JPH0419805Y2 - - Google Patents

Info

Publication number
JPH0419805Y2
JPH0419805Y2 JP1983075839U JP7583983U JPH0419805Y2 JP H0419805 Y2 JPH0419805 Y2 JP H0419805Y2 JP 1983075839 U JP1983075839 U JP 1983075839U JP 7583983 U JP7583983 U JP 7583983U JP H0419805 Y2 JPH0419805 Y2 JP H0419805Y2
Authority
JP
Japan
Prior art keywords
resin
lead
semiconductor element
metal plate
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983075839U
Other languages
English (en)
Japanese (ja)
Other versions
JPS59180450U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983075839U priority Critical patent/JPS59180450U/ja
Publication of JPS59180450U publication Critical patent/JPS59180450U/ja
Application granted granted Critical
Publication of JPH0419805Y2 publication Critical patent/JPH0419805Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1983075839U 1983-05-20 1983-05-20 樹脂封止型半導体装置 Granted JPS59180450U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983075839U JPS59180450U (ja) 1983-05-20 1983-05-20 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983075839U JPS59180450U (ja) 1983-05-20 1983-05-20 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS59180450U JPS59180450U (ja) 1984-12-01
JPH0419805Y2 true JPH0419805Y2 (enExample) 1992-05-06

Family

ID=30205898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983075839U Granted JPS59180450U (ja) 1983-05-20 1983-05-20 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS59180450U (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5620773B2 (ja) * 2010-09-28 2014-11-05 新電元工業株式会社 樹脂封止型半導体装置

Also Published As

Publication number Publication date
JPS59180450U (ja) 1984-12-01

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