JPH04277636A - Preparation of semiconductor device - Google Patents
Preparation of semiconductor deviceInfo
- Publication number
- JPH04277636A JPH04277636A JP6398891A JP6398891A JPH04277636A JP H04277636 A JPH04277636 A JP H04277636A JP 6398891 A JP6398891 A JP 6398891A JP 6398891 A JP6398891 A JP 6398891A JP H04277636 A JPH04277636 A JP H04277636A
- Authority
- JP
- Japan
- Prior art keywords
- leadframe
- joint
- chip
- semiconductor chip
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 239000004020 conductor Substances 0.000 abstract 3
- 239000000969 carrier Substances 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 238000007747 plating Methods 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 238000004381 surface treatment Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Abstract
PURPOSE: To provide a high density lead pattern, to facilitate the manufacture of a semiconductor device, and to reduce the production cost of the device by adhering a carrier film on the surface opposite to the chip-mounted surface of a leadframe, thereby preparing a joint member.
CONSTITUTION: There is prepared a leadframe 10 which is provided with a predetermined pattern, such as a pad 12 and a conductor pattern 14, and which includes chief areas, such as areas for bonding and connecting terminals 4, with a surface treatment such as a plating. A dielectric carrier film 20 is attached to the surface opposite to the conductor chip mounted surface of the leadframe 10, thereby preparing a joint member. A semiconductor chip 30 is mounted on the pad 12 of the joint member, and the semiconductor chip 30 and the leadframe 10 are electrically interconnected with each other. The surface of the joint member, where the semiconductor chip 30 is mounted, is sealed with resin, and the connecting terminals 4, which are electrically connected with the conductor pattern 14, are formed on the carrier-film-deposited surface of the resin-sealed package.
COPYRIGHT: (C)1992,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6398891A JP2962586B2 (en) | 1991-03-05 | 1991-03-05 | Semiconductor device, method of manufacturing the same, and joined body used therefor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6398891A JP2962586B2 (en) | 1991-03-05 | 1991-03-05 | Semiconductor device, method of manufacturing the same, and joined body used therefor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04277636A true JPH04277636A (en) | 1992-10-02 |
JP2962586B2 JP2962586B2 (en) | 1999-10-12 |
Family
ID=13245176
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6398891A Expired - Lifetime JP2962586B2 (en) | 1991-03-05 | 1991-03-05 | Semiconductor device, method of manufacturing the same, and joined body used therefor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2962586B2 (en) |
Cited By (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07283336A (en) * | 1994-04-05 | 1995-10-27 | Toppan Printing Co Ltd | Chip carrier |
JPH0878472A (en) * | 1994-09-05 | 1996-03-22 | Hitachi Cable Ltd | Semiconductor device and base body therefor |
JPH0878568A (en) * | 1994-09-05 | 1996-03-22 | Ibiden Co Ltd | Package |
JPH08213504A (en) * | 1995-02-03 | 1996-08-20 | Matsushita Electron Corp | Resin-sealed semiconductor device and manufacture thereof |
JPH08264581A (en) * | 1995-03-28 | 1996-10-11 | Ibiden Co Ltd | Package and its manufacture |
JPH08298345A (en) * | 1995-04-26 | 1996-11-12 | Shichizun Denshi:Kk | Chip type light emitting diode |
JPH0955444A (en) * | 1995-08-11 | 1997-02-25 | Hitachi Chem Co Ltd | Semiconductor package |
US5614443A (en) * | 1995-07-06 | 1997-03-25 | Mitsui High-Tec, Inc. | Method of producing a frame made of connected semiconductor die mounting substrates |
JPH0982741A (en) * | 1995-09-19 | 1997-03-28 | Seiko Epson Corp | Chip carrier structure and its manufacture |
JPH0997868A (en) * | 1995-09-28 | 1997-04-08 | Dainippon Printing Co Ltd | Lead frame member and its manufacturing method |
JPH09116045A (en) * | 1995-10-13 | 1997-05-02 | Dainippon Printing Co Ltd | Resin-sealed semiconductor device of bga type using lead frame and its manufacture |
US5663593A (en) * | 1995-10-17 | 1997-09-02 | National Semiconductor Corporation | Ball grid array package with lead frame |
JPH09237852A (en) * | 1996-02-28 | 1997-09-09 | Hitachi Chem Co Ltd | Chip support substrate for semiconductor package |
US5677566A (en) * | 1995-05-08 | 1997-10-14 | Micron Technology, Inc. | Semiconductor chip package |
US5818105A (en) * | 1994-07-22 | 1998-10-06 | Nec Corporation | Semiconductor device with plastic material covering a semiconductor chip mounted on a substrate of the device |
JPH10294335A (en) * | 1997-02-19 | 1998-11-04 | Japan Gore Tex Inc | Interposer for ic chip mounting use and ic chip package |
JPH11251484A (en) * | 1998-03-06 | 1999-09-17 | Mitsui High Tec Inc | Chip-sized semiconductor device |
JPH11288983A (en) * | 1999-03-08 | 1999-10-19 | Sony Corp | Lead frame, manufacture of the lead frame, semiconductor device and manufacture of the semiconductor device |
JPH11345895A (en) * | 1998-06-01 | 1999-12-14 | Matsushita Electron Corp | Semiconductor device, lead frame and manufacturing method thereof |
JP2002110858A (en) * | 1994-03-18 | 2002-04-12 | Hitachi Chem Co Ltd | Semiconductor package and its manufacturing method |
JP2002334948A (en) * | 1994-03-18 | 2002-11-22 | Hitachi Chem Co Ltd | Semiconductor package, substrate for semiconductor element mounting and method of manufacturing them |
JP2002334949A (en) * | 1994-03-18 | 2002-11-22 | Hitachi Chem Co Ltd | Semiconductor package and method of manufacturing substrate for semiconductor element mounting |
JP2002334950A (en) * | 1994-03-18 | 2002-11-22 | Hitachi Chem Co Ltd | Method of manufacturing semiconductor package and semiconductor package |
JP2002334951A (en) * | 1994-03-18 | 2002-11-22 | Hitachi Chem Co Ltd | Substrate for semiconductor element mounting and semiconductor package |
JP2003110058A (en) * | 2001-10-01 | 2003-04-11 | Dainippon Printing Co Ltd | Semiconductor package and circuit member for manufacturing method body apparatus of the semiconductor package |
JP2003179188A (en) * | 2002-11-29 | 2003-06-27 | Hitachi Chem Co Ltd | Substrate for semiconductor package |
JP2003243600A (en) * | 2001-12-14 | 2003-08-29 | Hitachi Ltd | Semiconductor device and method of manufacturing the same |
JP2003303920A (en) * | 2002-04-10 | 2003-10-24 | Hitachi Cable Ltd | Wiring plate and manufacturing method of semiconductor device using the same |
US6746897B2 (en) | 1994-03-18 | 2004-06-08 | Naoki Fukutomi | Fabrication process of semiconductor package and semiconductor package |
JP2004282098A (en) * | 1994-03-18 | 2004-10-07 | Hitachi Chem Co Ltd | Manufacturing method for semiconductor package |
JP2007123919A (en) * | 1994-03-18 | 2007-05-17 | Hitachi Chem Co Ltd | Method for manufacturing semiconductor package, and semiconductor package |
JP2007227962A (en) * | 2007-04-20 | 2007-09-06 | Hitachi Chem Co Ltd | Semiconductor packaging substrate, semiconductor package using same, and method of manufacturing them |
JP2016072588A (en) * | 2014-09-30 | 2016-05-09 | 菱生精密工業股▲分▼有限公司 | QFN package structure and QFN packaging method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6278751U (en) * | 1985-11-06 | 1987-05-20 | ||
JPS63146453A (en) * | 1986-12-10 | 1988-06-18 | Matsushita Electric Ind Co Ltd | Semiconductor package and manufacture of same |
JPH0311641A (en) * | 1989-06-08 | 1991-01-18 | Shinko Electric Ind Co Ltd | Semiconductor device |
JPH0399456A (en) * | 1989-09-06 | 1991-04-24 | Motorola Inc | Semiconductor device and manufacturing method thereof |
-
1991
- 1991-03-05 JP JP6398891A patent/JP2962586B2/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6278751U (en) * | 1985-11-06 | 1987-05-20 | ||
JPS63146453A (en) * | 1986-12-10 | 1988-06-18 | Matsushita Electric Ind Co Ltd | Semiconductor package and manufacture of same |
JPH0311641A (en) * | 1989-06-08 | 1991-01-18 | Shinko Electric Ind Co Ltd | Semiconductor device |
JPH0399456A (en) * | 1989-09-06 | 1991-04-24 | Motorola Inc | Semiconductor device and manufacturing method thereof |
Cited By (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1213754A3 (en) * | 1994-03-18 | 2005-05-25 | Hitachi Chemical Co., Ltd. | Fabrication process of semiconductor package and semiconductor package |
JP2002334948A (en) * | 1994-03-18 | 2002-11-22 | Hitachi Chem Co Ltd | Semiconductor package, substrate for semiconductor element mounting and method of manufacturing them |
JP2002334949A (en) * | 1994-03-18 | 2002-11-22 | Hitachi Chem Co Ltd | Semiconductor package and method of manufacturing substrate for semiconductor element mounting |
JP2002334950A (en) * | 1994-03-18 | 2002-11-22 | Hitachi Chem Co Ltd | Method of manufacturing semiconductor package and semiconductor package |
