JPH0412676Y2 - - Google Patents

Info

Publication number
JPH0412676Y2
JPH0412676Y2 JP1985182883U JP18288385U JPH0412676Y2 JP H0412676 Y2 JPH0412676 Y2 JP H0412676Y2 JP 1985182883 U JP1985182883 U JP 1985182883U JP 18288385 U JP18288385 U JP 18288385U JP H0412676 Y2 JPH0412676 Y2 JP H0412676Y2
Authority
JP
Japan
Prior art keywords
sealing resin
resin
main surface
semiconductor device
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985182883U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6291443U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985182883U priority Critical patent/JPH0412676Y2/ja
Publication of JPS6291443U publication Critical patent/JPS6291443U/ja
Application granted granted Critical
Publication of JPH0412676Y2 publication Critical patent/JPH0412676Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1985182883U 1985-11-29 1985-11-29 Expired JPH0412676Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985182883U JPH0412676Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1985-11-29 1985-11-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985182883U JPH0412676Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1985-11-29 1985-11-29

Publications (2)

Publication Number Publication Date
JPS6291443U JPS6291443U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-06-11
JPH0412676Y2 true JPH0412676Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-03-26

Family

ID=31129097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985182883U Expired JPH0412676Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1985-11-29 1985-11-29

Country Status (1)

Country Link
JP (1) JPH0412676Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11244774B2 (en) 2018-05-25 2022-02-08 Koa Corporation Resistor

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56129747U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1980-02-28 1981-10-02
JPS59112951U (ja) * 1983-01-20 1984-07-30 サンケン電気株式会社 絶縁物封止半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11244774B2 (en) 2018-05-25 2022-02-08 Koa Corporation Resistor

Also Published As

Publication number Publication date
JPS6291443U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-06-11

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