JPH0146228B2 - - Google Patents

Info

Publication number
JPH0146228B2
JPH0146228B2 JP56164344A JP16434481A JPH0146228B2 JP H0146228 B2 JPH0146228 B2 JP H0146228B2 JP 56164344 A JP56164344 A JP 56164344A JP 16434481 A JP16434481 A JP 16434481A JP H0146228 B2 JPH0146228 B2 JP H0146228B2
Authority
JP
Japan
Prior art keywords
solder
solder joint
copper
soldered
approximately
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56164344A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57112972A (en
Inventor
Sarubatoa Kyamarano Aamondo
Deijiakomo Giurio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS57112972A publication Critical patent/JPS57112972A/ja
Publication of JPH0146228B2 publication Critical patent/JPH0146228B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3013—Au as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP16434481A 1980-12-31 1981-10-16 Brazing method Granted JPS57112972A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US22160380A 1980-12-31 1980-12-31

Publications (2)

Publication Number Publication Date
JPS57112972A JPS57112972A (en) 1982-07-14
JPH0146228B2 true JPH0146228B2 (en, 2012) 1989-10-06

Family

ID=22828497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16434481A Granted JPS57112972A (en) 1980-12-31 1981-10-16 Brazing method

Country Status (4)

Country Link
EP (1) EP0055368B1 (en, 2012)
JP (1) JPS57112972A (en, 2012)
CA (1) CA1175297A (en, 2012)
DE (1) DE3171139D1 (en, 2012)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4634638A (en) * 1981-12-17 1987-01-06 International Business Machines Corporation High melting point copper-gold-tin brazing alloy for chip carriers
US4492842A (en) * 1983-08-08 1985-01-08 International Business Machines Corporation Process of brazing using low temperature braze alloy of gold-indium tin
DE4224012C1 (de) * 1992-07-21 1993-12-02 Heraeus Gmbh W C Lötfähiges elektrisches Kontaktelement
JP3271475B2 (ja) * 1994-08-01 2002-04-02 株式会社デンソー 電気素子の接合材料および接合方法
US5881945A (en) * 1997-04-30 1999-03-16 International Business Machines Corporation Multi-layer solder seal band for semiconductor substrates and process
US5990560A (en) * 1997-10-22 1999-11-23 Lucent Technologies Inc. Method and compositions for achieving a kinetically controlled solder bond
DE10314876B4 (de) * 2003-04-01 2008-02-14 Infineon Technologies Ag Verfahren zum mehrstufigen Herstellen von Diffusionslötverbindungen und seine Verwendung für Leistungsbauteile mit Halbleiterchips

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR932746A (fr) * 1945-05-30 1948-03-31 Int Standard Electric Corp Perfectionnements aux méthodes de soudure de pièces métalliques
GB677012A (en) * 1949-09-05 1952-08-06 Ronald Colgan Jewell Improvements in or relating to solders
FR1052958A (fr) * 1952-03-18 1954-01-29 Csf Procédé de brasure métal-métal, notamment pour la fermeture des tubes électroniques
FR1418430A (fr) * 1963-12-02 1965-11-19 Balzers Patent Beteilig Ag Procédé de réalisation par évaporation sous vide d'un revêtement métallique adhérent, électriquement conducteur et pouvant être brasé, sur une base solide, et non métallique, par exemple verre ou matière céramique
GB1444350A (en) * 1972-10-03 1976-07-28 Johnson Matthey Co Ltd Dental alloys
JPS59319B2 (ja) * 1977-09-07 1984-01-06 三菱電機株式会社 鑞付方法
JPS54115656A (en) * 1978-01-27 1979-09-08 Sumitomo Metal Mining Co Gold soldering material

Also Published As

Publication number Publication date
EP0055368A1 (en) 1982-07-07
EP0055368B1 (en) 1985-06-26
CA1175297A (en) 1984-10-02
JPS57112972A (en) 1982-07-14
DE3171139D1 (en) 1985-08-01

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