JPH0426782B2 - - Google Patents

Info

Publication number
JPH0426782B2
JPH0426782B2 JP63155739A JP15573988A JPH0426782B2 JP H0426782 B2 JPH0426782 B2 JP H0426782B2 JP 63155739 A JP63155739 A JP 63155739A JP 15573988 A JP15573988 A JP 15573988A JP H0426782 B2 JPH0426782 B2 JP H0426782B2
Authority
JP
Japan
Prior art keywords
gold paste
insulating substrate
bonding pad
pad portion
thermal print
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63155739A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01321644A (ja
Inventor
Yutaka Tatsumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15612382&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH0426782(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP63155739A priority Critical patent/JPH01321644A/ja
Publication of JPH01321644A publication Critical patent/JPH01321644A/ja
Publication of JPH0426782B2 publication Critical patent/JPH0426782B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/075—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H10W72/536—
    • H10W72/952—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
JP63155739A 1988-06-23 1988-06-23 印刷回路基板 Granted JPH01321644A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63155739A JPH01321644A (ja) 1988-06-23 1988-06-23 印刷回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63155739A JPH01321644A (ja) 1988-06-23 1988-06-23 印刷回路基板

Related Child Applications (3)

Application Number Title Priority Date Filing Date
JP5331897A Division JPH06293149A (ja) 1993-12-27 1993-12-27 熱印字用印刷回路基板
JP5331896A Division JPH06293151A (ja) 1993-12-27 1993-12-27 熱印字用印刷回路基板
JP5331895A Division JP2667787B2 (ja) 1993-12-27 1993-12-27 サーマルプリントヘッド

Publications (2)

Publication Number Publication Date
JPH01321644A JPH01321644A (ja) 1989-12-27
JPH0426782B2 true JPH0426782B2 (enExample) 1992-05-08

Family

ID=15612382

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63155739A Granted JPH01321644A (ja) 1988-06-23 1988-06-23 印刷回路基板

Country Status (1)

Country Link
JP (1) JPH01321644A (enExample)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5876286A (ja) * 1981-10-31 1983-05-09 Mitsubishi Electric Corp サ−マルヘツド

Also Published As

Publication number Publication date
JPH01321644A (ja) 1989-12-27

Similar Documents

Publication Publication Date Title
US7616223B2 (en) Thermal printhead
US6469724B1 (en) Thick-film thermal print head and its manufacturing method
JPH0426782B2 (enExample)
JP2667787B2 (ja) サーマルプリントヘッド
JP2001232838A (ja) サーマルプリントヘッドおよびその製造方法
JPH06293149A (ja) 熱印字用印刷回路基板
JP2023084582A (ja) サーマルプリントヘッドの製造方法、サーマルプリントヘッドおよびサーマルプリンタ
JP3819640B2 (ja) サーマルプリントヘッド
JP3652831B2 (ja) 発熱装置およびその製造方法
JPH06293151A (ja) 熱印字用印刷回路基板
JP2530931Y2 (ja) サーマルヘッド
JP2633701B2 (ja) サーマルヘッド
JPH08310028A (ja) サーマルヘッド
JP2605077Y2 (ja) サーマルプリントヘッド
JP2602608Y2 (ja) サーマルヘッド
JP3114790B2 (ja) サーマルヘッド
JP3320151B2 (ja) サーマルプリントヘッド
JP2832977B2 (ja) サーマルヘッドおよびその製造方法
JPH022028A (ja) 熱転写及び通電熱転写プリンタヘッド構造
JPH02305654A (ja) サーマルヘッド
JP3476961B2 (ja) サーマルヘッド
JP3476921B2 (ja) サーマルヘッド
JPS61139453A (ja) サ−マルヘツド
JPH04241962A (ja) サーマルヘッドの製造方法
JPS6319358B2 (enExample)

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090508

Year of fee payment: 17