JPH0418703B2 - - Google Patents
Info
- Publication number
- JPH0418703B2 JPH0418703B2 JP61197049A JP19704986A JPH0418703B2 JP H0418703 B2 JPH0418703 B2 JP H0418703B2 JP 61197049 A JP61197049 A JP 61197049A JP 19704986 A JP19704986 A JP 19704986A JP H0418703 B2 JPH0418703 B2 JP H0418703B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- screen printing
- printing plate
- sealing frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007789 sealing Methods 0.000 claims description 41
- 238000007650 screen-printing Methods 0.000 claims description 33
- 229920005989 resin Polymers 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 26
- 239000004065 semiconductor Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 7
- 229920001187 thermosetting polymer Polymers 0.000 claims description 7
- 239000000839 emulsion Substances 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明はプリント配線基板のダイスに固着され
ワイヤボンデイングされた半導体素子を樹脂で封
止するに際し樹脂の流動を制止するためにプリン
ト配線基板に設ける封止枠の形成方法に関するも
のである。Detailed Description of the Invention [Industrial Application Field] The present invention is applied to a printed wiring board in order to prevent the flow of resin when sealing with resin a semiconductor element fixed to a die of a printed wiring board and wire bonded. The present invention relates to a method of forming a sealing frame to be provided.
［従来の技術］
プリント配線基板のダイスに固着されワイヤボ
ンデイングされた半導体素子は樹脂で被覆され保
護されている。これは機械的衝撃により半導体素
子が割れたり傷ついたりすることを防ぐと共に、
大気中に含まれる水分や腐食性ガスによるワイヤ
ボンデイング部分の腐食に基づく電気的接続不良
の発生を防止するためである。この樹脂による被
覆はダイスに固着され周囲の導体にワイヤボンデ
イングされた半導体素子の上に樹脂ペレツト又は
液状樹脂を載せて加熱し樹脂を半導体素子の上部
とその周囲に流動させてから固化することによつ
て行われる。この樹脂の被覆が十分な封止保護機
能を果すためには樹脂が所定の厚さで半導体素子
を覆つていなければならないが、流動化した樹脂
を制御して所定の厚さに固化せしめることは甚だ
困難である。[Prior Art] A semiconductor element fixed to a die of a printed wiring board and wire-bonded is protected by being covered with resin. This prevents semiconductor elements from being cracked or damaged by mechanical shock, and
This is to prevent electrical connection failures due to corrosion of the wire bonding portion due to moisture or corrosive gas contained in the atmosphere. This resin coating is achieved by placing resin pellets or liquid resin on top of the semiconductor element, which is fixed to the die and wire-bonded to the surrounding conductor, and heating it to cause the resin to flow over and around the semiconductor element, and then solidify. It is done by folding. In order for this resin coating to perform a sufficient sealing protection function, the resin must cover the semiconductor element with a predetermined thickness, but it is necessary to control the fluidized resin and solidify it to a predetermined thickness. is extremely difficult.
特開昭59−172791号に示す如く、プリント配線
基板上に固着された半導体素子を封止する樹脂の
厚さを制御するためと、流動化した樹脂が半導体
素子を囲む所望の範囲を越えて外部に流れること
を防止するために、半導体素子を固着しワイヤボ
ンデイングすべき場所を囲み、プリント配線基板
上にプラスチツク等の素材よりなる封止枠を取り
付けることが従来から知られている。 As shown in Japanese Patent Application Laid-Open No. 59-172791, in order to control the thickness of the resin that seals the semiconductor element fixed on the printed wiring board, and to prevent the fluidized resin from exceeding the desired area surrounding the semiconductor element. In order to prevent wire bonding from flowing outside, it has been known to attach a sealing frame made of a material such as plastic on a printed wiring board, surrounding the area where semiconductor elements are to be fixed and wire bonded.
又この封止枠をスクリーン印刷により形成する
方法が特開昭57−106058号公報で提案されてい
る。 Furthermore, a method of forming this sealing frame by screen printing has been proposed in Japanese Patent Application Laid-Open No. 106058/1983.
