JP3611463B2 - Manufacturing method of electronic parts - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component manufacturing method for manufacturing an individual electronic component by dividing an aggregate substrate on which a plurality of semiconductor chips are mounted.
[0002]
[Prior art]
A conventional example of a method of manufacturing an individual electronic component by mounting and sealing a semiconductor chip on an aggregate substrate having a plurality of through holes for end face electrodes is shown below.
[0003]
FIG. 6 shows a conventional example of the first manufacturing method. Through holes 62 for end face electrodes are formed in the collective substrate 61. After the semiconductor chip 64 is mounted at each mounting position 63, the sealing resin material 65 is individually supplied to each semiconductor chip 64. At this time, if the sealing resin 65 enters the through hole 62 and adheres to the surface thereof, the soldering quality of the end face electrode 67 is adversely affected. Therefore, the sealing resin 65 is sealed so that the sealing resin 65 does not enter the through hole 62. It is necessary to control the supply amount of the stopping resin material. For this purpose, a sealing resin is supplied by a printing method, or a sealing material packed in a cylinder is individually potted by dispensing. After the resin material is cured, the resin material is cut along a dotted line 66 to form a device form of the individual electronic component 68.
[0004]
FIG. 7 shows a conventional example of the second manufacturing method. The collective substrate 71 on which the semiconductor chip 74 is mounted at each mounting position 73 is cut into individual electronic components 76 along the dotted line 75, and the portion that was the through hole 72 before the cut becomes the end face electrode 77. The sealing method is a method of attaching a metal box-type cover 78 to the cut individual electronic component 76 and covering the upper surface thereof, that is, a sealing method called CAN sealing.
[0005]
[Problems to be solved by the invention]
In recent years, downsizing of electronic devices has been demanded, and demands for device productivity such as high quality / high performance, production tact increase, and cost reduction have become accelerating. The above-described conventional example 1 is a method of supplying the sealing resin individually to each semiconductor chip so that the sealing resin does not enter into the through hole. Therefore, there is a restriction on the mounting pitch of the semiconductor chip, that is, the device size, and the stability of the supply amount cannot be ensured unless the individual piece size is about 1 cm square or larger. In addition, the individual potting method has a problem that the tact becomes long in addition to the size restriction.
[0006]
Even in the CAN sealing of Conventional Example 2, there is a restriction on the size, which is inappropriate for manufacturing a microminiature device having a piece size of 3 mm square or less, and has left a problem of high cost. An object of the present invention is to mount a semiconductor chip on a collective substrate and package it with a resin, and to manufacture an ultra-small electronic device whose device size of an individual electronic component is 3 mm square or less with high quality, low cost, and short tact. And
[0007]
[Means for Solving the Problems]
In order to solve this problem, the present invention provides an anisotropic conductive material in which a main component is a thermosetting resin material and contains conductive particles on a collective substrate having a plurality of through holes having conductivity. A film is pasted to close the opening of the through hole, and then a plurality of semiconductor chips are mounted on the anisotropic conductive film, and then the plurality of semiconductor chips are thermocompression bonded, and then a sealing resin layer is formed on the collective substrate after sealing the semiconductor chip and the substrate surface to form the Suruho by dividing the aggregate board along the Le, characterized and Turkey to produce the end surface electrode is formed in the through hole portion pieces electronic component And
[0008]
The present invention prevents the sealing resin from penetrating into the through-hole by the anisotropic conductive film, can protect the end face electrode, and can also shorten the production tact and improve the productivity.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Next, an embodiment of the present invention will be described with reference to FIGS.
[0010]
4 shows the appearance and cross section of the collective substrate 1. FIG. 4 (a) is a plan view of the surface of the collective substrate 1, and FIG. 4 (b) is a cross section taken along the alternate long and short dash line 16 in FIG. 4 (a). The figure is shown. The collective substrate 1 is composed of a wiring pattern 5 and a through hole 2 on the surface, and a semiconductor chip is bonded to a portion indicated by a dotted line 18. The wiring pattern 5 is a two-dimensional repetition of the same pattern in the plane of the collective substrate 1, and becomes an individual electronic component by cutting the dotted line 17 after mounting and sealing a semiconductor chip. Therefore, in the semiconductor chip mounting process, the substrate is a so-called collective substrate 1 having a structure in which the individual pieces are connected to each other. Further, the through-holes 2 are regularly formed in the collective substrate 1 and the inside thereof is hollow, but the inner wall thereof is provided with metal plating 3 such as gold, so that the semiconductor chip joints and wirings are provided. The electrode 5a on the pattern 5 is electrically connected. After being separated into pieces, the metal plating 3 on the inner wall of the through hole 2 becomes a soldering electrode as a device, that is, an end face electrode.
