JPH0377277B2 - - Google Patents
Info
- Publication number
- JPH0377277B2 JPH0377277B2 JP16362087A JP16362087A JPH0377277B2 JP H0377277 B2 JPH0377277 B2 JP H0377277B2 JP 16362087 A JP16362087 A JP 16362087A JP 16362087 A JP16362087 A JP 16362087A JP H0377277 B2 JPH0377277 B2 JP H0377277B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- etching
- brush
- conveyor
- support frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 85
- 238000005530 etching Methods 0.000 claims description 57
- 230000001680 brushing effect Effects 0.000 claims description 17
- 239000007788 liquid Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 description 18
- 239000000243 solution Substances 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 239000007921 spray Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
Landscapes
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16362087A JPS648284A (en) | 1987-06-30 | 1987-06-30 | Brush-etching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16362087A JPS648284A (en) | 1987-06-30 | 1987-06-30 | Brush-etching device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS648284A JPS648284A (en) | 1989-01-12 |
| JPH0377277B2 true JPH0377277B2 (enExample) | 1991-12-10 |
Family
ID=15777391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16362087A Granted JPS648284A (en) | 1987-06-30 | 1987-06-30 | Brush-etching device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS648284A (enExample) |
-
1987
- 1987-06-30 JP JP16362087A patent/JPS648284A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS648284A (en) | 1989-01-12 |
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