JPH0395634U - - Google Patents
Info
- Publication number
- JPH0395634U JPH0395634U JP93990U JP93990U JPH0395634U JP H0395634 U JPH0395634 U JP H0395634U JP 93990 U JP93990 U JP 93990U JP 93990 U JP93990 U JP 93990U JP H0395634 U JPH0395634 U JP H0395634U
- Authority
- JP
- Japan
- Prior art keywords
- splash guard
- semiconductor wafer
- wafer processing
- processing apparatus
- rinsing liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 235000012431 wafers Nutrition 0.000 claims 8
- 239000007788 liquid Substances 0.000 claims 3
- 238000000034 method Methods 0.000 claims 1
- 239000012487 rinsing solution Substances 0.000 claims 1
- 239000000243 solution Substances 0.000 claims 1
- 238000001039 wet etching Methods 0.000 description 7
- 238000005530 etching Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Weting (AREA)
Description
第１図は本考案の実施例を示すウエツトエツチ
ング装置のスプラツシユガードが開いた状態（エ
ツチング時）を示す断面図、第２図はそのウエツ
トエツチング装置のスプラツシユガードが開いた
状態を示す平面図、第３図はそのウエツトエツチ
ング装置のスプラツシユガードが開いた状態を示
す斜視図、第４図は本考案の実施例を示すウエツ
トエツチング装置のスプラツシユガードが閉じた
状態（水のスプレイ時）を示す断面図、第５図は
そのウエツトエツチング装置のスプラツシユガー
ドが閉じた状態を示す平面図、第６図はそのウエ
ツトエツチング装置のスプラツシユガードが閉じ
た状態を示す斜視図、第７図は従来のウエツトエ
ツチング装置の断面図、第８図及び第９図は本考
案の他の実施例を示すスプラツシユガードを有す
る現像機の構成図である。
１０……ヘツド、１１，２１……エツチング用
ノズル、１２，２２……リンス用ノズル、１３，
２３……半導体ウエハ、１４，２４……スプラツ
シユガード、１４ａ……ハネ、１５……エツチヤ
ント受け、１６，２６……第２の排液管、１７，
２７……第１の排液管、１８……モータ、２５…
…現像液受け。
Fig. 1 is a sectional view showing the wet etching device according to an embodiment of the present invention with the splash guard open (during etching), and Fig. 2 shows the wet etching device with the splash guard open. 3 is a perspective view showing the wet etching device with the splash guard open, and FIG. 4 shows the wet etching device according to an embodiment of the present invention with the splash guard closed ( Fig. 5 is a plan view showing the wet etching device with the splash guard closed, and Fig. 6 shows the wet etching device with the splash guard closed. 7 is a sectional view of a conventional wet etching apparatus, and FIGS. 8 and 9 are structural diagrams of a developing machine having a splash guard showing other embodiments of the present invention. 10... Head, 11, 21... Etching nozzle, 12, 22... Rinsing nozzle, 13,
23... Semiconductor wafer, 14, 24... Splash guard, 14a... Splash, 15... Etchant receiver, 16, 26... Second drain pipe, 17,
27...first drain pipe, 18...motor, 25...
...Developer receiver.
Claims (1)
体ウエハの処理を行う半導体ウエハ処理装置にお
いて、 (a) 前記半導体ウエハの周辺部に配置される
スプラツシユガードと、 (b) 該スプラツシユガードが開いた状態で前
記エツチヤントを第１の排液管に導く手段と、 (c) 前記スプラツシユガードが閉じた状態で
前記リンス液を第２の排液管に導く手段とを具備
することを特徴とする半導体ウエハ処理装置。 (2) 現像液とリンス液とを供給し、半導体ウエ
ハの処理を行う半導体ウエハ処理装置において、 (a) 前記半導体ウエハの周辺部に配置される
スプラツシユガードと、 (b) 該スプラツシユガードが開いた状態で前
記現像液を第１の排液管に導く手段と、 (c) 前記スプラツシユガードが閉じた状態で
前記リンス液を第２の排液管に導く手段とを具備
することを特徴とする半導体ウエハ処理装置。[Claims for Utility Model Registration] (1) A semiconductor wafer processing apparatus for processing semiconductor wafers by supplying an etchant and a rinsing liquid, comprising: (a) a splash guard disposed around the semiconductor wafer; (b) means for directing said etchant into a first drain when said splash guard is open; and (c) means for directing said rinsing liquid to a second drain when said splash guard is closed. A semiconductor wafer processing apparatus comprising: means. (2) A semiconductor wafer processing apparatus that processes semiconductor wafers by supplying a developing solution and a rinsing solution, which includes: (a) a splash guard disposed around the semiconductor wafer; and (b) the splash guard. and (c) means for guiding the rinsing liquid to a second drain pipe when the splash guard is closed. A semiconductor wafer processing device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP93990U JPH0395634U (en) | 1990-01-11 | 1990-01-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP93990U JPH0395634U (en) | 1990-01-11 | 1990-01-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0395634U true JPH0395634U (en) | 1991-09-30 |
Family
ID=31504873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP93990U Pending JPH0395634U (en) | 1990-01-11 | 1990-01-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0395634U (en) |
-
1990
- 1990-01-11 JP JP93990U patent/JPH0395634U/ja active Pending
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