［発明が解決しようとする問題点］
この封止枠をプラスチツク等の原板から切り抜
きプリント配線基板上の所定の場所に接着剤で張
り付ける方法は小さな封止枠を切り抜き所定の場
所に１つづつ正しく接着しなければならないので
手間がかかり、多数のプリント配線基板を多量生
産する場合において生産性の向上を阻害する原因
の一つとなつている。[Problems to be Solved by the Invention] The method of cutting out the sealing frame from a base plate such as plastic and pasting it on a predetermined place on the printed wiring board with adhesive is to cut out small sealing frames and place them one by one in a predetermined place. Since it has to be properly bonded, it is time-consuming and is one of the causes of hindering productivity improvement when mass-producing a large number of printed wiring boards.
又この封止枠をスクリーン印刷により形成する
従来の方法は、封止枠に必要程度の高さを与える
ためにはスクリーン印刷を何回も繰り返し積層す
る方法をとらねばならず、このため生産性が悪い
と共に正確な形態の封止枠を形成することが難し
いという問題があつた。 In addition, in the conventional method of forming this sealing frame by screen printing, in order to give the sealing frame the necessary height, it is necessary to repeat the screen printing many times and stack it, which reduces productivity. There were problems in that it was difficult to form a sealing frame with an accurate shape.
本発明は上記従来の方法に比べて手間が省け生
産性を向上し得ると共に正確な形状をもつたプリ
ント配線基板の封止枠の形成方法を提供すること
を目的とするものである。 It is an object of the present invention to provide a method for forming a sealing frame for a printed wiring board that can save labor and improve productivity compared to the above-mentioned conventional methods and has an accurate shape.
［問題点を解決するための手段］
上記目的を達成するために本発明によれば半導
体素子を搭載すべき場所とその周囲の該素子をワ
イヤボンデイングすべき導体部分の存在する場所
とを含む区域を残してソルダーレジストで被覆さ
れたプリント配線基板において、前記区域の外線
にほぼ合致する内縁を有し該内縁から外方に所定
の幅をもつ型開口の形成された下面に厚さ0.3mm
以上の乳剤層を有するスクリーン印刷版を用意
し、前記プリント配線基板の上に前記スクリーン
印刷版を両者の間に間隔をあけて前記開口の内縁
が前記区域の外縁にほぼ合致するよにして重ね、
前記スクリーン印刷版の開口の中に熱硬化性樹脂
のインクを充填し、前記スクリーン印刷版を前記
乳剤層が前記プリント配線基板に接するまで下方
に押し付け前記開口内の熱硬化性樹脂のインクを
前記プリント配線基板のソルダーレジストの上に
一度に転写印刷し、前記印刷された樹脂を熱硬化
させ厚さ0.2mm以上の封止枠を形成することを特
徴とするプリント配線基板の封止枠を形成方法が
提供される。[Means for Solving the Problems] In order to achieve the above object, the present invention provides an area including a place where a semiconductor element is to be mounted and a place around the place where a conductor part to which the element is to be wire-bonded is present. In the printed wiring board which is covered with a solder resist except for the area, a mold opening with a thickness of 0.3 mm is formed on the lower surface of the printed wiring board, which has an inner edge that almost matches the outer line of the area and has a predetermined width outward from the inner edge.
A screen printing plate having the above emulsion layer is prepared, and the screen printing plate is stacked on the printed wiring board with a gap between the two so that the inner edge of the opening almost matches the outer edge of the area. ,
The openings of the screen printing plate are filled with thermosetting resin ink, and the screen printing plate is pressed down until the emulsion layer contacts the printed wiring board. Forming a sealing frame for a printed wiring board characterized by transferring and printing on the solder resist of the printed wiring board at one time and thermally curing the printed resin to form a sealing frame with a thickness of 0.2 mm or more. A method is provided.
