JPH0416425Y2 - - Google Patents

Info

Publication number
JPH0416425Y2
JPH0416425Y2 JP1988046333U JP4633388U JPH0416425Y2 JP H0416425 Y2 JPH0416425 Y2 JP H0416425Y2 JP 1988046333 U JP1988046333 U JP 1988046333U JP 4633388 U JP4633388 U JP 4633388U JP H0416425 Y2 JPH0416425 Y2 JP H0416425Y2
Authority
JP
Japan
Prior art keywords
bump electrode
pattern
electrode
length measurement
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1988046333U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01157433U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988046333U priority Critical patent/JPH0416425Y2/ja
Publication of JPH01157433U publication Critical patent/JPH01157433U/ja
Application granted granted Critical
Publication of JPH0416425Y2 publication Critical patent/JPH0416425Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP1988046333U 1988-04-06 1988-04-06 Expired JPH0416425Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988046333U JPH0416425Y2 (enExample) 1988-04-06 1988-04-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988046333U JPH0416425Y2 (enExample) 1988-04-06 1988-04-06

Publications (2)

Publication Number Publication Date
JPH01157433U JPH01157433U (enExample) 1989-10-30
JPH0416425Y2 true JPH0416425Y2 (enExample) 1992-04-13

Family

ID=31272604

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988046333U Expired JPH0416425Y2 (enExample) 1988-04-06 1988-04-06

Country Status (1)

Country Link
JP (1) JPH0416425Y2 (enExample)

Also Published As

Publication number Publication date
JPH01157433U (enExample) 1989-10-30

Similar Documents

Publication Publication Date Title
US6590274B2 (en) Semiconductor wafer and method for manufacturing semiconductor devices
US4446477A (en) Multichip thin film module
US8067950B2 (en) Semiconductor device including chip
US7446029B2 (en) Semiconductor element and manufacturing method thereof
JPH09330934A (ja) 半導体装置及びその製造方法
US20080128893A1 (en) Semiconductor package having semiconductor device featuring externally-accessible endless ring-shaped resistance circuit
TWI243416B (en) Semiconductor wafer, semiconductor chip and dicing method of a semiconductor wafer
US5463255A (en) Semiconductor integrated circuit device having an electrode pad including an extended wire bonding portion
JP2559977B2 (ja) バイアに係るクラックを除去する方法及び構造、並びに、半導体セラミックパッケージ基板。
JPH0416425Y2 (enExample)
JPH07122604A (ja) 半導体集積回路装置
JP2765567B2 (ja) 半導体装置
KR100350936B1 (ko) 반도체 장치
JPS62266842A (ja) 半導体装置及びその製造方法
JPH0922912A (ja) 半導体装置及びその製造方法
JPS5815251A (ja) 半導体装置
JPS6149452A (ja) 半導体素子
JP2008027929A (ja) 半導体装置、その製造方法および検査方法
JP2005064218A (ja) 半導体装置
JPH02168640A (ja) 異なる基板間の接続構造
JPH0786281A (ja) 半導体装置および半導体装置の製造方法
JPH02134857A (ja) 半導体装置
JPH03256395A (ja) 電子装置
JPS63283042A (ja) 半導体素子
JPH01286430A (ja) 半導体チップの実装方法