JPS62104057A - 透明樹脂封止半導体装置 - Google Patents

透明樹脂封止半導体装置

Info

Publication number
JPS62104057A
JPS62104057A JP60243361A JP24336185A JPS62104057A JP S62104057 A JPS62104057 A JP S62104057A JP 60243361 A JP60243361 A JP 60243361A JP 24336185 A JP24336185 A JP 24336185A JP S62104057 A JPS62104057 A JP S62104057A
Authority
JP
Japan
Prior art keywords
light
transparent resin
semiconductor device
except
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60243361A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0410741B2 (https=
Inventor
Hiromichi Sawatani
沢谷　博道
Toshio Ishigami
石上　俊雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP60243361A priority Critical patent/JPS62104057A/ja
Publication of JPS62104057A publication Critical patent/JPS62104057A/ja
Publication of JPH0410741B2 publication Critical patent/JPH0410741B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
JP60243361A 1985-10-30 1985-10-30 透明樹脂封止半導体装置 Granted JPS62104057A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60243361A JPS62104057A (ja) 1985-10-30 1985-10-30 透明樹脂封止半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60243361A JPS62104057A (ja) 1985-10-30 1985-10-30 透明樹脂封止半導体装置

Publications (2)

Publication Number Publication Date
JPS62104057A true JPS62104057A (ja) 1987-05-14
JPH0410741B2 JPH0410741B2 (https=) 1992-02-26

Family

ID=17102694

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60243361A Granted JPS62104057A (ja) 1985-10-30 1985-10-30 透明樹脂封止半導体装置

Country Status (1)

Country Link
JP (1) JPS62104057A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01171252A (ja) * 1987-12-25 1989-07-06 Fuji Electric Co Ltd 樹脂モールド形受光用半導体装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3958864B2 (ja) * 1998-05-21 2007-08-15 浜松ホトニクス株式会社 透明樹脂封止光半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5160769U (https=) * 1974-11-07 1976-05-13

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5160769U (https=) * 1974-11-07 1976-05-13

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01171252A (ja) * 1987-12-25 1989-07-06 Fuji Electric Co Ltd 樹脂モールド形受光用半導体装置

Also Published As

Publication number Publication date
JPH0410741B2 (https=) 1992-02-26

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term