JPH0376339B2 - - Google Patents

Info

Publication number
JPH0376339B2
JPH0376339B2 JP59025200A JP2520084A JPH0376339B2 JP H0376339 B2 JPH0376339 B2 JP H0376339B2 JP 59025200 A JP59025200 A JP 59025200A JP 2520084 A JP2520084 A JP 2520084A JP H0376339 B2 JPH0376339 B2 JP H0376339B2
Authority
JP
Japan
Prior art keywords
resin
thermoplastic
parts
weight
solid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59025200A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60170658A (ja
Inventor
Teru Okunoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Original Assignee
Toshiba Chemical Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd filed Critical Toshiba Chemical Products Co Ltd
Priority to JP2520084A priority Critical patent/JPS60170658A/ja
Publication of JPS60170658A publication Critical patent/JPS60170658A/ja
Publication of JPH0376339B2 publication Critical patent/JPH0376339B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP2520084A 1984-02-15 1984-02-15 導電性ペ−スト Granted JPS60170658A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2520084A JPS60170658A (ja) 1984-02-15 1984-02-15 導電性ペ−スト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2520084A JPS60170658A (ja) 1984-02-15 1984-02-15 導電性ペ−スト

Publications (2)

Publication Number Publication Date
JPS60170658A JPS60170658A (ja) 1985-09-04
JPH0376339B2 true JPH0376339B2 (enrdf_load_stackoverflow) 1991-12-05

Family

ID=12159305

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2520084A Granted JPS60170658A (ja) 1984-02-15 1984-02-15 導電性ペ−スト

Country Status (1)

Country Link
JP (1) JPS60170658A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62164757A (ja) * 1986-01-14 1987-07-21 Shinto Paint Co Ltd 導電性回路を形成する方法
JPS63161015A (ja) * 1986-12-25 1988-07-04 Sumitomo Bakelite Co Ltd 導電性樹脂ペ−スト

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54149758A (en) * 1978-05-16 1979-11-24 Asahi Chem Ind Co Ltd Heat-resistant resin paste composition

Also Published As

Publication number Publication date
JPS60170658A (ja) 1985-09-04

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees