JPH0418703B2 - - Google Patents
Info
- Publication number
- JPH0418703B2 JPH0418703B2 JP61197049A JP19704986A JPH0418703B2 JP H0418703 B2 JPH0418703 B2 JP H0418703B2 JP 61197049 A JP61197049 A JP 61197049A JP 19704986 A JP19704986 A JP 19704986A JP H0418703 B2 JPH0418703 B2 JP H0418703B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- screen printing
- printing plate
- sealing frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007789 sealing Methods 0.000 claims description 41
- 238000007650 screen-printing Methods 0.000 claims description 33
- 229920005989 resin Polymers 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 26
- 239000004065 semiconductor Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 7
- 229920001187 thermosetting polymer Polymers 0.000 claims description 7
- 239000000839 emulsion Substances 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19704986A JPS6353955A (ja) | 1986-08-25 | 1986-08-25 | プリント配線基板の封止枠の形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19704986A JPS6353955A (ja) | 1986-08-25 | 1986-08-25 | プリント配線基板の封止枠の形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6353955A JPS6353955A (ja) | 1988-03-08 |
| JPH0418703B2 true JPH0418703B2 (zh) | 1992-03-27 |
Family
ID=16367861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19704986A Granted JPS6353955A (ja) | 1986-08-25 | 1986-08-25 | プリント配線基板の封止枠の形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6353955A (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3135952C2 (de) | 1981-09-10 | 1983-11-17 | Siemens AG, 1000 Berlin und 8000 München | Gegentakt-Ausgangsschaltung für ein Verknüpfungsglied in Stromschaltertechnik. |
| US6067709A (en) * | 1996-02-23 | 2000-05-30 | Mpm Corporation | Applying encapsulating material to substrates |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57106058A (en) * | 1980-12-23 | 1982-07-01 | Nitto Electric Ind Co Ltd | Manufacture of frame body |
-
1986
- 1986-08-25 JP JP19704986A patent/JPS6353955A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57106058A (en) * | 1980-12-23 | 1982-07-01 | Nitto Electric Ind Co Ltd | Manufacture of frame body |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6353955A (ja) | 1988-03-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5717252A (en) | Solder-ball connected semiconductor device with a recessed chip mounting area | |
| KR100212607B1 (ko) | 반도체 칩 팩키지 | |
| KR19980042617A (ko) | 웨이퍼 레벨 패키징 | |
| JPH063819B2 (ja) | 半導体装置の実装構造および実装方法 | |
| JPH1050878A (ja) | 半導体装置およびその製造方法 | |
| JP3391282B2 (ja) | 電子部品の製造方法 | |
| JPS624351A (ja) | 半導体キヤリアの製造方法 | |
| JPS5835367B2 (ja) | 回路素子基板及びその製造方法 | |
| JP3461073B2 (ja) | ベアチップ封止方法 | |
| JPH0418703B2 (zh) | ||
| JP3611463B2 (ja) | 電子部品の製造方法 | |
| JPS58182854A (ja) | レジン封止型半導体装置およびその製造方法 | |
| JP3398580B2 (ja) | 半導体装置の製造方法及び基板フレーム | |
| JPH04302457A (ja) | 混成集積回路基板の製造方法 | |
| JPH04119655A (ja) | プリント配線板 | |
| JP3325410B2 (ja) | 半導体装置の製造方法 | |
| KR100515101B1 (ko) | 반도체패키지의 제조 방법 및 그 반도체패키지 | |
| JP2700257B2 (ja) | 配線基板付きリードフレームとその製造方法 | |
| KR100723211B1 (ko) | 집적회로 칩 패키징 방법 | |
| JPH033292A (ja) | 回路基板及びそれを用いたイメージセンサ | |
| JPH038390A (ja) | 電子部品搭載用基板の製造方法 | |
| JPH09270435A (ja) | 半導体装置の製造方法 | |
| JPS63110758A (ja) | 半導体搭載用基板 | |
| JP2000077433A (ja) | 半導体装置およびその製造方法 | |
| US6700184B1 (en) | Lead frame and semiconductor device having the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |