JPH0410741B2 - - Google Patents

Info

Publication number
JPH0410741B2
JPH0410741B2 JP60243361A JP24336185A JPH0410741B2 JP H0410741 B2 JPH0410741 B2 JP H0410741B2 JP 60243361 A JP60243361 A JP 60243361A JP 24336185 A JP24336185 A JP 24336185A JP H0410741 B2 JPH0410741 B2 JP H0410741B2
Authority
JP
Japan
Prior art keywords
light
transparent resin
sealed
semiconductor device
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60243361A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62104057A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP60243361A priority Critical patent/JPS62104057A/ja
Publication of JPS62104057A publication Critical patent/JPS62104057A/ja
Publication of JPH0410741B2 publication Critical patent/JPH0410741B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
JP60243361A 1985-10-30 1985-10-30 透明樹脂封止半導体装置 Granted JPS62104057A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60243361A JPS62104057A (ja) 1985-10-30 1985-10-30 透明樹脂封止半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60243361A JPS62104057A (ja) 1985-10-30 1985-10-30 透明樹脂封止半導体装置

Publications (2)

Publication Number Publication Date
JPS62104057A JPS62104057A (ja) 1987-05-14
JPH0410741B2 true JPH0410741B2 (https=) 1992-02-26

Family

ID=17102694

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60243361A Granted JPS62104057A (ja) 1985-10-30 1985-10-30 透明樹脂封止半導体装置

Country Status (1)

Country Link
JP (1) JPS62104057A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11340257A (ja) * 1998-05-21 1999-12-10 Hamamatsu Photonics Kk 透明樹脂封止光半導体装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0750754B2 (ja) * 1987-12-25 1995-05-31 富士電機株式会社 樹脂モールド形受光用半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5160769U (https=) * 1974-11-07 1976-05-13

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11340257A (ja) * 1998-05-21 1999-12-10 Hamamatsu Photonics Kk 透明樹脂封止光半導体装置

Also Published As

Publication number Publication date
JPS62104057A (ja) 1987-05-14

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term