JPH043107B2 - - Google Patents
Info
- Publication number
- JPH043107B2 JPH043107B2 JP7630382A JP7630382A JPH043107B2 JP H043107 B2 JPH043107 B2 JP H043107B2 JP 7630382 A JP7630382 A JP 7630382A JP 7630382 A JP7630382 A JP 7630382A JP H043107 B2 JPH043107 B2 JP H043107B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- wafer
- pattern
- name
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000523 sample Substances 0.000 claims description 21
- 230000007246 mechanism Effects 0.000 claims description 10
- 238000007689 inspection Methods 0.000 claims description 9
- 238000012790 confirmation Methods 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 80
- 238000003384 imaging method Methods 0.000 description 16
- 238000005259 measurement Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 238000012546 transfer Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 238000003909 pattern recognition Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/5448—Located on chip prior to dicing and remaining on chip after dicing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7630382A JPS58194348A (ja) | 1982-05-07 | 1982-05-07 | ウエハ内チツプの自動種別確認方式 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7630382A JPS58194348A (ja) | 1982-05-07 | 1982-05-07 | ウエハ内チツプの自動種別確認方式 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58194348A JPS58194348A (ja) | 1983-11-12 |
| JPH043107B2 true JPH043107B2 (enrdf_load_stackoverflow) | 1992-01-22 |
Family
ID=13601597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7630382A Granted JPS58194348A (ja) | 1982-05-07 | 1982-05-07 | ウエハ内チツプの自動種別確認方式 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58194348A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0715931B2 (ja) * | 1985-08-30 | 1995-02-22 | キヤノン株式会社 | ウェハ処理装置 |
| JPH04130386U (ja) * | 1991-05-23 | 1992-11-30 | 株式会社ダイクレ | Ｆｒｐグレーチングの積層構造 |
-
1982
- 1982-05-07 JP JP7630382A patent/JPS58194348A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58194348A (ja) | 1983-11-12 |
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