JPH0379865B2 - - Google Patents

Info

Publication number
JPH0379865B2
JPH0379865B2 JP63168940A JP16894088A JPH0379865B2 JP H0379865 B2 JPH0379865 B2 JP H0379865B2 JP 63168940 A JP63168940 A JP 63168940A JP 16894088 A JP16894088 A JP 16894088A JP H0379865 B2 JPH0379865 B2 JP H0379865B2
Authority
JP
Japan
Prior art keywords
package case
semiconductor device
recess
powder glass
ridge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63168940A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0220045A (ja
Inventor
Tadao Hirakawa
Yukio Tamura
Hiromitsu Sasanami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goto Seisakusho KK
Original Assignee
Goto Seisakusho KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goto Seisakusho KK filed Critical Goto Seisakusho KK
Priority to JP63168940A priority Critical patent/JPH0220045A/ja
Publication of JPH0220045A publication Critical patent/JPH0220045A/ja
Priority to US07/769,770 priority patent/US5151118A/en
Publication of JPH0379865B2 publication Critical patent/JPH0379865B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP63168940A 1988-07-08 1988-07-08 半導体装置及びそのパッケージ方法 Granted JPH0220045A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP63168940A JPH0220045A (ja) 1988-07-08 1988-07-08 半導体装置及びそのパッケージ方法
US07/769,770 US5151118A (en) 1988-07-08 1991-10-04 Method for producing a package-type semiconductor assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63168940A JPH0220045A (ja) 1988-07-08 1988-07-08 半導体装置及びそのパッケージ方法

Publications (2)

Publication Number Publication Date
JPH0220045A JPH0220045A (ja) 1990-01-23
JPH0379865B2 true JPH0379865B2 (enrdf_load_stackoverflow) 1991-12-20

Family

ID=15877363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63168940A Granted JPH0220045A (ja) 1988-07-08 1988-07-08 半導体装置及びそのパッケージ方法

Country Status (1)

Country Link
JP (1) JPH0220045A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0427617U (enrdf_load_stackoverflow) * 1990-06-27 1992-03-05
US7365442B2 (en) * 2003-03-31 2008-04-29 Osram Opto Semiconductors Gmbh Encapsulation of thin-film electronic devices

Also Published As

Publication number Publication date
JPH0220045A (ja) 1990-01-23

Similar Documents

Publication Publication Date Title
JP2647194B2 (ja) 半導体用パッケージの封止方法
US4025716A (en) Dual in-line package with window frame
JPS598358Y2 (ja) 半導体素子パツケ−ジ
EP0090566B1 (en) Semiconductor device package
JPS5992556A (ja) 半導体装置
JPH0379865B2 (enrdf_load_stackoverflow)
US6194779B1 (en) Plastic mold type semiconductor device
JPH02125454A (ja) 樹脂封止型半導体装置
JPH07307350A (ja) 半導体リードフレ−ムおよびパッケージ
JPS5824446Y2 (ja) 半導体装置
US4151638A (en) Hermetic glass encapsulation for semiconductor die and method
JPH0741158Y2 (ja) 半導体装置
JPH0459777B2 (enrdf_load_stackoverflow)
KR100214857B1 (ko) 멀티 칩 패키지
JPH0513608A (ja) 半導体装置
JPH0338053A (ja) 半導体装置及びその製造方法
JP2522165B2 (ja) 半導体装置
JPH03114247A (ja) パッケージ型半導体装置
JPH03108361A (ja) 半導体集積回路装置
JPH043501Y2 (enrdf_load_stackoverflow)
JPH0476504B2 (enrdf_load_stackoverflow)
JPS6358859A (ja) 半導体装置
JPH039334Y2 (enrdf_load_stackoverflow)
JPH0744024Y2 (ja) 半導体セラミック・パッケージ用窓枠状ろう材付き封着板
KR19980079223A (ko) 반도체 장치 및 그의 제조 방법