JPH0376339B2 - - Google Patents
Info
- Publication number
- JPH0376339B2 JPH0376339B2 JP59025200A JP2520084A JPH0376339B2 JP H0376339 B2 JPH0376339 B2 JP H0376339B2 JP 59025200 A JP59025200 A JP 59025200A JP 2520084 A JP2520084 A JP 2520084A JP H0376339 B2 JPH0376339 B2 JP H0376339B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- thermoplastic
- parts
- weight
- solid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003822 epoxy resin Substances 0.000 claims description 15
- 229920000647 polyepoxide Polymers 0.000 claims description 15
- 229920001169 thermoplastic Polymers 0.000 claims description 12
- 239000004416 thermosoftening plastic Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 239000007787 solid Substances 0.000 claims description 10
- 239000011230 binding agent Substances 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 7
- 229920000178 Acrylic resin Polymers 0.000 claims description 5
- 239000004925 Acrylic resin Substances 0.000 claims description 5
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229920005992 thermoplastic resin Polymers 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- UALAKBZSBJIXBP-UHFFFAOYSA-N 1-phenylethane-1,1,2,2-tetrol Chemical compound OC(O)C(O)(O)C1=CC=CC=C1 UALAKBZSBJIXBP-UHFFFAOYSA-N 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Substances FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 1
- -1 boron trifluoride amine Chemical class 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 150000007974 melamines Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
Landscapes
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
［発明の技術分野］
本発明は、各種電子・電気部品の接着もしくは
導電性を必要とする部分の接着等に用いる導電性
ペーストに関する。
［発明の技術的背景とその問題点］
従来公知の動電性ペーストは主に導電性粉体と
エポキシ樹脂等の結合剤とから構成されている。
このようなエポキシ樹脂を結合剤とした導電性ペ
ーストは、エポキシ樹脂の硬化剤としてポリアミ
ド樹脂、アミン類、イミダゾール類、メラミン
類、フエノール樹脂類、三フツ化ホウ素アミン錯
体等の多種類のものが使用されている。
しかしながら、これらのうち一液性の導電性ペ
ーストは適当な溶剤によつてペースト粘度が調整
されており、ペーストを被着体に塗布した後ハン
ドリングが可能になるのに長時間を要するのが通
常である。ハンドリング可能時間を短縮するため
に固形エポシキ樹脂と低沸点の溶剤とを使用した
ものがあるが、ペーストの可撓性が損われてしま
うばかりか被着体とのぬれ性に劣つて密着性が悪
くなり問題を生ずるという欠点があつた。
［発展の目的］
本発明の目的は、前記の欠点を解消するために
なされたもので、塗布後ハンドリングが短時間で
可能になり、かつ密着性、可撓性および導電性に
優れた動導性ペーストを提供しようとするもので
ある。
［発明の概要］
本発明は、上記の目的を達成すべく鋭意研究を
重ねた結果、後述する組成の動導性ペーストが上
記目的を達成できることを見出したものである。
即ち、本発明は、
(A) (a)常温で固形のエポキシ樹脂および(b)軟化点
が80℃以上かつ常温で固形の熱可塑性アクリル
系樹脂、熱可塑性酢酸ビニル系樹脂または熱可
塑性ホルマール系樹脂からなる結合剤と、
(B) 導電性粉体と
を主成分とし、(a)常温で固形のエポキシ樹脂
100重量部に対して(b)の熱可塑性アクリル系樹
脂、熱可塑性酢酸ビニル系樹脂および熱可塑性
ホルマール系樹脂を20〜200重量部配合するこ
とを特徴とする導電性ペーストである。
本発明に用いる(A)(a)常温で固形のエポキシ樹脂
としては、１分子中に２個以上のエポキシ基を有
するエポキシ樹脂および各種硬化剤が挙げられ
る。具体的にはビスフエノールＡ型、ハロゲン化
ビスフエノールＡ型、レゾルシン型、ビスフエノ
ールＦ型、テトラヒドロキシフエニルエタン型、
ノボラツクス型があり、これらは単独又は２種類
以上の混合物として用いられる。またこれらの硬
化剤としてアミド系硬化剤であるジシアンジアミ
ド、尿素系硬化剤である３−（３，４−ジクロロ
フエニル）−１，１−ジメル尿素、各種固形のフ
エノール樹脂、イミダゾール系化合物等が挙げら
れ、これらは単独又は２種以上の混合物として使
用される。
本発明に用いられる(b)軟化点が80℃以上かつ常
温で固形の熱可塑性樹脂としては、アクリル系樹
脂、酢酸ビニル系樹脂、各種ホルマール系樹脂等
が挙げられ、これらは単独又は２種以上の混合物
として用いられる。また(a)エポキシ樹脂と(b)熱可
塑性樹脂との配合割合は、エポキシ樹脂100重量
部に対して熱可塑性樹脂20〜200重量部、好まし
くは50〜100重量部配合することが必要である。
熱可塑性樹脂の配合量が20重量部未満では可撓性
が不充分となり、また200重量部を超えると熱時
の密着性が不足となり好ましくない。このエポキ
シ樹脂と熱可塑性樹脂とは本発明における結合剤
を構成する。
本発明に用いる(B)導電性粉体としては、フレー
ク状、球状あるいはステアリン酸コートされた
銀、銅、ニツケル等が挙げられ、平均粒径が10μ
ｍ以下のものを使用するのが好ましい。そしてこ
れらは１種又は２種以上の混合物として使用され
る。
前述の結合剤と導電性粉体との配合割合は30：
70〜10：90（重量比）の範囲内であることが必要
である。導電性粉体が70重量部未満であると満足
な導電性が得られず、また90重量部を超える場合
は作業性や接着強度が低下して好ましくない。
本発明においては以上の成分のほかに、粘度を
調整し、種々の基板に導電性を形成するためのペ
ーストとして用いる場合に有機溶剤を使用するこ
とができる。
次に本発明に係る導電性ペーストは、前記の各
成分を三本ロールなどにより混練し、所定の場所
にデイスペンサー、刷毛塗り等によつて塗布し５
〜15分経過してハンドリングが可能になつた後
に、120〜160℃に可熱硬化させて使用する。
［発明の実施例］
以下本発明の実施例について説明する。本発明
は本実施例に限定されるものではない。
実施例 １〜３
第１表に示した各成分を三本ロールにより三回
混練して一液性導電性ペーストを製造した。得ら
れた導電性ペーストについて、ハンドリング可能
時間、導電性、密着性、可使時間および引張り剪
断強度を試験し、その結果を第１表に示した。
比較例 １〜２
従来の一液性のエポキシ樹脂導電性ペースト
（比較例１）、および二液性ポリアミド樹脂硬化型
のエポキシ樹脂導電性ペースト（比較例２）につ