JP2002334951A (en) * | 1994-03-18 | 2002-11-22 | Hitachi Chem Co Ltd | Substrate for semiconductor element mounting and semiconductor package |
US6746897B2 (en) | 1994-03-18 | 2004-06-08 | Naoki Fukutomi | Fabrication process of semiconductor package and semiconductor package |
JP2007123919A (en) * | 1994-03-18 | 2007-05-17 | Hitachi Chem Co Ltd | Method for manufacturing semiconductor package, and semiconductor package |
US7187072B2 (en) | 1994-03-18 | 2007-03-06 | Hitachi Chemical Company, Ltd. | Fabrication process of semiconductor package and semiconductor package |
JP2004282098A (en) * | 1994-03-18 | 2004-10-07 | Hitachi Chem Co Ltd | Manufacturing method for semiconductor package |
JP2002110858A (en) * | 1994-03-18 | 2002-04-12 | Hitachi Chem Co Ltd | Semiconductor package and its manufacturing method |
JPH07283336A (en) * | 1994-04-05 | 1995-10-27 | Toppan Printing Co Ltd | Chip carrier |
US5818105A (en) * | 1994-07-22 | 1998-10-06 | Nec Corporation | Semiconductor device with plastic material covering a semiconductor chip mounted on a substrate of the device |
JPH0878568A (en) * | 1994-09-05 | 1996-03-22 | Ibiden Co Ltd | Package |
JPH0878472A (en) * | 1994-09-05 | 1996-03-22 | Hitachi Cable Ltd | Semiconductor device and base body therefor |
JPH08213504A (en) * | 1995-02-03 | 1996-08-20 | Matsushita Electron Corp | Resin-sealed semiconductor device and manufacture thereof |
JPH08264581A (en) * | 1995-03-28 | 1996-10-11 | Ibiden Co Ltd | Package and its manufacture |
JPH08298345A (en) * | 1995-04-26 | 1996-11-12 | Shichizun Denshi:Kk | Chip type light emitting diode |
US5677566A (en) * | 1995-05-08 | 1997-10-14 | Micron Technology, Inc. | Semiconductor chip package |
US7038315B2 (en) | 1995-05-08 | 2006-05-02 | Micron Technology, Inc. | Semiconductor chip package |
US6232213B1 (en) | 1995-05-08 | 2001-05-15 | Micron Technology, Inc. | Method of making a semiconductor chip package |
US5614443A (en) * | 1995-07-06 | 1997-03-25 | Mitsui High-Tec, Inc. | Method of producing a frame made of connected semiconductor die mounting substrates |
JPH0955444A (en) * | 1995-08-11 | 1997-02-25 | Hitachi Chem Co Ltd | Semiconductor package |
JPH0982741A (en) * | 1995-09-19 | 1997-03-28 | Seiko Epson Corp | Chip carrier structure and its manufacture |
JPH0997868A (en) * | 1995-09-28 | 1997-04-08 | Dainippon Printing Co Ltd | Lead frame member and its manufacturing method |
JPH09116045A (en) * | 1995-10-13 | 1997-05-02 | Dainippon Printing Co Ltd | Resin-sealed semiconductor device of bga type using lead frame and its manufacture |
US5663593A (en) * | 1995-10-17 | 1997-09-02 | National Semiconductor Corporation | Ball grid array package with lead frame |
JPH09237852A (en) * | 1996-02-28 | 1997-09-09 | Hitachi Chem Co Ltd | Chip support substrate for semiconductor package |
JPH10294335A (en) * | 1997-02-19 | 1998-11-04 | Japan Gore Tex Inc | Interposer for ic chip mounting use and ic chip package |
JPH11251484A (en) * | 1998-03-06 | 1999-09-17 | Mitsui High Tec Inc | Chip-sized semiconductor device |
JPH11345895A (en) * | 1998-06-01 | 1999-12-14 | Matsushita Electron Corp | Semiconductor device, lead frame and manufacturing method thereof |
JPH11288983A (en) * | 1999-03-08 | 1999-10-19 | Sony Corp | Lead frame, manufacture of the lead frame, semiconductor device and manufacture of the semiconductor device |
JP2003110058A (en) * | 2001-10-01 | 2003-04-11 | Dainippon Printing Co Ltd | Semiconductor package and circuit member for manufacturing method body apparatus of the semiconductor package |
JP2003243600A (en) * | 2001-12-14 | 2003-08-29 | Hitachi Ltd | Semiconductor device and method of manufacturing the same |
JP2003303920A (en) * | 2002-04-10 | 2003-10-24 | Hitachi Cable Ltd | Wiring plate and manufacturing method of semiconductor device using the same |
JP2003179188A (en) * | 2002-11-29 | 2003-06-27 | Hitachi Chem Co Ltd | Substrate for semiconductor package |
JP2007227962A (en) * | 2007-04-20 | 2007-09-06 | Hitachi Chem Co Ltd | Semiconductor packaging substrate, semiconductor package using same, and method of manufacturing them |
JP4605177B2 (en) * | 2007-04-20 | 2011-01-05 | 日立化成工業株式会社 | Semiconductor mounting substrate |
JP2016072588A (en) * | 2014-09-30 | 2016-05-09 | 菱生精密工業股▲分▼有限公司 | QFN package structure and QFN packaging method |
Also Published As
Publication number | Publication date |
---|---|
JP2962586B2 (en) | 1999-10-12 |
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