［作用］
本発明の方法は熱硬化性樹脂のインクをスクリ
ーン印刷版上に塗り付け更にスキージによりスク
リーン印刷版をプリント配線基板に押し付けなが
らこすることにより封止枠をスクリーン印刷版の
型開口を通して半導体素子を搭載ワイヤボンデイ
ングずべき区域を囲むプリント配線基板のソルダ
ーレジストの上に印刷するようにしたので、封止
枠の形状の型開口を形成したスクリーン印刷版を
一旦製作すれば、封止枠の形成は次々と印刷によ
りなされるので極めて簡単である。特に通常プリ
ント配線基板は一枚の基板に多数のプリント配線
を施した後個々のプリント配線基板に切断する方
法で製作されるが、スクリーン印刷版に多数の型
開口を形成し切断前の多数のプリント配線の各々
に一度に封止枠を印刷することによつて大幅に生
産性を向上せしめることができる。[Function] The method of the present invention is to apply a thermosetting resin ink onto a screen printing plate, and then rub the screen printing plate with a squeegee while pressing it against the printed wiring board, thereby passing the sealing frame through the mold opening of the screen printing plate. Since the printing is carried out on the solder resist of the printed wiring board surrounding the area where the semiconductor element is mounted and wire bonding is to be performed, once a screen printing plate with a mold opening in the shape of the sealing frame is manufactured, the sealing frame can be printed. is extremely easy to form because it is done by printing one after another. In particular, printed wiring boards are normally manufactured by placing a large number of printed wirings on a single board and then cutting them into individual printed wiring boards. By printing the sealing frame on each printed wiring at once, productivity can be greatly improved.
［実施例］
第１図は半導体素子を搭載したプリント配線基
板の概要を示す断面図で、半導体素子５は本発明
により形成された封止枠７で囲まれた凹所内に載
置され、樹脂８で被覆し保護されている。絶縁基
板１はガラス−エポキシ樹脂、ガラス−シリコン
樹脂等で形成され、その上面にエツチングにより
形成された導体パターン２とダイスボンデイング
部３とを有する。半導体素子５はダイスボンデイ
ング部３の上に載置接着され、ワイヤ６により導
体パターンの一部２′に電気的に接続される。[Example] FIG. 1 is a cross-sectional view showing an outline of a printed wiring board on which a semiconductor element is mounted, in which a semiconductor element 5 is placed in a recess surrounded by a sealing frame 7 formed according to the present invention, and a resin 8 and protected. The insulating substrate 1 is made of glass-epoxy resin, glass-silicon resin, etc., and has a conductor pattern 2 and a die bonding portion 3 formed by etching on its upper surface. The semiconductor element 5 is placed and bonded on the die bonding part 3 and electrically connected to a portion 2' of the conductor pattern by a wire 6.
第２図は封止枠７を形成する前のプリント配線
基板の概要を示す断面図で、導体パターン２はワ
イヤ６により半導体素子と接続される部分２′を
除きスクリーン印刷されたソルダーレジスト４の
被膜で保護されている。封止枠７はエポキシ樹脂
等の熱硬化性樹脂よりなり、第３図に示す如くソ
ルダーレジスト４の内縁に沿つてソルダーレジス
ト４の上に形成される。なお半導体素子は通常方
形をなしており、これに従つてソルダーレジスト
４の内縁は正方形となつている。 FIG. 2 is a cross-sectional view showing the outline of the printed wiring board before the sealing frame 7 is formed, and the conductor pattern 2 is made of a screen-printed solder resist 4 except for the portion 2' connected to the semiconductor element by the wire 6. protected by a coating. The sealing frame 7 is made of thermosetting resin such as epoxy resin, and is formed on the solder resist 4 along the inner edge of the solder resist 4 as shown in FIG. Note that semiconductor elements are usually rectangular, and accordingly, the inner edge of the solder resist 4 is square.
