JPH0427185Y2 - - Google Patents
Info
- Publication number
- JPH0427185Y2 JPH0427185Y2 JP5730086U JP5730086U JPH0427185Y2 JP H0427185 Y2 JPH0427185 Y2 JP H0427185Y2 JP 5730086 U JP5730086 U JP 5730086U JP 5730086 U JP5730086 U JP 5730086U JP H0427185 Y2 JPH0427185 Y2 JP H0427185Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- multilayer printed
- copper foil
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 22
- 238000007689 inspection Methods 0.000 claims description 20
- 239000011889 copper foil Substances 0.000 claims description 16
- 239000004593 Epoxy Substances 0.000 description 9
- 238000007747 plating Methods 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000005553 drilling Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5730086U JPH0427185Y2 (US20100223739A1-20100909-C00005.png) | 1986-04-16 | 1986-04-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5730086U JPH0427185Y2 (US20100223739A1-20100909-C00005.png) | 1986-04-16 | 1986-04-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62168681U JPS62168681U (US20100223739A1-20100909-C00005.png) | 1987-10-26 |
| JPH0427185Y2 true JPH0427185Y2 (US20100223739A1-20100909-C00005.png) | 1992-06-30 |
Family
ID=30886883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5730086U Expired JPH0427185Y2 (US20100223739A1-20100909-C00005.png) | 1986-04-16 | 1986-04-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0427185Y2 (US20100223739A1-20100909-C00005.png) |
-
1986
- 1986-04-16 JP JP5730086U patent/JPH0427185Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62168681U (US20100223739A1-20100909-C00005.png) | 1987-10-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1009204A4 (en) | MULTI-LAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD FOR SAID BOARD | |
| JPH0427185Y2 (US20100223739A1-20100909-C00005.png) | ||
| KR101039775B1 (ko) | 인쇄회로기판의 비아홀 평가 방법 및 테스트 기판 제조방법 | |
| JPH06164138A (ja) | 片面スルーホール基板 | |
| JP3116975B2 (ja) | プリント配線板のパターン検査方法 | |
| JP2570174B2 (ja) | 多層プリント配線板 | |
| JP2002100845A (ja) | ブラインドビアホール位置ずれ検査用回路パターン | |
| JPS63142694A (ja) | プリント配線板 | |
| JP2002111232A (ja) | 多層プリント配線板 | |
| JPS60109297A (ja) | プリント板の製造方法 | |
| JPH0548229A (ja) | プリント基板 | |
| JP2712997B2 (ja) | プリント配線板の製造におけるソルダーレジスト処理方法 | |
| JPH0653658A (ja) | 多層プリント配線板 | |
| JPH077272A (ja) | 多層プリント配線板 | |
| JPH05297049A (ja) | プリント配線板のパターン検査方法 | |
| JPS6215892A (ja) | 多層プリント基板の内層パタ−ン | |
| JPH0266993A (ja) | 多層プリント基板のスルーホール欠陥検出方法 | |
| JP2004053292A (ja) | インターポーザ基板の導通検査方法 | |
| JPH10326969A (ja) | プリント配線板の製造方法 | |
| JPS6129194A (ja) | 多層プリント板の内層接続法 | |
| JPH0457392A (ja) | 多層プリント基板のｎｃ基準穴穴あけ方法 | |
| JPS62252195A (ja) | 内層ずれ検出用テストホ−ルを有する多層プリント板 | |
| JPH0653622A (ja) | プリント配線板 | |
| JPH04269667A (ja) | スミア検出装置 | |
| JPS61174695A (ja) | 高温環境用部品実装プリント配線板の製作方法 |