JPH0416940B2 - - Google Patents
Info
- Publication number
- JPH0416940B2 JPH0416940B2 JP59108214A JP10821484A JPH0416940B2 JP H0416940 B2 JPH0416940 B2 JP H0416940B2 JP 59108214 A JP59108214 A JP 59108214A JP 10821484 A JP10821484 A JP 10821484A JP H0416940 B2 JPH0416940 B2 JP H0416940B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin material
- pressurizing
- pot
- plunger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 88
- 229920005989 resin Polymers 0.000 claims description 88
- 239000000463 material Substances 0.000 claims description 39
- 238000000465 moulding Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 12
- 238000002844 melting Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000001721 transfer moulding Methods 0.000 claims description 5
- 230000000903 blocking effect Effects 0.000 claims description 4
- 230000000694 effects Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000004891 communication Methods 0.000 description 4
- 238000007599 discharging Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/462—Injection of preformed charges of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10821484A JPS60251635A (ja) | 1984-05-28 | 1984-05-28 | トランスフア−モ−ルド成形方法及びその成形用金型装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10821484A JPS60251635A (ja) | 1984-05-28 | 1984-05-28 | トランスフア−モ−ルド成形方法及びその成形用金型装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60251635A JPS60251635A (ja) | 1985-12-12 |
JPH0416940B2 true JPH0416940B2 (US20110009641A1-20110113-C00185.png) | 1992-03-25 |
Family
ID=14478917
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10821484A Granted JPS60251635A (ja) | 1984-05-28 | 1984-05-28 | トランスフア−モ−ルド成形方法及びその成形用金型装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60251635A (US20110009641A1-20110113-C00185.png) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4826931A (en) * | 1986-10-09 | 1989-05-02 | Mitsubishi Denki Kabushiki Kaisha | Tablet for resin-molding semiconductor devices |
JPH0449016A (ja) * | 1990-06-18 | 1992-02-18 | Ngk Insulators Ltd | トランスファ成形方法及びその装置 |
GB2252746B (en) * | 1991-01-17 | 1995-07-12 | Towa Corp | A method of molding resin to seal an electronic part on a lead frame and apparatus therefor |
US5275546A (en) * | 1991-12-30 | 1994-01-04 | Fierkens Richard H J | Plastic encapsulation apparatus for an integrated circuit lead frame and method therefor |
JP2524955B2 (ja) * | 1993-04-22 | 1996-08-14 | トーワ株式会社 | 電子部品の樹脂封止成形方法及び装置 |
TW434131B (en) * | 1996-07-25 | 2001-05-16 | Matsushita Electric Works Ltd | Thermoset resin molding apparatus |
WO2005078807A1 (ja) * | 2004-02-17 | 2005-08-25 | Matsushita Electric Industrial Co., Ltd. | 光電変換プラグとそれを用いた光電変換モジュール、及びその光電変換プラグの製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5986229A (ja) * | 1982-11-09 | 1984-05-18 | Toshiba Corp | 半導体樹脂封止型 |
-
1984
- 1984-05-28 JP JP10821484A patent/JPS60251635A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5986229A (ja) * | 1982-11-09 | 1984-05-18 | Toshiba Corp | 半導体樹脂封止型 |
Also Published As
Publication number | Publication date |
---|---|
JPS60251635A (ja) | 1985-12-12 |