本発明は封止枠７をスクリーン印刷により形成
することを特徴とするものである。第４図は本発
明に使用されるスクリーン印刷版９を簡略化して
示す平面図で、図には封止枠７の平面形状に合致
する４個の型開口１０を示しているが、実際には
通常50個以上の型開口が形成される。スクリーン
印刷版９は第５図に示す如く４弗化エチレンの布
よりなるスクリーン１１の下面に光硬化樹脂より
なる乳剤層１２を印刷した型膜を板枠１３に展張
した構造をしており、型膜には複数個の上述の型
開口１０がエツチングにより形成されている。 The present invention is characterized in that the sealing frame 7 is formed by screen printing. FIG. 4 is a simplified plan view of the screen printing plate 9 used in the present invention, and the figure shows four mold openings 10 that match the planar shape of the sealing frame 7. Typically, more than 50 mold openings are formed. As shown in FIG. 5, the screen printing plate 9 has a structure in which a mold film, in which an emulsion layer 12 made of a photocurable resin is printed on the lower surface of a screen 11 made of a cloth of tetrafluoroethylene, is spread over a plate frame 13. A plurality of the above-mentioned mold openings 10 are formed in the mold film by etching.
以上の構造のスクリーン印刷版９はプリント配
線基板１の上に間隔ｌを置き、型開口１０上を封
止枠を形成すべき場所に合せて固定され、その上
に第６ａ図に示す如くエポキシ樹脂のインク１４
を載せドクターナイフ１５で伸ばすと、インク１
４は第６ｂ図に示す如くスクリーン印刷版９の型
開口１０の中に押し込まれる。次に第６ｃ図に示
す如くスキージ１６を使用してスクリーン印刷版
９を下方に撓ませプリント配線基板１の上に押し
付けスキージ１６をスクリーン印刷版９の上面に
沿つて横に動かすと、型開口１０の中に押し込ま
れていたインク１４は、型開口１０がプリント配
線基板１と接触するとき、同基板に付着し、更に
第６ｄ図に示す如くスキージ１６が横に動いてス
クリーン印刷版９自身の張力により型開口１０が
プリント配線基板１から離れて上昇するときイン
キ１４は基板１上に残される。こうしてプリント
配線基板１上所定の場所に未硬化のエポキシ樹脂
よりなる封止枠７′が形成される。最後に未硬化
のエポキシ樹脂を例えば130℃で30分間加熱する
ことにより熱硬化させ、第３図に示す如き封止枠
７を備えたプリント配線基板が完成される。 The screen printing plate 9 having the above structure is fixed on the printed wiring board 1 at a distance l, with the mold opening 10 aligned with the place where the sealing frame is to be formed. resin ink 14
Place the ink and stretch it with the doctor knife 15, then ink 1
4 is pushed into the mold opening 10 of the screen printing plate 9 as shown in FIG. 6b. Next, as shown in FIG. 6c, the screen printing plate 9 is bent downward using the squeegee 16 and pressed onto the printed wiring board 1, and the squeegee 16 is moved laterally along the top surface of the screen printing plate 9 to open the mold. When the mold opening 10 comes into contact with the printed wiring board 1, the ink 14 that had been forced into the mold opening 10 adheres to the printed wiring board 1, and as the squeegee 16 moves laterally as shown in FIG. When the mold opening 10 is lifted away from the printed wiring board 1 due to the tension, the ink 14 is left on the board 1. In this way, a sealing frame 7' made of uncured epoxy resin is formed at a predetermined location on the printed wiring board 1. Finally, the uncured epoxy resin is thermally cured by heating it at, for example, 130° C. for 30 minutes, thereby completing a printed wiring board having a sealing frame 7 as shown in FIG.
