JPS57106058A - Manufacture of frame body - Google Patents

Manufacture of frame body

Info

Publication number
JPS57106058A
JPS57106058A JP18327880A JP18327880A JPS57106058A JP S57106058 A JPS57106058 A JP S57106058A JP 18327880 A JP18327880 A JP 18327880A JP 18327880 A JP18327880 A JP 18327880A JP S57106058 A JPS57106058 A JP S57106058A
Authority
JP
Japan
Prior art keywords
frame body
screen
printing
resin
low cost
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18327880A
Other languages
Japanese (ja)
Inventor
Kazuo Iko
Michio Mihara
Katsumi Shimada
Takashi Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP18327880A priority Critical patent/JPS57106058A/en
Publication of JPS57106058A publication Critical patent/JPS57106058A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

PURPOSE:To obtain a frame body at low cost even when the shape thereof is complicated by a method wherein the frame body is formed by the screen printing method. CONSTITUTION:A heat resistive thermosetting resin which is not melted or deformed at the temperature when sealing of semiconductor element is to be performed is used for printing ink. A thermosetting resin which is solid at the normal temperature is used for an element sealing resin. The frame body is printed by screen printing, and thickness thereof is regulated according to the number of times of printing, viscosity of the resin, and meshes of a screen, and thickness is made normally as about 10-50mu. By this method, the frame body can be formed continuously, to make breadth of the frame body as narrow and to make the frame body in a complicated shape is enabled at the stage when the mask of screen is to be designed, and the frame body can be obtained at low cost.
JP18327880A 1980-12-23 1980-12-23 Manufacture of frame body Pending JPS57106058A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18327880A JPS57106058A (en) 1980-12-23 1980-12-23 Manufacture of frame body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18327880A JPS57106058A (en) 1980-12-23 1980-12-23 Manufacture of frame body

Publications (1)

Publication Number Publication Date
JPS57106058A true JPS57106058A (en) 1982-07-01

Family

ID=16132853

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18327880A Pending JPS57106058A (en) 1980-12-23 1980-12-23 Manufacture of frame body

Country Status (1)

Country Link
JP (1) JPS57106058A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61184834A (en) * 1985-02-13 1986-08-18 Toshiba Chem Corp Manufacture of resin-molded semiconductor device
JPS6353955A (en) * 1986-08-25 1988-03-08 Asaka Denshi Kk Formation of sealing frame for printed circuit board
JPH02205389A (en) * 1989-02-03 1990-08-15 Nippon Retsuku Kk Forming of flow stopping frame of electric component sealing resin for surface mounting of electric circuit board
EP2184720B1 (en) * 2007-08-30 2019-05-08 Glory Ltd. Paper sheet processor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61184834A (en) * 1985-02-13 1986-08-18 Toshiba Chem Corp Manufacture of resin-molded semiconductor device
JPS6353955A (en) * 1986-08-25 1988-03-08 Asaka Denshi Kk Formation of sealing frame for printed circuit board
JPH0418703B2 (en) * 1986-08-25 1992-03-27 Asaka Denshi Kk
JPH02205389A (en) * 1989-02-03 1990-08-15 Nippon Retsuku Kk Forming of flow stopping frame of electric component sealing resin for surface mounting of electric circuit board
EP2184720B1 (en) * 2007-08-30 2019-05-08 Glory Ltd. Paper sheet processor

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