JPH0420742B2 - - Google Patents

Info

Publication number
JPH0420742B2
JPH0420742B2 JP62105290A JP10529087A JPH0420742B2 JP H0420742 B2 JPH0420742 B2 JP H0420742B2 JP 62105290 A JP62105290 A JP 62105290A JP 10529087 A JP10529087 A JP 10529087A JP H0420742 B2 JPH0420742 B2 JP H0420742B2
Authority
JP
Japan
Prior art keywords
acid
polishing
water
wafer
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62105290A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63272460A (ja
Inventor
Shigeo Sasaki
Yasuo Aritake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Monsanto Japan Ltd
Original Assignee
Monsanto Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=14403554&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH0420742(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Monsanto Japan Ltd filed Critical Monsanto Japan Ltd
Priority to JP62105290A priority Critical patent/JPS63272460A/ja
Publication of JPS63272460A publication Critical patent/JPS63272460A/ja
Publication of JPH0420742B2 publication Critical patent/JPH0420742B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP62105290A 1987-04-28 1987-04-28 ウエハ−用研磨剤組成物 Granted JPS63272460A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62105290A JPS63272460A (ja) 1987-04-28 1987-04-28 ウエハ−用研磨剤組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62105290A JPS63272460A (ja) 1987-04-28 1987-04-28 ウエハ−用研磨剤組成物

Publications (2)

Publication Number Publication Date
JPS63272460A JPS63272460A (ja) 1988-11-09
JPH0420742B2 true JPH0420742B2 (enExample) 1992-04-06

Family

ID=14403554

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62105290A Granted JPS63272460A (ja) 1987-04-28 1987-04-28 ウエハ−用研磨剤組成物

Country Status (1)

Country Link
JP (1) JPS63272460A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008532329A (ja) * 2005-03-07 2008-08-14 チェイル インダストリーズ インコーポレイテッド シリコンウエハの表面品質を改善する研磨用スラリー組成物、及びそれを用いたシリコンウエハの研磨方法
US10460947B2 (en) 2014-12-15 2019-10-29 Shin-Etsu Handotai Co., Ltd. Method for polishing silicon wafer

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999032570A1 (en) * 1997-12-23 1999-07-01 Akzo Nobel N.V. A composition for chemical mechanical polishing
JP3810588B2 (ja) * 1998-06-22 2006-08-16 株式会社フジミインコーポレーテッド 研磨用組成物
AU5445899A (en) 1998-08-31 2000-03-21 Hitachi Chemical Company, Ltd. Abrasive liquid for metal and method for polishing
TWI267549B (en) * 1999-03-18 2006-12-01 Toshiba Corp Aqueous dispersion, aqueous dispersion for chemical mechanical polishing used for manufacture of semiconductor devices, method for manufacture of semiconductor devices, and method for formation of embedded wiring
JP2008155368A (ja) * 1999-06-23 2008-07-10 Jsr Corp 研磨用組成物、および研磨方法
JP3440419B2 (ja) 2001-02-02 2003-08-25 株式会社フジミインコーポレーテッド 研磨用組成物およびそれを用いた研磨方法
AU2003277621A1 (en) 2002-11-08 2004-06-07 Fujimi Incorporated Polishing composition and rinsing composition
JP4814502B2 (ja) 2004-09-09 2011-11-16 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
TW200619368A (en) * 2004-10-28 2006-06-16 Nissan Chemical Ind Ltd Polishing composition for silicon wafer
US20090127501A1 (en) * 2005-05-27 2009-05-21 Nissan Chemical Industries, Ltd. Polishing Composition for Silicon Wafer
EP2100666A4 (en) 2006-12-04 2013-03-27 Nomura Micro Science Kk PROCESS FOR PURIFYING A CHEMICAL ADDITIONED WITH A CHELATING AGENT
JP7379789B2 (ja) 2020-03-02 2023-11-15 株式会社タイテム コロイダルシリカスラリー

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3328141A (en) * 1966-02-28 1967-06-27 Tizon Chemical Corp Process for polishing crystalline silicon
JPS6287242A (ja) * 1985-05-29 1987-04-21 Nippon Shokubai Kagaku Kogyo Co Ltd 安定な金属酸化物系ゾル組成物

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008532329A (ja) * 2005-03-07 2008-08-14 チェイル インダストリーズ インコーポレイテッド シリコンウエハの表面品質を改善する研磨用スラリー組成物、及びそれを用いたシリコンウエハの研磨方法
US10460947B2 (en) 2014-12-15 2019-10-29 Shin-Etsu Handotai Co., Ltd. Method for polishing silicon wafer
DE112015005277B4 (de) 2014-12-15 2024-05-02 Shin-Etsu Handotai Co., Ltd. Verfahren zum Polieren von Siliciumwafern

Also Published As

Publication number Publication date
JPS63272460A (ja) 1988-11-09

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