上記封止枠のスクリーン印刷の良否には封止枠
７の寸法とスクリーン印刷版９とプリント配線基
板１の間隔ｌとの関係が微妙に影響する。本発明
者のテストによれば、粘度を350ポイズに調整し
たエポキシ樹脂のインクを使用し、高さ0.2mm、
幅0.8mmで外縁の一辺が15mmの正方形の封止枠７
を形成する場合について、この封止枠の寸法に対
応する型開口１０を50個備え、乳剤層１２の厚さ
が0.3〜0.4mmで板枠１３の一辺が760mmである正
方形のスクリーン印刷版９を使用したとき、間隔
ｌを５mmとすることによつて良好な結果が得られ
る。 The quality of the screen printing of the sealing frame is subtly influenced by the relationship between the dimensions of the sealing frame 7 and the distance l between the screen printing plate 9 and the printed wiring board 1. According to the inventor's tests, epoxy resin ink with a viscosity of 350 poise was used, and the height was 0.2 mm.
Square sealing frame 7 with a width of 0.8 mm and an outer edge of 15 mm on each side
For the case of forming a square screen printing plate 9, which has 50 mold openings 10 corresponding to the dimensions of the sealing frame, the emulsion layer 12 has a thickness of 0.3 to 0.4 mm, and the plate frame 13 has a side of 760 mm. When using , good results can be obtained by setting the distance l to 5 mm.
［発明の効果］
従来封止枠はプラスチツク板から切抜かれたも
を１つ１つプリント配線基板の所定の場所に接着
剤を使用して貼り付けるか、スクリーン印刷を何
度も繰返して所定の高さを与えるようにしていた
ので非常に手間がかかつていたが、本発明はプリ
ント配線基板の所定の場所に１度のスクリーン印
刷により封止枠を形成するので非常に作業が簡単
になり、特にプリント配線基板は通常１枚の大き
な基板に多数の配線を一度にプリントしてから
個々のプリント配線基板に切断する方法で製作さ
れるので、この場合スクリーン印刷版に多数の型
開口を設け、一度のスクリーン印刷で多数のプリ
ント配線基板の各々に同時に封止枠を印刷形成で
きるので封止枠の形成作業は極めて能率化され
る。[Effects of the Invention] Conventionally, sealing frames were cut out from a plastic board and pasted one by one onto a predetermined location on a printed wiring board using adhesive, or by repeating screen printing many times to create a predetermined shape. It was very time-consuming to give the height, but with the present invention, the sealing frame is formed at a predetermined location on the printed wiring board by one screen printing, making the work extremely easy. In particular, printed wiring boards are usually manufactured by printing a large number of wiring lines on one large board at once and then cutting them into individual printed wiring boards. Since the sealing frame can be printed and formed on each of a large number of printed wiring boards at the same time by one screen printing, the work of forming the sealing frame is extremely streamlined.
第１図は半導体素子を搭載し樹脂で被覆したプ
リント配線基板の概要を示す断面図である。第２
図は封止枠を形成する前のプリント配線基板の概
要を示す断面図である。第３図は封止枠が形成さ
れた後のプリント配線基板の概要を示す断面図で
ある。第４図は本発明により封止枠をスクリーン
印刷するために使用されるスクリーン印刷版を簡
略化して示す平面図である。第５図はスクリーン
印刷版とプリント配線基板の配置関係を示す断面
図である。第６ａ図、第６ｂ図、第６ｃ図および
第６ｄ図は熱硬化性樹脂のインクがプリント配線
基板上に印刷されるプロセスを示す概要図であ
る。
１……基板、２……導体パターン、３……ダイ
スボンデイング部、４……ソルダーレジスト、５
……半導体素子、６……ワイヤ、７……封止枠、
８……樹脂、９……スクリーン印刷版、１０……
型開口。
FIG. 1 is a cross-sectional view schematically showing a printed wiring board on which a semiconductor element is mounted and coated with resin. Second
The figure is a sectional view showing an outline of the printed wiring board before forming the sealing frame. FIG. 3 is a cross-sectional view schematically showing the printed wiring board after the sealing frame is formed. FIG. 4 is a simplified plan view of a screen printing plate used for screen printing a sealing frame according to the present invention. FIG. 5 is a sectional view showing the arrangement relationship between the screen printing plate and the printed wiring board. Figures 6a, 6b, 6c and 6d are schematic diagrams showing the process by which thermosetting resin ink is printed on a printed wiring board. DESCRIPTION OF SYMBOLS 1...Substrate, 2...Conductor pattern, 3...Dice bonding part, 4...Solder resist, 5
... Semiconductor element, 6 ... Wire, 7 ... Sealing frame,
8...Resin, 9...Screen printing plate, 10...
