JPH04277636A - Preparation of semiconductor device - Google Patents

Preparation of semiconductor device

Info

Publication number
JPH04277636A
JPH04277636A JP6398891A JP6398891A JPH04277636A JP H04277636 A JPH04277636 A JP H04277636A JP 6398891 A JP6398891 A JP 6398891A JP 6398891 A JP6398891 A JP 6398891A JP H04277636 A JPH04277636 A JP H04277636A
Authority
JP
Japan
Prior art keywords
leadframe
joint member
chip
semiconductor chip
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6398891A
Other languages
Japanese (ja)
Other versions
JP2962586B2 (en
Inventor
Katsuya Fukase
Masato Tanaka
Seiki Shimada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP6398891A priority Critical patent/JP2962586B2/en
Publication of JPH04277636A publication Critical patent/JPH04277636A/en
Application granted granted Critical
Publication of JP2962586B2 publication Critical patent/JP2962586B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85001Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/153Connection portion
    • H01L2924/1531Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Abstract

PURPOSE: To provide a high density lead pattern, to facilitate the manufacture of a semiconductor device, and to reduce the production cost of the device by adhering a carrier film on the surface opposite to the chip-mounted surface of a leadframe, thereby preparing a joint member.
CONSTITUTION: There is prepared a leadframe 10 which is provided with a predetermined pattern, such as a pad 12 and a conductor pattern 14, and which includes chief areas, such as areas for bonding and connecting terminals 4, with a surface treatment such as a plating. A dielectric carrier film 20 is attached to the surface opposite to the conductor chip mounted surface of the leadframe 10, thereby preparing a joint member. A semiconductor chip 30 is mounted on the pad 12 of the joint member, and the semiconductor chip 30 and the leadframe 10 are electrically interconnected with each other. The surface of the joint member, where the semiconductor chip 30 is mounted, is sealed with resin, and the connecting terminals 4, which are electrically connected with the conductor pattern 14, are formed on the carrier-film-deposited surface of the resin-sealed package.
COPYRIGHT: (C)1992,JPO&Japio
JP6398891A 1991-03-05 1991-03-05 Semiconductor device, method of manufacturing the same, and joined body used therefor Expired - Lifetime JP2962586B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6398891A JP2962586B2 (en) 1991-03-05 1991-03-05 Semiconductor device, method of manufacturing the same, and joined body used therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6398891A JP2962586B2 (en) 1991-03-05 1991-03-05 Semiconductor device, method of manufacturing the same, and joined body used therefor

Publications (2)

Publication Number Publication Date
JPH04277636A true JPH04277636A (en) 1992-10-02
JP2962586B2 JP2962586B2 (en) 1999-10-12

Family

ID=13245176

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6398891A Expired - Lifetime JP2962586B2 (en) 1991-03-05 1991-03-05 Semiconductor device, method of manufacturing the same, and joined body used therefor

Country Status (1)

Country Link
JP (1) JP2962586B2 (en)

Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07283336A (en) * 1994-04-05 1995-10-27 Toppan Printing Co Ltd Chip carrier
JPH0878472A (en) * 1994-09-05 1996-03-22 Hitachi Cable Ltd Semiconductor device and base body therefor
JPH0878568A (en) * 1994-09-05 1996-03-22 Ibiden Co Ltd Package
JPH08213504A (en) * 1995-02-03 1996-08-20 Matsushita Electron Corp Resin-sealed semiconductor device and manufacture thereof
JPH08264581A (en) * 1995-03-28 1996-10-11 Ibiden Co Ltd Package and its manufacture
JPH08298345A (en) * 1995-04-26 1996-11-12 Shichizun Denshi:Kk Chip type light emitting diode
JPH0955444A (en) * 1995-08-11 1997-02-25 Hitachi Chem Co Ltd Semiconductor package
US5614443A (en) * 1995-07-06 1997-03-25 Mitsui High-Tec, Inc. Method of producing a frame made of connected semiconductor die mounting substrates
JPH0982741A (en) * 1995-09-19 1997-03-28 Seiko Epson Corp Chip carrier structure and its manufacture
JPH0997868A (en) * 1995-09-28 1997-04-08 Dainippon Printing Co Ltd Lead frame member and its manufacturing method
JPH09116045A (en) * 1995-10-13 1997-05-02 Dainippon Printing Co Ltd Resin-sealed semiconductor device of bga type using lead frame and its manufacture
US5663593A (en) * 1995-10-17 1997-09-02 National Semiconductor Corporation Ball grid array package with lead frame
JPH09237852A (en) * 1996-02-28 1997-09-09 Hitachi Chem Co Ltd Chip support substrate for semiconductor package
US5677566A (en) * 1995-05-08 1997-10-14 Micron Technology, Inc. Semiconductor chip package
US5818105A (en) * 1994-07-22 1998-10-06 Nec Corporation Semiconductor device with plastic material covering a semiconductor chip mounted on a substrate of the device
JPH10294335A (en) * 1997-02-19 1998-11-04 Japan Gore Tex Inc Interposer for ic chip mounting use and ic chip package
JPH11251484A (en) * 1998-03-06 1999-09-17 Mitsui High Tec Inc Chip-sized semiconductor device
JPH11288983A (en) * 1999-03-08 1999-10-19 Sony Corp Lead frame, manufacture of the lead frame, semiconductor device and manufacture of the semiconductor device
JPH11345895A (en) * 1998-06-01 1999-12-14 Matsushita Electron Corp Semiconductor device, lead frame and manufacturing method thereof
JP2002110858A (en) * 1994-03-18 2002-04-12 Hitachi Chem Co Ltd Semiconductor package and its manufacturing method
JP2002334949A (en) * 1994-03-18 2002-11-22 Hitachi Chem Co Ltd Semiconductor package and method of manufacturing substrate for semiconductor element mounting
JP2002334948A (en) * 1994-03-18 2002-11-22 Hitachi Chem Co Ltd Semiconductor package, substrate for semiconductor element mounting and method of manufacturing them
JP2002334950A (en) * 1994-03-18 2002-11-22 Hitachi Chem Co Ltd Method of manufacturing semiconductor package and semiconductor package
JP2002334951A (en) * 1994-03-18 2002-11-22 Hitachi Chem Co Ltd Substrate for semiconductor element mounting and semiconductor package
JP2003110058A (en) * 2001-10-01 2003-04-11 Dainippon Printing Co Ltd Semiconductor package and circuit member for manufacturing method body apparatus of the semiconductor package
JP2003179188A (en) * 2002-11-29 2003-06-27 Hitachi Chem Co Ltd Substrate for semiconductor package
JP2003243600A (en) * 2001-12-14 2003-08-29 Hitachi Ltd Semiconductor device and method of manufacturing the same
JP2003303920A (en) * 2002-04-10 2003-10-24 Hitachi Cable Ltd Wiring plate and manufacturing method of semiconductor device using the same
US6746897B2 (en) 1994-03-18 2004-06-08 Naoki Fukutomi Fabrication process of semiconductor package and semiconductor package
JP2004282098A (en) * 1994-03-18 2004-10-07 Hitachi Chem Co Ltd Manufacturing method for semiconductor package
JP2007123919A (en) * 1994-03-18 2007-05-17 Hitachi Chem Co Ltd Method for manufacturing semiconductor package, and semiconductor package
JP2007227962A (en) * 2007-04-20 2007-09-06 Hitachi Chem Co Ltd Semiconductor packaging substrate, semiconductor package using same, and method of manufacturing them
JP2016072588A (en) * 2014-09-30 2016-05-09 菱生精密工業股▲分▼有限公司 QFN package structure and QFN packaging method
JP2020188186A (en) * 2019-05-16 2020-11-19 Towa株式会社 Manufacturing method of semiconductor device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6278751U (en) * 1985-11-06 1987-05-20
JPS63146453A (en) * 1986-12-10 1988-06-18 Matsushita Electric Ind Co Ltd Semiconductor package and manufacture of same
JPH0311641A (en) * 1989-06-08 1991-01-18 Shinko Electric Ind Co Ltd Semiconductor device
JPH0399456A (en) * 1989-09-06 1991-04-24 Motorola Inc Semiconductor device and manufacturing method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6278751U (en) * 1985-11-06 1987-05-20
JPS63146453A (en) * 1986-12-10 1988-06-18 Matsushita Electric Ind Co Ltd Semiconductor package and manufacture of same
JPH0311641A (en) * 1989-06-08 1991-01-18 Shinko Electric Ind Co Ltd Semiconductor device
JPH0399456A (en) * 1989-09-06 1991-04-24 Motorola Inc Semiconductor device and manufacturing method thereof