[0011]
FIG. 1 shows a series of processes from mounting of semiconductor chips on the collective substrate shown in FIG. 4 to dividing into individual pieces. The process shown in FIG. 1A is a process of attaching the bonding resin sheet 4 on the collective substrate 1. As the bonding resin sheet 4, it is preferable to use an anisotropic conductive film (ACF) whose main component is a thermosetting resin material and contains conductive particles, but the number of semiconductor chips to be mounted and the flatness of the substrate are preferable. Depending on the degree, even a bonding resin sheet made of a thermosetting resin material that does not contain conductive particles can be electrically connected between the bumps 7 and the electrodes 5a of the wiring pattern 5 described later . At this time, the bonding resin sheet 4 is affixed in a state where the wiring patterns 5 and the through holes 2 for the plurality of pieces are simultaneously covered. In order to affix the bonding resin sheet 4, the bonding resin sheet 4 is pressure-bonded to the substrate at a temperature of about 100 ° C. Here, in the present invention, since the opening of the through hole 2 is blocked by the bonding resin sheet 4, the sealing resin does not enter the through hole 2 when the sealing material is supplied later, and the end face electrode 3 is formed. There is an advantage that the quality of the device can be ensured without contamination.
[0012]
Next, the process shown in FIG. 1B is a process for mounting the semiconductor chip 6, and a dedicated mounting machine is used. The bumps 7 formed on the electrodes of the semiconductor chip 6 and the electrodes 5a on the substrate facing the bumps 7 are positioned so as to face each other, and with respect to a plurality of mounting positions in the region where the bonding resin sheet 4 is attached. Wear one by one.
[0013]
Next, the process shown in FIG. 1C is a thermocompression bonding process, and a perspective view thereof is shown in FIG. A load 10 is simultaneously applied from above the plurality of semiconductor chips 6 by the heating tool 8 having a flat surface and heated to about 200 ° C., and pressed against the collective substrate 1 for about 20 seconds. As a result, the bump 7 and the electrode 5a of the wiring pattern 5 are electrically connected to each other through the conductive particles in the bonding resin sheet 4, and at the same time, the bonding resin sheet 4 is cured and the bump 7 and the electrode 5a are conductive. It is fixed as it is, and it will be in the state shown in FIG.1 (d). In the present invention, since all the semiconductor chips 6 mounted two-dimensionally are heat-bonded at the same time, the mounting tact for each semiconductor chip 6 is a value obtained by dividing the pressure-bonding time by the number of chips. It is very short compared. For example, in the case of 10 × 10 = 100 simultaneous crimping shown in FIG. 2, when converted to one semiconductor chip, the tact time is 20 seconds ÷ 100 = 0.2 seconds. Further, at the time of crimping, it is desirable to sandwich an elastic sheet 14 such as Teflon between the heating tool 8 and the semiconductor chip 6 as shown in FIG. 3, so that each of the bump height, the substrate pattern thickness, and the semiconductor chip thickness can be obtained. There is an effect of absorbing the variation and reducing the bonding failure. As shown in FIG. 3, if the elastic sheet 14 is wound on both sides of the tool, the used part of the sheet can be replaced.
[0014]
Next, FIG. 1E shows a sealing process for the purpose of packaging and protecting the semiconductor chip 6. The sealing resin 11 is a thermosetting epoxy resin and is in the form of a paste at the supply stage. In order to make the finished height uniform, as shown in FIG. A supply method by a printing method in which the sealing resin 11 is scraped off at 20 is preferable. Since all the semiconductor chips 6 that have been mounted are supplied simultaneously in a lump, the supply tact per semiconductor chip 6 is very short compared to individual supply. For example, in the case of individual potting, about 1 second is required for each semiconductor chip, whereas in the case of the collective simultaneous supply, 0.003 seconds per chip, which is 3 digits shorter. Thereafter, the sealing resin 11 is cured by heating in a curing furnace. As a curing condition, for example, after heating at 100 ° C. for 2 hours, heating is performed at 150 ° C. for 1 hour.
[0015]
Last step As shown in FIG. 1 (f), the portion of the dotted line 12 is cut in a dicing apparatus and divided into individual pieces.
[0016]
Finally, as shown in FIG. 1G, the semiconductor chip 6 is protected by the sealing resin 11, and the high-quality individual electronic component 9 including the end surface electrode 3 that is not contaminated by the sealing resin 11 is completed. . The size of the individual electronic component 9 is 1.3 mm × 1.3 mm square and the thickness is 0.5 mm. The size is about 1/10 compared to the conventional product, and the miniaturization can be realized. In addition, this miniaturization can significantly reduce the wiring length of the substrate, and the electrical characteristics as a device can be improved as compared with a package of a conventional size (3 × 3 mm □ or more). As an example, the insertion loss can be reduced from 0.5 dB to 0.4 dB compared to the conventional product.
[0017]
In the conventional sealing example shown in FIG. 6, since the flatness of the top surface of the sealing resin and the form of the individual electronic parts are not uniform, problems such as suction errors occur when mounting the individual electronic parts. There was a productivity problem. On the other hand, in the present invention, the upper surface of the sealing resin coated on the individual electronic component is flat, the height of the individual electronic component is constant, and the shape is uniform. When mounted on top, the mounting rate on the mounting machine is almost 100%, and there is also an advantage that there are no problems during mounting due to recognition errors or suction errors.
[0018]
【The invention's effect】
As described above, according to the present invention, in the manufacture of a small electronic component with an end face electrode, the end face electrode is manufactured with high quality without being contaminated with the sealing resin, and the manufacturing tact time is shortened and the productivity is improved. Advantageous manufacturing effects can be obtained. At the same time, there is an advantage that the shape of the individual electronic component is stable and the mounting rate in the mounting machine can be improved.
[Brief description of the drawings]
1A to 1G are cross-sectional views illustrating a semiconductor chip mounting and sealing process according to an embodiment of the present invention.
FIG. 2 is a perspective view showing a thermocompression bonding process.
FIG. 3 is a cross-sectional view showing a thermocompression bonding process with an elastic sheet sandwiched therebetween.
4A and 4B show a structure of an aggregate substrate, in which FIG. 4A is a plan view and FIG. 4B is a cross-sectional view thereof.
FIG. 5 is a cross-sectional view showing a sealing resin supply step by printing.
FIG. 6 is a cross-sectional view showing a conventional manufacturing process.
FIG. 7 is a cross-sectional view showing a conventional manufacturing process.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Collective substrate 2 Through-hole 3 End face electrode 4 Resin sheet | seat 6 for joining 6 Semiconductor chip 8 Heating tool 9 Piece electronic component 11 Sealing resin 14 Elastic sheet

Claims (3)

On an aggregate substrate having a plurality of conductive through holes, an anisotropic conductive film whose main component is a thermosetting resin material and containing conductive particles is pasted to open the through holes. Next, after mounting a plurality of semiconductor chips on the anisotropic conductive film, the plurality of semiconductor chips are thermocompression bonded, and then a sealing resin layer is formed on the collective substrate to seal the semiconductor chip and the substrate surface. After stopping, the collective substrate is divided along the through hole, and an individual electronic component having an end face electrode formed in the through hole portion is manufactured. A semiconductor chip mounting location is two-dimensionally arranged on the surface of a collective substrate having conductive through-holes around it, and the main component is a thermosetting resin material containing conductive particles. Affixing a bonding resin sheet consisting of an anisotropic conductive film or a film of a thermosetting resin alone containing no conductive particles, and mounting a semiconductor chip on a predetermined mounting portion from the bonding resin sheet, The bonding and electrical connection between the plurality of semiconductor chips and the collective substrate are completed by simultaneously heat-pressing the plurality of mounted semiconductor chips from above with a heating tool. Then, the paste-like encapsulating resin material covers the surfaces of the semiconductor chip and the bonding resin sheet, and is supplied to the plurality of bonded semiconductor chips. Does not enter inside the hole, it said after the sealing resin material is cured, method of manufacturing an electronic component, characterized in that to obtain a cut singulated electronic components into individual pieces. 3. The method of manufacturing an electronic component according to claim 2, wherein an elastic sheet is sandwiched between the heating tool and the semiconductor chip when heat-pressing with the heating tool.

Images