いて、実施例と同様にハンドリング可能時間、導
電性、密着性、可使時間および引張り剪断強度を
試験し、その結果を第１表にした。
[Technical Field of the Invention] The present invention relates to a conductive paste used for adhering various electronic/electrical parts or parts requiring conductivity. [Technical background of the invention and its problems] Conventionally known electrokinetic pastes are mainly composed of conductive powder and a binder such as an epoxy resin.
Conductive pastes using epoxy resin as a binder include many types of epoxy resin curing agents such as polyamide resins, amines, imidazoles, melamines, phenolic resins, and boron trifluoride amine complexes. It is used. However, the viscosity of the one-component conductive pastes is adjusted using a suitable solvent, and it usually takes a long time to be able to handle the paste after it is applied to the adherend. It is. Some methods use a solid epoxy resin and a low-boiling point solvent to shorten the handling time, but this not only impairs the flexibility of the paste, but also results in poor wettability with the adherend, resulting in poor adhesion. The drawback was that it deteriorated and caused problems. [Purpose of Development] The purpose of the present invention was to solve the above-mentioned drawbacks. It is intended to provide a sex paste. [Summary of the Invention] In the present invention, as a result of intensive research to achieve the above object, it was discovered that a dynamic conductive paste having the composition described below can achieve the above object. That is, the present invention provides (A) (a) an epoxy resin that is solid at room temperature; and (b) a thermoplastic acrylic resin, thermoplastic vinyl acetate resin, or thermoplastic formal resin that has a softening point of 80°C or higher and is solid at room temperature. The main components are a binder made of resin, (B) conductive powder, and (a) an epoxy resin that is solid at room temperature.
This conductive paste is characterized by blending 20 to 200 parts by weight of (b) thermoplastic acrylic resin, thermoplastic vinyl acetate resin, and thermoplastic formal resin to 100 parts by weight. Examples of the epoxy resin (A) (a) that is solid at room temperature used in the present invention include epoxy resins having two or more epoxy groups in one molecule and various curing agents. Specifically, bisphenol type A, halogenated bisphenol type A, resorcinol type, bisphenol type F, tetrahydroxyphenylethane type,
There are novolax types, and these are used alone or as a mixture of two or more types. In addition, these curing agents include dicyandiamide which is an amide curing agent, 3-(3,4-dichlorophenyl)-1,1-dimelurea which is a urea curing agent, various solid phenol resins, imidazole compounds, etc. These can be used alone or as a mixture of two or more. (b) Thermoplastic resins that have a softening point of 80°C or higher and are solid at room temperature include acrylic resins, vinyl acetate resins, various formal resins, etc., which may be used alone or in combination. It is used as a mixture of Furthermore, the blending ratio of (a) epoxy resin and (b) thermoplastic resin is 20 to 200 parts by weight, preferably 50 to 100 parts by weight of thermoplastic resin per 100 parts by weight of epoxy resin. .
If the amount of thermoplastic resin blended is less than 20 parts by weight, flexibility will be insufficient, and if it exceeds 200 parts by weight, adhesion under heat will be insufficient, which is undesirable. This epoxy resin and thermoplastic resin constitute the binder in the present invention. The conductive powder (B) used in the present invention includes flaky, spherical, or stearic acid-coated silver, copper, nickel, etc., and has an average particle size of 10 μm.
It is preferable to use one having a diameter of m or less. These may be used alone or as a mixture of two or more. The blending ratio of the above-mentioned binder and conductive powder is 30:
It is necessary that the ratio be within the range of 70 to 10:90 (weight ratio). If the amount of conductive powder is less than 70 parts by weight, satisfactory conductivity cannot be obtained, and if it exceeds 90 parts by weight, workability and adhesive strength will decrease, which is undesirable. In the present invention, in addition to the above-mentioned components, an organic solvent can be used to adjust the viscosity and when used as a paste for forming conductivity on various substrates. Next, the conductive paste according to the present invention is prepared by kneading the above-mentioned components using a triple roll or the like, and applying the paste to a predetermined location using a dispenser, a brush, or the like.
After ~15 minutes have passed and it is possible to handle it, it is heat cured at 120-160°C and used. [Embodiments of the Invention] Examples of the present invention will be described below. The present invention is not limited to this example. Examples 1 to 3 Each component shown in Table 1 was kneaded three times using three rolls to produce a one-component conductive paste. The obtained conductive paste was tested for handling time, conductivity, adhesion, pot life, and tensile shear strength, and the results are shown in Table 1. Comparative Examples 1 to 2 Conventional one-component epoxy resin conductive paste (Comparative Example 1) and two-component polyamide resin curing epoxy resin conductive paste (Comparative Example 2) can be handled in the same manner as in the examples. Time, conductivity, adhesion, pot life and tensile shear strength were tested and the results are shown in Table 1.
【表】
テープを貼りつけ急激に引きはがした時の塗面の
残存碁盤目個数をもつて表わす
［発明の効果］
以上の説明および第１表から明らかなように、
本発明の導電性ペーストは、塗布後ハンドリング
が可能になる時間が短いために作業性がよく、か
つ密着性および熱時の引張り剪断強度に優れ、全
体にバランスのとれた導電性ペーストであり、各
種電子・電気部品の接着、半田づけ前後の接着、
リード線取出し口への接着、導電性を必要とする
部分の接着等に使用することによつて極めて信頼
性の高い製品を得ることができるものである。[Table] Expressed by the number of grid marks remaining on the painted surface when the tape is applied and rapidly removed [Effects of the invention] As is clear from the above explanation and Table 1,
The conductive paste of the present invention has good workability because the time required for handling after application is short, and has excellent adhesion and tensile shear strength when heated, and is a well-balanced conductive paste as a whole. Adhesion of various electronic and electrical parts, adhesion before and after soldering,
By using it for adhesion to lead wire outlets, adhesion of parts that require conductivity, etc., extremely reliable products can be obtained.
Claims (1)
化点が80℃以上かつ常温で固形の熱可塑性アク
リル系樹脂、熱可塑性酢酸ビニル系樹脂または
熱可塑性ホルマール系樹脂からなる結合剤と、 (B) 導電性粉体と を主成分とし、(a)常温で固形のエポキシ樹脂
100重量部に対して(b)の熱可塑性アクリル系樹
脂、熱可塑性酢酸ビニル系樹脂および熱可塑性
ホルマール系樹脂を20〜200重量部配合するこ
とを特徴とする導電性ペースト。 ２ (A)結合剤と(B)導電性粉体との配合割合が、
30：70〜10：90（重量比）の範囲内である特許請
求の範囲第１項記載の導電性ペースト。[Scope of Claims] 1 (A) (a) Epoxy resin that is solid at room temperature, and (b) thermoplastic acrylic resin, thermoplastic vinyl acetate resin, or thermoplastic formal having a softening point of 80°C or higher and solid at room temperature. The main components are a binder made of a resin, (B) conductive powder, and (a) an epoxy resin that is solid at room temperature.
A conductive paste characterized in that 20 to 200 parts by weight of (b) thermoplastic acrylic resin, thermoplastic vinyl acetate resin, and thermoplastic formal resin are blended to 100 parts by weight. 2 The blending ratio of (A) binder and (B) conductive powder is
The conductive paste according to claim 1, which has a weight ratio of 30:70 to 10:90 (weight ratio).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2520084A JPS60170658A (en) | 1984-02-15 | 1984-02-15 | Electrically conductive paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2520084A JPS60170658A (en) | 1984-02-15 | 1984-02-15 | Electrically conductive paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60170658A JPS60170658A (en) | 1985-09-04 |
| JPH0376339B2 true JPH0376339B2 (en) | 1991-12-05 |
Family
ID=12159305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2520084A Granted JPS60170658A (en) | 1984-02-15 | 1984-02-15 | Electrically conductive paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60170658A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62164757A (en) * | 1986-01-14 | 1987-07-21 | Shinto Paint Co Ltd | Solderable, electrically conductive composition |
| JPS63161015A (en) * | 1986-12-25 | 1988-07-04 | Sumitomo Bakelite Co Ltd | Electrically conductive resin paste |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54149758A (en) * | 1978-05-16 | 1979-11-24 | Asahi Chem Ind Co Ltd | Heat-resistant resin paste composition |
-
1984
- 1984-02-15 JP JP2520084A patent/JPS60170658A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54149758A (en) * | 1978-05-16 | 1979-11-24 | Asahi Chem Ind Co Ltd | Heat-resistant resin paste composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60170658A (en) | 1985-09-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |