JPS62113965U - - Google Patents

Info

Publication number
JPS62113965U
JPS62113965U JP1986000457U JP45786U JPS62113965U JP S62113965 U JPS62113965 U JP S62113965U JP 1986000457 U JP1986000457 U JP 1986000457U JP 45786 U JP45786 U JP 45786U JP S62113965 U JPS62113965 U JP S62113965U
Authority
JP
Japan
Prior art keywords
surface plate
wafer
processing surface
water washing
washing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986000457U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986000457U priority Critical patent/JPS62113965U/ja
Publication of JPS62113965U publication Critical patent/JPS62113965U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の半導体ウエーハの鏡面加工装置
の平面図、第２図は同じく従来の加工側を示す横
断面図、第３図は本考案の半導体ウエーハの鏡面
加工装置の一実施例の平面図、第４図は第３図の
Ｐ―Ｐ矢視図、第５図は同じく一実施例のウエー
ハ固定用治具の移送軌跡を示す移送軌跡図である
。 １：ウエーハ固定用治具、１ａ：半導体ウエー
ハ、２：加工用定盤、３：加工液供給口、４：防
液堤、５：水洗装置、５ａ：治具洗浄固定部、５
ｂ：治具洗浄シヤワー噴出部、６：移送間シヤワ
ー噴出部（移送間水洗装置）、７：防液堤。 FIG. 1 is a plan view of a conventional semiconductor wafer mirror finishing apparatus, FIG. 2 is a cross-sectional view showing the conventional processing side, and FIG. 3 is a plan view of an embodiment of the semiconductor wafer mirror finishing apparatus of the present invention. 4 is a view taken along the line P--P in FIG. 3, and FIG. 5 is a transfer locus diagram showing the transfer locus of the wafer fixing jig of one embodiment. 1: Wafer fixing jig, 1a: Semiconductor wafer, 2: Processing surface plate, 3: Processing liquid supply port, 4: Liquid barrier, 5: Water washing device, 5a: Jig washing fixing part, 5
b: Jig cleaning shower spout section, 6: Shower spout section during transfer (washing device during transfer), 7: Liquid barrier.

Claims (1)

【実用新案登録請求の範囲】 (1) 所定の研磨位置に設けられ、かつウエーハ
固定用治具に固定された半導体ウエーハを加圧研
磨する加工用定盤と、この加工用定盤から離れた
所定の水洗位置に設けられ、かつ研磨された前記
ウエーハを水洗浄する水洗装置とを備えた半導体
ウエーハの鏡面加工装置において、前記加工用定
盤で研磨され、かつ前記ウエーハ固定用治具な固
定されたウエーハを前記加工用定盤から前記水洗
装置に自動的に移送するようにすると共に、前記
加工用定盤と前記水洗装置との間に、前記移送さ
れるウエーハを水洗浄する移送間水洗装置を設け
たことを特徴とする半導体ウエーハの鏡面加工装
置。 (2) 前記移送間水洗装置が、前記加工用定盤と
前記水洗装置との間に設けられた移送間シヤワー
噴出部で形成されたものである実用新案登録請求
の範囲第１項記載の半導体ウエーハの鏡面加工装
置。[Scope of Claim for Utility Model Registration] (1) A processing surface plate for pressurizing and polishing a semiconductor wafer that is installed at a predetermined polishing position and fixed to a wafer fixing jig, and a surface plate that is separated from this processing surface plate. A semiconductor wafer mirror polishing apparatus, which is provided at a predetermined water washing position and includes a water washing device for washing the polished wafer with water, wherein the wafer is polished on the processing surface plate and is fixed with a jig for fixing the wafer. The processed wafers are automatically transferred from the processing surface plate to the water washing device, and between the processing surface plate and the water washing device, an inter-transfer water washing is provided to wash the transferred wafers with water. 1. A semiconductor wafer mirror polishing device, characterized in that the device is provided with the device. (2) The semiconductor according to claim 1, wherein the inter-transfer washing device is formed by an inter-transfer shower jetting section provided between the processing surface plate and the washing device. Wafer mirror finishing equipment.
JP1986000457U 1986-01-07 1986-01-07 Pending JPS62113965U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986000457U JPS62113965U (en) 1986-01-07 1986-01-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986000457U JPS62113965U (en) 1986-01-07 1986-01-07

Publications (1)

Publication Number Publication Date
JPS62113965U true JPS62113965U (en) 1987-07-20

Family

ID=30777447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986000457U Pending JPS62113965U (en) 1986-01-07 1986-01-07

Country Status (1)

Country Link
JP (1) JPS62113965U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521406A (en) * 1991-07-12 1993-01-29 Fujikoshi Kikai Kogyo Kk Tandem full automatic wafer polishing device and polishing method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5932350B2 (en) * 1980-12-17 1984-08-08 神鋼電機株式会社 Brake control device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5932350B2 (en) * 1980-12-17 1984-08-08 神鋼電機株式会社 Brake control device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521406A (en) * 1991-07-12 1993-01-29 Fujikoshi Kikai Kogyo Kk Tandem full automatic wafer polishing device and polishing method

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