JPH0378779B2 - - Google Patents

Info

Publication number
JPH0378779B2
JPH0378779B2 JP60033763A JP3376385A JPH0378779B2 JP H0378779 B2 JPH0378779 B2 JP H0378779B2 JP 60033763 A JP60033763 A JP 60033763A JP 3376385 A JP3376385 A JP 3376385A JP H0378779 B2 JPH0378779 B2 JP H0378779B2
Authority
JP
Japan
Prior art keywords
resin
support plate
pair
main surface
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60033763A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61193460A (ja
Inventor
Tetsuo Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP60033763A priority Critical patent/JPS61193460A/ja
Publication of JPS61193460A publication Critical patent/JPS61193460A/ja
Publication of JPH0378779B2 publication Critical patent/JPH0378779B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/016—
    • H10W74/10—
    • H10W90/756—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP60033763A 1985-02-22 1985-02-22 樹脂封止型半導体装置の製造方法 Granted JPS61193460A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60033763A JPS61193460A (ja) 1985-02-22 1985-02-22 樹脂封止型半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60033763A JPS61193460A (ja) 1985-02-22 1985-02-22 樹脂封止型半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS61193460A JPS61193460A (ja) 1986-08-27
JPH0378779B2 true JPH0378779B2 (enExample) 1991-12-16

Family

ID=12395470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60033763A Granted JPS61193460A (ja) 1985-02-22 1985-02-22 樹脂封止型半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS61193460A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5018003A (en) * 1988-10-20 1991-05-21 Mitsubishi Denki Kabushiki Kaisha Lead frame and semiconductor device
US5728600A (en) * 1994-11-15 1998-03-17 Vlt Corporation Circuit encapsulation process
US5945130A (en) 1994-11-15 1999-08-31 Vlt Corporation Apparatus for circuit encapsulation

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5980951A (ja) * 1983-08-24 1984-05-10 Hitachi Ltd レジンモ−ルド電子部品

Also Published As

Publication number Publication date
JPS61193460A (ja) 1986-08-27

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