JPH0410699Y2 - - Google Patents

Info

Publication number
JPH0410699Y2
JPH0410699Y2 JP1982007298U JP729882U JPH0410699Y2 JP H0410699 Y2 JPH0410699 Y2 JP H0410699Y2 JP 1982007298 U JP1982007298 U JP 1982007298U JP 729882 U JP729882 U JP 729882U JP H0410699 Y2 JPH0410699 Y2 JP H0410699Y2
Authority
JP
Japan
Prior art keywords
plating film
resin
lead frame
metal plate
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982007298U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58111958U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1982007298U priority Critical patent/JPS58111958U/ja
Publication of JPS58111958U publication Critical patent/JPS58111958U/ja
Application granted granted Critical
Publication of JPH0410699Y2 publication Critical patent/JPH0410699Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1982007298U 1982-01-21 1982-01-21 半導体装置のリ−ドフレ−ム Granted JPS58111958U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982007298U JPS58111958U (ja) 1982-01-21 1982-01-21 半導体装置のリ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982007298U JPS58111958U (ja) 1982-01-21 1982-01-21 半導体装置のリ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS58111958U JPS58111958U (ja) 1983-07-30
JPH0410699Y2 true JPH0410699Y2 (enExample) 1992-03-17

Family

ID=30020054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982007298U Granted JPS58111958U (ja) 1982-01-21 1982-01-21 半導体装置のリ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS58111958U (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4316019B2 (ja) * 1996-10-01 2009-08-19 株式会社東芝 半導体装置及び半導体装置製造方法
JP4815708B2 (ja) * 1999-01-05 2011-11-16 日亜化学工業株式会社 発光ダイオードを用いた表示装置
JP3685057B2 (ja) * 1999-12-08 2005-08-17 日亜化学工業株式会社 Ｌｅｄランプ及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5816339B2 (ja) * 1975-04-04 1983-03-30 日本電気株式会社 ハンドウタイソウチ
JPS574183A (en) * 1980-06-10 1982-01-09 Toshiba Corp Metallic thin strip for installing semiconductor light-emitting element

Also Published As

Publication number Publication date
JPS58111958U (ja) 1983-07-30

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