800B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
JP4214583A 1983-03-16 1983-03-16 半田接着方法 Granted JPS59169694A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4214583A JPS59169694A (ja) 1983-03-16 1983-03-16 半田接着方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4214583A JPS59169694A (ja) 1983-03-16 1983-03-16 半田接着方法

Publications (2)

Publication Number Publication Date
JPS59169694A JPS59169694A (ja) 1984-09-25
JPH0431800B2 true JPH0431800B2 (en, 2012) 1992-05-27

Family

ID=12627768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4214583A Granted JPS59169694A (ja) 1983-03-16 1983-03-16 半田接着方法

Country Status (1)

Country Link
JP (1) JPS59169694A (en, 2012)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6187396A (ja) * 1984-10-05 1986-05-02 株式会社日立製作所 電子回路装置とその製造方法
JPS6471591A (en) * 1987-09-09 1989-03-16 Sumitomo Spec Metals Joining method for metal or alloy piece
JPH04270092A (ja) * 1991-01-21 1992-09-25 Mitsubishi Electric Corp 半田材料及び接合方法
JPH0596395A (ja) * 1991-10-04 1993-04-20 Mitsubishi Electric Corp 接合材、接合方法および半導体装置
US5881945A (en) * 1997-04-30 1999-03-16 International Business Machines Corporation Multi-layer solder seal band for semiconductor substrates and process
JPWO2024176947A1 (en, 2012) * 2023-02-22 2024-08-29

Also Published As

Publication number Publication date
JPS59169694A (ja) 1984-09-25

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