Cited By (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004282098A (en) * 1994-03-18 2004-10-07 Hitachi Chem Co Ltd Manufacturing method for semiconductor package
US7187072B2 (en) 1994-03-18 2007-03-06 Hitachi Chemical Company, Ltd. Fabrication process of semiconductor package and semiconductor package
JP2002334950A (en) * 1994-03-18 2002-11-22 Hitachi Chem Co Ltd Method of manufacturing semiconductor package and semiconductor package
JP2002334948A (en) * 1994-03-18 2002-11-22 Hitachi Chem Co Ltd Semiconductor package, substrate for semiconductor element mounting and method of manufacturing them
JP2002334949A (en) * 1994-03-18 2002-11-22 Hitachi Chem Co Ltd Semiconductor package and method of manufacturing substrate for semiconductor element mounting
US6746897B2 (en) 1994-03-18 2004-06-08 Naoki Fukutomi Fabrication process of semiconductor package and semiconductor package
JP2007123919A (en) * 1994-03-18 2007-05-17 Hitachi Chem Co Ltd Method for manufacturing semiconductor package, and semiconductor package
JP2002110858A (en) * 1994-03-18 2002-04-12 Hitachi Chem Co Ltd Semiconductor package and its manufacturing method
JP2002334951A (en) * 1994-03-18 2002-11-22 Hitachi Chem Co Ltd Substrate for semiconductor element mounting and semiconductor package
EP1213754A3 (en) * 1994-03-18 2005-05-25 Hitachi Chemical Co., Ltd. Fabrication process of semiconductor package and semiconductor package
JPH07283336A (en) * 1994-04-05 1995-10-27 Toppan Printing Co Ltd Chip carrier
US5818105A (en) * 1994-07-22 1998-10-06 Nec Corporation Semiconductor device with plastic material covering a semiconductor chip mounted on a substrate of the device
JPH0878472A (en) * 1994-09-05 1996-03-22 Hitachi Cable Ltd Semiconductor device and base body therefor
JPH0878568A (en) * 1994-09-05 1996-03-22 Ibiden Co Ltd Package
JPH08213504A (en) * 1995-02-03 1996-08-20 Matsushita Electron Corp Resin-sealed semiconductor device and manufacture thereof
JPH08264581A (en) * 1995-03-28 1996-10-11 Ibiden Co Ltd Package and its manufacture
JPH08298345A (en) * 1995-04-26 1996-11-12 Shichizun Denshi:Kk Chip type light emitting diode
US6232213B1 (en) 1995-05-08 2001-05-15 Micron Technology, Inc. Method of making a semiconductor chip package
US5677566A (en) * 1995-05-08 1997-10-14 Micron Technology, Inc. Semiconductor chip package
US7038315B2 (en) 1995-05-08 2006-05-02 Micron Technology, Inc. Semiconductor chip package
US5614443A (en) * 1995-07-06 1997-03-25 Mitsui High-Tec, Inc. Method of producing a frame made of connected semiconductor die mounting substrates
JPH0955444A (en) * 1995-08-11 1997-02-25 Hitachi Chem Co Ltd Semiconductor package
JPH0982741A (en) * 1995-09-19 1997-03-28 Seiko Epson Corp Chip carrier structure and its manufacture
JPH0997868A (en) * 1995-09-28 1997-04-08 Dainippon Printing Co Ltd Lead frame member and its manufacturing method
JPH09116045A (en) * 1995-10-13 1997-05-02 Dainippon Printing Co Ltd Resin-sealed semiconductor device of bga type using lead frame and its manufacture
US5663593A (en) * 1995-10-17 1997-09-02 National Semiconductor Corporation Ball grid array package with lead frame
JPH09237852A (en) * 1996-02-28 1997-09-09 Hitachi Chem Co Ltd Chip support substrate for semiconductor package
JPH10294335A (en) * 1997-02-19 1998-11-04 Japan Gore Tex Inc Interposer for ic chip mounting use and ic chip package
JPH11251484A (en) * 1998-03-06 1999-09-17 Mitsui High Tec Inc Chip-sized semiconductor device
JPH11345895A (en) * 1998-06-01 1999-12-14 Matsushita Electron Corp Semiconductor device, lead frame and manufacturing method thereof
JPH11288983A (en) * 1999-03-08 1999-10-19 Sony Corp Lead frame, manufacture of the lead frame, semiconductor device and manufacture of the semiconductor device
JP2003110058A (en) * 2001-10-01 2003-04-11 Dainippon Printing Co Ltd Semiconductor package and circuit member for manufacturing method body apparatus of the semiconductor package
JP2003243600A (en) * 2001-12-14 2003-08-29 Hitachi Ltd Semiconductor device and method of manufacturing the same
JP2003303920A (en) * 2002-04-10 2003-10-24 Hitachi Cable Ltd Wiring plate and manufacturing method of semiconductor device using the same
JP2003179188A (en) * 2002-11-29 2003-06-27 Hitachi Chem Co Ltd Substrate for semiconductor package
JP2007227962A (en) * 2007-04-20 2007-09-06 Hitachi Chem Co Ltd Semiconductor packaging substrate, semiconductor package using same, and method of manufacturing them
JP4605177B2 (en) * 2007-04-20 2011-01-05 日立化成工業株式会社 Semiconductor mounting substrate
JP2016072588A (en) * 2014-09-30 2016-05-09 菱生精密工業股▲分▼有限公司 QFN package structure and QFN packaging method
JP2020188186A (en) * 2019-05-16 2020-11-19 Towa株式会社 Manufacturing method of semiconductor device
KR20200132698A (en) * 2019-05-16 2020-11-25 토와 가부시기가이샤 Manufacturing method of semiconductor apparatus

Also Published As

Publication number Publication date
JP2962586B2 (en) 1999-10-12

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