JPH0379370B2 - - Google Patents

Info

Publication number
JPH0379370B2
JPH0379370B2 JP57177613A JP17761382A JPH0379370B2 JP H0379370 B2 JPH0379370 B2 JP H0379370B2 JP 57177613 A JP57177613 A JP 57177613A JP 17761382 A JP17761382 A JP 17761382A JP H0379370 B2 JPH0379370 B2 JP H0379370B2
Authority
JP
Japan
Prior art keywords
resin
epoxy resin
epoxy
phenol
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57177613A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5967660A (ja
Inventor
Hirotoshi Iketani
Micha Azuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP57177613A priority Critical patent/JPS5967660A/ja
Publication of JPS5967660A publication Critical patent/JPS5967660A/ja
Publication of JPH0379370B2 publication Critical patent/JPH0379370B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP57177613A 1982-10-12 1982-10-12 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置 Granted JPS5967660A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57177613A JPS5967660A (ja) 1982-10-12 1982-10-12 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57177613A JPS5967660A (ja) 1982-10-12 1982-10-12 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP7180550A Division JP2654376B2 (ja) 1995-06-26 1995-06-26 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS5967660A JPS5967660A (ja) 1984-04-17
JPH0379370B2 true JPH0379370B2 (en, 2012) 1991-12-18

Family

ID=16034063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57177613A Granted JPS5967660A (ja) 1982-10-12 1982-10-12 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS5967660A (en, 2012)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59105019A (ja) * 1982-12-07 1984-06-18 Toshiba Chem Corp 封止用樹脂組成物
JPS59105018A (ja) * 1982-12-07 1984-06-18 Toshiba Chem Corp 封止用樹脂組成物
JPH0791523B2 (ja) * 1987-12-25 1995-10-04 エヌオーケー株式会社 加硫接着剤配合物
JPH04300914A (ja) * 1991-03-29 1992-10-23 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及び半導体装置
JP2654376B2 (ja) * 1995-06-26 1997-09-17 株式会社東芝 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置
JP4327756B2 (ja) 2005-03-22 2009-09-09 トヨタ自動車株式会社 油圧回路装置及びそれを用いたハイブリッド駆動装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5328197B2 (en, 2012) * 1974-03-08 1978-08-12
JPS51132267A (en) * 1975-04-18 1976-11-17 Hitachi Ltd An epoxy resin composition for sealing semi-conductor elements
JPS52132100A (en) * 1976-04-28 1977-11-05 Hitachi Ltd Epoxy resin molding materials for sealing semiconductors
JPS5458795A (en) * 1977-10-19 1979-05-11 Hitachi Ltd Preparation of curing agent for epoxy resin
JPS6056172B2 (ja) * 1978-02-17 1985-12-09 株式会社日立製作所 半導体装置封止用エポキシ樹脂組成物
ES491385A0 (es) * 1979-08-08 1981-05-16 Un metodo para preparar un silano
JPS5659841A (en) * 1979-10-19 1981-05-23 Hitachi Ltd Epoxy resin composition
JPS5684717A (en) * 1979-12-14 1981-07-10 Hitachi Ltd Epoxy resin molding material
JPS572329A (en) * 1980-06-05 1982-01-07 Toshiba Corp Epoxy resin type composition and semiconductor device of resin sealing type
JPS57153022A (en) * 1981-03-18 1982-09-21 Toshiba Corp Resin-sealed semiconductor device
JPS57153454A (en) * 1981-03-18 1982-09-22 Toshiba Corp Resin molded type semiconductor device

Also Published As

Publication number Publication date
JPS5967660A (ja) 1984-04-17

Similar Documents

Publication Publication Date Title
JPH0445982B2 (en, 2012)
KR20080027966A (ko) 에폭시 수지 조성물 및 반도체장치
JPS6153321A (ja) 半導体封止用エポキシ樹脂組成物及びそれを用いた樹脂封止型半導体装置
JPH0379370B2 (en, 2012)
JP2004067717A (ja) エポキシ樹脂組成物及び半導体装置
JPS6219066B2 (en, 2012)
JPH0520447B2 (en, 2012)
JPS6181426A (ja) 半導体封止用エポキシ樹脂組成物
JP2626377B2 (ja) エポキシ樹脂組成物及び半導体装置
JPS583382B2 (ja) 樹脂封止型半導体装置
JPH07107091B2 (ja) 半導体封止用エポキシ樹脂組成物
JP2654376B2 (ja) 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置
JPS6219070B2 (en, 2012)
JPS61221220A (ja) 樹脂封止型半導体装置
JPS61151234A (ja) 半導体封止用エポキシ樹脂組成物
JP2002053732A (ja) エポキシ樹脂組成物及び半導体装置
JPS6054458A (ja) 樹脂封止型半導体装置
JP2576726B2 (ja) エポキシ樹脂組成物
JPS58119655A (ja) 樹脂封止型半導体装置
JP2004339292A (ja) 封止用樹脂組成物および半導体装置
JPH0549696B2 (en, 2012)
JP2991847B2 (ja) 半導体封止用樹脂組成物
KR930008189B1 (ko) 반도체 봉지용 에폭시 수지 조성물
JPH0319707B2 (en, 2012)
JPS6219069B2 (en, 2012)