Mold opening.
Claims (1)
素子をワイヤボンデイングすべき導体部分の存在
する場所とを含む区域を残してソルダーレジスト
で被覆されたプリント配線基板において、前記区
域の外線にほぼ合致する内縁を有し該内縁から外
方に所定の幅をもつ型開口の形成された下面に厚
さ0.3mm以上の乳剤層を有するスクリーン印刷版
を用意し、前記プリント配線基板の上に前記スク
リーン印刷版を両者の間に間隔をあけて前記開口
の内縁が前記区域の外縁にほぼ合致するようにし
て重ね、前記スクリーン印刷版の開口の中に熱硬
化性樹脂のインクを充填し、前記スクリーン印刷
版を前記乳剤層が前記プリント配線基板に接する
まで下方に押し付け前記開口内の熱硬化性樹脂の
インクを前記プリント配線基板のソルダーレジス
トの上に一度に転写印刷し、前記印刷された樹脂
を熱硬化させ厚さ0.2mm以上の封止枠を形成する
ことを特徴とするプリント配線基板の封止枠の形
成方法。 ２ 複数の前記開口の形成されたスクリーン印刷
版を使用し、一度に複数個の封止枠を形成するこ
とを特徴とする特許請求の範囲第１項記載のプリ
ント配線基板の封止枠の形成方法。[Scope of Claims] 1. In a printed wiring board covered with a solder resist, leaving an area including a place where a semiconductor element is to be mounted and a place surrounding the area including a place where a conductor part to which the element is to be wire bonded exists, A screen printing plate having an emulsion layer with a thickness of 0.3 mm or more on the lower surface having an inner edge that almost matches the outer line of the area and a mold opening having a predetermined width outward from the inner edge is prepared; The screen printing plate is stacked on top of the substrate with a gap between them so that the inner edge of the opening substantially matches the outer edge of the area, and a thermosetting resin ink is placed in the opening of the screen printing plate. pressing the screen printing plate downward until the emulsion layer comes into contact with the printed wiring board, transferring and printing the thermosetting resin ink in the opening onto the solder resist of the printed wiring board at once; A method for forming a sealing frame for a printed wiring board, the method comprising thermosetting the printed resin to form a sealing frame having a thickness of 0.2 mm or more. 2. Formation of a sealing frame for a printed wiring board according to claim 1, characterized in that a screen printing plate in which a plurality of the openings are formed is used to form a plurality of sealing frames at one time. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19704986A JPS6353955A (en) | 1986-08-25 | 1986-08-25 | Formation of sealing frame for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19704986A JPS6353955A (en) | 1986-08-25 | 1986-08-25 | Formation of sealing frame for printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6353955A JPS6353955A (en) | 1988-03-08 |
| JPH0418703B2 true JPH0418703B2 (en) | 1992-03-27 |
Family
ID=16367861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19704986A Granted JPS6353955A (en) | 1986-08-25 | 1986-08-25 | Formation of sealing frame for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6353955A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3135952C2 (en) | 1981-09-10 | 1983-11-17 | Siemens AG, 1000 Berlin und 8000 München | Push-pull output circuit for a logic element in current switch technology. |
| US6067709A (en) * | 1996-02-23 | 2000-05-30 | Mpm Corporation | Applying encapsulating material to substrates |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57106058A (en) * | 1980-12-23 | 1982-07-01 | Nitto Electric Ind Co Ltd | Manufacture of frame body |
-
1986
- 1986-08-25 JP JP19704986A patent/JPS6353955A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57106058A (en) * | 1980-12-23 | 1982-07-01 | Nitto Electric Ind Co Ltd | Manufacture of frame body |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6353955A (en) | 1988-03-08 |
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